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    THE EFFECT OF FORCED AIR COOLING ON HEAT SINK THERMAL RATINGS Search Results

    THE EFFECT OF FORCED AIR COOLING ON HEAT SINK THERMAL RATINGS Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    MG800FXF1JMS3 Toshiba Electronic Devices & Storage Corporation N-ch SiC MOSFET Module, 3300 V, 800 A, iXPLV, High-side: SiC SBD、Low-side: SiC MOSFET Visit Toshiba Electronic Devices & Storage Corporation
    TK190U65Z Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 650 V, 15 A, 0.19 Ohm@10V, TOLL Visit Toshiba Electronic Devices & Storage Corporation
    TK7R0E08QM Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 80 V, 64 A, 0.0070 Ohm@10V, TO-220AB Visit Toshiba Electronic Devices & Storage Corporation
    XPJ1R004PB Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 40 V, 160 A, 0.001 Ω@10V, S-TOGL Visit Toshiba Electronic Devices & Storage Corporation
    TK4K1A60F Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 600 V, 2.0 A, 4.1 Ohm@10V, TO-220SIS Visit Toshiba Electronic Devices & Storage Corporation

    THE EFFECT OF FORCED AIR COOLING ON HEAT SINK THERMAL RATINGS Datasheets Context Search

    Catalog Datasheet MFG & Type Document Tags PDF

    The Effect of Forced Air Cooling on Heat Sink Thermal Ratings

    Abstract: No abstract text available
    Text: zpero 1 The Effect of Forced Air Cooling on Heat Sink Thermal Ratings By Paul Bachman, Fellow Engineer & Ronnie Haiduk, Applications Engineer, Crydom, Inc. ABSTRACT A heat sink’s ability to dissipate thermal energy is determined by its thermal impedance, which


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    crouzet 900

    Abstract: No abstract text available
    Text: pero 1 The Effect of Forced Air Cooling on Heat Sink Thermal Ratings By Paul Bachman, Fellow Engineer & Ronnie Haiduk, Applications Engineer, Crydom, Inc. ABSTRACT A heat sink’s ability to dissipate thermal energy is determined by its thermal impedance, which


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    Untitled

    Abstract: No abstract text available
    Text: OPTIMUM DESIGN AND SELECTION OF HEAT SINKS ‘, Seri Lee Aavid Engineering Inc. Laconia, New Hampshire 0 3 2 4 7 Abstract An analytical simulation model has been developed for predicting and optimizing the thermal performance of bidirectional fin heat sinks in a partiaHy confined configuration. Sample calculations are carried out, and parametric


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    D3PAK

    Abstract: tunnel diode application to247 pcb footprint FR4 substrate height and thickness APT9503 APT4016SN "tunnel diode" chip assembly Thermalcote THE 249
    Text: APPLICATION NOTE APT9503 By Kenneth W. Dierberger and Denis R. Grafham INNOVATIVE MOUNTING TECHNIQUES ENHANCE THERMAL PERFORMANCE OF THE SURFACE-MOUNT D3 PAK PACKAGE PRESENTED AT POWERSYSTEMS WORLD INTERNATIONAL CONFERENCE & EXHIBIT SEPTEMBER 12, 1995 Page 1


    Original     		APT9503 B-1330 O-247, D3PAK tunnel diode application to247 pcb footprint FR4 substrate height and thickness APT9503 APT4016SN "tunnel diode" chip assembly Thermalcote THE 249 PDF

    2850KT

    Abstract: 2850MT 1200 RTV 1N5550 1N6515 2850FT RTV-615 scotchcast epoxy potting material diode with piv of 40v
    Text: APPENDIX B Diode Thermal Analysis Controlling junction temperature is key to reliable semiconductor package design. High voltage diodes present unique junction temperature problems which must be addressed. In high voltage diodes, heat is generated primarily by:


    Original     		1N6515 1N5550 2850KT 2850MT 1200 RTV 1N5550 1N6515 2850FT RTV-615 scotchcast epoxy potting material diode with piv of 40v PDF

    CENELEC REPORT R040-001

    Abstract: CECC 30301-808 CECC 30301 805 trichloroethylene B41690 permittivity of iron oxide padding wacker B41691 B41693
    Text: Aluminum Electrolytic Capacitors General technical information Date: November 2008 EPCOS AG 2009. Reproduction, publication and dissemination of this publication, enclosures hereto and the information contained therein without EPCOS' prior express consent is prohibited.


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    Untitled

    Abstract: No abstract text available
    Text: Application Guide Glossary of Terms AC Line: The ac power distribution lines. See Alternating Current. AC Line Filter: A filter placed in the ac line to condition high frequency noise variations. Aging: The operation of a power supply under tightly controlled conditions input voltage, output load, ambient temperature, etc. for a predetermined time. Used in reliability testing


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    Untitled

    Abstract: No abstract text available
    Text: Vishay Semiconductors Assembly Instructions General Soldering Instructions Optoelectronic semiconductor devices can be mounted in any position. Connection wires may be bent provided the bend is not less than 1.5 mm from the bottom of the case. During bending, no forces must


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    JEP140

    Abstract: JESD51-9 pcb board 0.035mm JESD51-10 JEP-140 PCB 1.2mm FR4 1oz cu JESD51-11 JESD51-X jesd51 6 JESD51-7
    Text: Thermal Characterization of Packaged Semiconductor Devices Technical Brief December 2002 TB379.3 Author: Jim Benson Introduction With the continuing industry trends towards smaller, faster, and higher power devices, thermal management is becoming increasingly important. After all, higher device


    Original     		TB379 JEP140 JESD51-9 pcb board 0.035mm JESD51-10 JEP-140 PCB 1.2mm FR4 1oz cu JESD51-11 JESD51-X jesd51 6 JESD51-7 PDF

    JESD51-9

    Abstract: JEP140 JEP-140 JESD51-10 JEDEC JESD51-8 conductivity meter circuit Reliability Test Methods for Packaged Devices thermal resistance standards JESD51-1 JESD51-3
    Text: Thermal Characterization of Packaged Semiconductor Devices Technical Brief December 2002 TB379.3 Author: Jim Benson Introduction With the continuing industry trends towards smaller, faster, and higher power devices, thermal management is becoming increasingly important. After all, higher device


    Original     		TB379 JESD51-9 JEP140 JEP-140 JESD51-10 JEDEC JESD51-8 conductivity meter circuit Reliability Test Methods for Packaged Devices thermal resistance standards JESD51-1 JESD51-3 PDF

    TS68040

    Abstract: microprocessor 5962-9314301MXA 5962-9314301MYC ATC 1184 296Bytes IF-FC2 CAPACITOR SMD 107C ts68030 TS68882
    Text: TS68040 Third-Generation 32-bit Microprocessor Datasheet Features • • • • • • • • • • • • • • 26-42 MIPS Integer Performance 3.5-5.6 MFLOPS Floating-Point-Performance IEEE 754-Compatible FPU Independent Instruction and Data MMUs


    Original     		TS68040 32-bit 754-Compatible 32-bit, TS68000 0851B TS68040 microprocessor 5962-9314301MXA 5962-9314301MYC ATC 1184 296Bytes IF-FC2 CAPACITOR SMD 107C ts68030 TS68882 PDF

    JESD51-1

    Abstract: "thermal via" QFN "100 pin" PACKAGE thermal resistance QFN PACKAGE thermal resistance JESD51-3 SLMA002 AN569 JESD51-2
    Text: Application Note: HFAN-08.1 Rev 0; 11/01 Thermal Considerations of QFN and Other Exposed-Paddle Packages Note: This application note is a summary and compilation of information based on the references mentioned at the end of this document. This information is neither tested


    Original     		HFAN-08 4hfan081 JESD51-7: JESD51-8: JESD51-9: JESD51-10: SZZA017A, JESD51-1 "thermal via" QFN "100 pin" PACKAGE thermal resistance QFN PACKAGE thermal resistance JESD51-3 SLMA002 AN569 JESD51-2 PDF

    QFN PACKAGE Junction to PCB thermal resistance

    Abstract: AN569 Motorola
    Text: Application Note: HFAN-08.1 Rev 0; 11/01 Thermal Considerations of QFN and Other Exposed-Paddle Packages Note: This application note is a summary and compilation of information based on the references mentioned at the end of this document. This information is neither tested


    Original     		HFAN-08 4hfan081 JESD51-5: JESD51-6: JESD51-7: JESD51-8: JESD51-9: JESD51-10: QFN PACKAGE Junction to PCB thermal resistance AN569 Motorola PDF

    Amkor Technology 1999

    Abstract: JESD51-1 QFN PACKAGE Junction to PCB thermal resistance JESD51-4 HFAN-08-1 AN569 JESD51-2 JESD51-3 SLMA002 thermal analysis on pcb
    Text: Application Note: HFAN-08.1 Rev.1; 04/08 Thermal Considerations of QFN and Other Exposed-Paddle Packages Note: This application note is a summary and compilation of information based on the references mentioned at the end of this document. This information is neither tested


    Original     		HFAN-08 JESD51-7: JESD51-8: JESD51-9: JESD51-10: SZZA017A, Amkor Technology 1999 JESD51-1 QFN PACKAGE Junction to PCB thermal resistance JESD51-4 HFAN-08-1 AN569 JESD51-2 JESD51-3 SLMA002 thermal analysis on pcb PDF

    Atmel 826

    Abstract: TS88915T atmel 748 TS68882 Atmel 89c TIP 41c transistor TS68000 TS68040 TS6840 5962-9314301MXA
    Text: Features • • • • • • • • • • • • • • 26-42 MIPS Integer Performance 3.5-5.6 MFLOPS Floating-Point-Performance IEEE 754-Compatible FPU Independent Instruction and Data MMUs 4K bytes Physical Instruction Cache and 4K bytes Physical Data Cache Accessed


    Original     		754-Compatible 32-bit, TS68000 Atmel 826 TS88915T atmel 748 TS68882 Atmel 89c TIP 41c transistor TS68040 TS6840 5962-9314301MXA PDF

    Thomson-CSF semiconductor

    Abstract: 68030 cqfp 5962-9314301MXA 68040 THOMSON CSF TIP TIP 41c transistor 5962-9314302MYC THOMSON-CSF SEMICONDUCTEURS SPECIFIQUES marking thomson logo MIL-M-3853
    Text: TS 68040 THIRD-GENERATION 32-BIT MICROPROCESSOR DESCRIPTION The TS 68040 is Thomson’s third generation of 68000-compatible, high-performance, 32-bit microprocessors. The TS 68040 is a virtual memory microprocessor employing multiple, concurrent execution units and a highly integrated architecture to provide very high performance in a monolithic


    Original     		32-BIT 68000-compatible, 68030-compatible 754-compatible DSTS68040T/0298 Thomson-CSF semiconductor 68030 cqfp 5962-9314301MXA 68040 THOMSON CSF TIP TIP 41c transistor 5962-9314302MYC THOMSON-CSF SEMICONDUCTEURS SPECIFIQUES marking thomson logo MIL-M-3853 PDF

    siemens CAPACITOR gpf

    Abstract: siemens foil capacitor CENELEC REPORT R040-001
    Text: General Technical Information 1 Basic construction of aluminum electrolytic capacitors Aluminum electrolytic capacitors, which will be abbreviated to “Al electrolytic capacitors” in the following, assume a special position among the various types of capacitors since their principle of


    Original     		41590-A7 41590-S3 siemens CAPACITOR gpf siemens foil capacitor CENELEC REPORT R040-001 PDF

    2090-XXNPMF-xxSxx

    Abstract: ALLEN-BRADLEY 9300 vibration sensor sin cos encoder Ultra-3000 LDC-M100500 Allen-Bradley 2090 2090-XXNFMF-Sxx LDC-100-300-CP 2090-KFBM4-CAAA 2090-XXNFMF-S
    Text: LDC-Series Iron Core Linear Servo Motors Catalog Numbers LDC-C030xxx-xHT11, LDC-C050xxx-xHT11, LDC-C075xxx-xHT11, LDC-C100xxx-xHT11, LDC-C150xxx-xHT11 LDC-C030xxx-xHT20, LDC-C050xxx-xHT20, LDC-C075xxx-xHT20, LDC-C100xxx-xHT20, LDC-C150xxx-xHT20 LDC-M030xxx, LDC-M050xxx, LDC-M075xxx, LDC-M100xxx, LDC-M150xxx


    Original     		LDC-C030xxx-xHT11, LDC-C050xxx-xHT11, LDC-C075xxx-xHT11, LDC-C100xxx-xHT11, LDC-C150xxx-xHT11 LDC-C030xxx-xHT20, LDC-C050xxx-xHT20, LDC-C075xxx-xHT20, LDC-C100xxx-xHT20, LDC-C150xxx-xHT20 2090-XXNPMF-xxSxx ALLEN-BRADLEY 9300 vibration sensor sin cos encoder Ultra-3000 LDC-M100500 Allen-Bradley 2090 2090-XXNFMF-Sxx LDC-100-300-CP 2090-KFBM4-CAAA 2090-XXNFMF-S PDF

    MICROPROCESSOR 68000

    Abstract: THOMSON CSF TIP Thomson-CSF semiconductor TIP 41c transistor 68040 thomson 6804-D 68030 cqfp THOMSON-CSF PRODUCTS MIL-STD-853 754for
    Text: TS 68040 THIRD-GENERATION 32-BIT MICROPROCESSOR DESCRIPTION The TS 68040 is Thomson’s third generation of 68000-compatible, high-performance, 32-bit microprocessors. The TS 68040 is a virtual memory microprocessor employing multiple, concurrent execution units and a highly integrated architecture to provide very high performance in a monolithic


    Original     		32-BIT 68000-compatible, 68030-compatible 754-compatible DSTS68040T/0298 MICROPROCESSOR 68000 THOMSON CSF TIP Thomson-CSF semiconductor TIP 41c transistor 68040 thomson 6804-D 68030 cqfp THOMSON-CSF PRODUCTS MIL-STD-853 754for PDF

    siemens CAPACITOR gpf

    Abstract: SIEMENS SIKOREL B41684 CENELEC REPORT R040-001 cenelec r040-001 3844 b so 8 b43682 CECC Detail Specifications 45811 DIN 43560
    Text: Aluminum Electrolytic Capacitors General Technical Information General technical information 1 Basic construction of aluminum electrolytic capacitors Aluminum electrolytic capacitors, which will be abbreviated to “Al electrolytic capacitors” in the following, assume a special position among the various types of capacitors since their principle of operation relies, in part, on electrochemical processes.


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    Power Semiconductor Applications Philips Semiconductors

    Abstract: "Power Semiconductor Applications" Philips "CHAPTER 1 Introduction to Power Semiconductors" CHAPTER 1 Introduction to Power Semiconductors "static induction thyristor" varistor 503 static induction Thyristor TELEVISION EHT TRANSFORMERS 201 Static Induction Thyristor varistor 10c 471
    Text: Thermal Management Power Semiconductor Applications Philips Semiconductors CHAPTER 7 Thermal Management 7.1 Thermal Considerations 553 Thermal Management Power Semiconductor Applications Philips Semiconductors Thermal Considerations 555 Thermal Management


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    VI-J00

    Abstract: No abstract text available
    Text: Design Guide & Applications Manual For VI-200 and VI-J00 Family DC-DC Converters and Configurable Power Supplies Table of Contents Design Guide & Applications Manual For VI-200 and VI-J00 Family DC-DC Converters and Configurable Power Supplies VI-/MI-200 and VI-/MI-J00 DC-DC Converters


    Original     		VI-200 VI-J00 VI-/MI-200 VI-/MI-J00 PDF

    VI-B60-CU

    Abstract: VICOR REGULATOR SCHEMATIC J7X LASER DIODE Vicor VI-B60 driver 30090 opto triac angle phase control Infant Radiant Warmer induction heating offline switcher VICOR 31742
    Text: Design Guide & Applications Manual For VI-200 and VI-J00 Family DC-DC Converters and Configurable Power Supplies Table of Contents Design Guide & Applications Manual For VI-200 and VI-J00 Family DC-DC Converters and Configurable Power Supplies VI-/MI-200 and VI-/MI-J00 DC-DC Converters


    Original     		VI-200 VI-J00 VI-/MI-200 VI-/MI-J00 VI-B60-CU VICOR REGULATOR SCHEMATIC J7X LASER DIODE Vicor VI-B60 driver 30090 opto triac angle phase control Infant Radiant Warmer induction heating offline switcher VICOR 31742 PDF

    Untitled

    Abstract: No abstract text available
    Text: A N A LO G D EVICES Airflow and Temperature Sensor TMP12* FEATURES Temperature Sensor Includes 100 £2 Heater Heater Provides Power IC Emulation Accuracy ±3°C typ. from -4 0 °C to +100°C Operation to +150°C 5 mV/°C Internal Scale-Factor Resistor Programmable Temperature Setpoints


    OCR Scan     		TMP12* TMP12 PDF