5962-8513101XA
Abstract: 5962-85131073A 5962-85131083C 5962-85131013A 5962-85131032A HI5116 34371 5962-8513105XA hi4-546 5962-85131083A
Text: REVISIONS LTR DESCRIPTION DATE YR-MO-DA APPROVED A Add case outlines, terminal connections and thermal resistance values for case outlines 2 and 3. For device type 01, 02, and 03, add subgroup 3 to IIH and IIL test, add RDS1 test, add VISO test, delete VCT test, change RL and CL test conditions for
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5962-R061-95.
1ES66
5962-8513101XA
5962-85131073A
5962-85131083C
5962-85131013A
5962-85131032A
HI5116
34371
5962-8513105XA
hi4-546
5962-85131083A
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107D
Abstract: No abstract text available
Text: CHIP LED LAMPS GENERAL INFORMATION QUALITY CONTROL AND ASSURANCE Classification Endurance Test Environmental Test Test Item Reference Standard Test Conditions Operation Life MIL-STD-750 : 1026 MIL-STD-883 : 1005 JIS C 7021 : B-1 High Temperature High Humidity
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MIL-STD-202
MIL-STD-883
JIS-C-7021
MIL-STD-750
107D
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107D
Abstract: HX2040
Text: CHIP LED LAMPS GENERAL INFORMATION QUALITY CONTROL AND ASSURANCE Classification Endurance Test Environmental Test Test Item Reference Standard Test Conditions Result Operation Life MIL-STD-750 : 1026 MIL-STD-883 : 1005 JIS C 7021 : B-1 Connect with a power If = 20mA
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MIL-STD-202
240hrs
MIL-STD-883
000hrs
JIS-C-7021
MIL-STD-750
60min
107D
HX2040
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Maruwa substrate
Abstract: H60A H63A C15010C
Text: MARUWA GENERAL CATALOG PERFORMANCE AND TEST METHOD Specifications CHIP VARISTORS Characteristics Test Method and Conditions 20ȗ5°C,65ȗ20% RH in principle. If results obtained are doubted, a further test should be carried out at 20ȗ15°C, 65ȗ20% RH. Standard Test Condition
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Untitled
Abstract: No abstract text available
Text: TeleLink Fuse Qualification Data The F1250T and F1251T meet the following test conditions per GR 1089 without any additional series resistance. However, in-circuit test verification is required. Note that considerable heating may occur during Test 4 of the Second Level AC Power Fault Test.
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F1250T
F1251T
10x1000
10x360
10x360
F1251T.
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TELELINK
Abstract: No abstract text available
Text: Four-port TeleLink Fuse Qualification Data The F1250Z8 and F1251Z8 meet the following test conditions per GR 1089 without additional series resistance. However, in-circuit test verification is required. Note that considerable heating may occur during Test 4 of the Second Level AC Power Fault Test.
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F1250Z8
F1251Z8
10x1000
10x360
10x360
TELELINK
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Teccor Electronics
Abstract: No abstract text available
Text: TeleLink Fuse Qualification Data The 0461 1.25 and 0461 002. meet the following test conditions per GR 1089 without additional series resistance. However, in-circuit test verification is required. Note that considerable heating may occur during Test 4 of the Second Level AC Power Fault Test.
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10x1000
10x360
10x360
Teccor Electronics
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EIAJ ED-4701 305
Abstract: No abstract text available
Text: Reliability Test Category Environmental Test No Test Category Related Standards Test Conditions Purpose MIL-STD-883G IEC 60749 IEC 60068-2 JESD22 EIAJ ED-4701 ― Part 5 ― A101-C Method 102 To evaluate the endurance of the devices when used in high temperature and high humidity
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MIL-STD-883G
JESD22
ED-4701
A101-C
A103-C
200pF
A114-F
A115-A
JESD78A
EIAJ ED-4701 305
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Untitled
Abstract: No abstract text available
Text: TestStation LH In-Circuit Test System Quality In-Circuit Test at an Affordable Price ½ High fault coverage ½ Safe low voltage test ½ Fast test throughput ½ Exceptional diagnostic accuracy ½ Proven test reliability ½ Scalable test capabilities ½ Low cost of
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AT-150-0303-5k
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Untitled
Abstract: No abstract text available
Text: Test Conditions: - All test in room temp. Input board loss = ignored Output board loss = ignored Vcc = 9.00V
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RF Connectors
Abstract: BGE885 BGX881 BGD885 BGX885N SC16
Text: DISCRETE SEMICONDUCTORS DATA SHEET SC16_TEST_JIGS CATV test jigs 1998 Mar 06 File under Discrete Semiconductors, SC16 Philips Semiconductors CATV test jigs SC16_TEST_JIGS STANDARD CATV TEST JIG PARAMETER CONDITIONS VALUE Frequency Suitability 5 to 1000 MHz
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NSG1003
Abstract: TDS1002 TSP070-112 TSP090-124 TSP140-112 TSP180-124 TSP360-124 TSP600-124
Text: SEMI F-47 Test Compliance Test Report Standard: SEMI F47-0200 Specification for Semiconductor Processing Equipment Voltage Sag Immunity Test Procedure Standard: Semi F42 : Test method for Semiconductor Processing Equipment. Voltage Sag Immunity 1. Test Setup
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F47-0200
NSG1003:
TDS1002
TSP070-112
TSP090-124
TSP140-112
TSP180-124
TSP360-124
TSP600-124
DUT50
NSG1003
TDS1002
TSP070-112
TSP090-124
TSP140-112
TSP180-124
TSP360-124
TSP600-124
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Willamette
Abstract: project transistor tester
Text: Intel Technology Journal Q199 Defect-Based Test: A Key Enabler for Successful Migration to Structural Test Sanjay Sengupta, MPG Test Technology, Intel Corp. Sandip Kundu, MPG Test Technology, Intel Corp. Sreejit Chakravarty, MPG Test Technology, Intel Corp.
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A4/T11
Willamette
project transistor tester
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Yageo electrolytic capacitor marking
Abstract: No abstract text available
Text: 3 ELECTROLYTIC CAPACITORS TEST RELIABILITY PROCEDURES AND REQUIREMENT This is a summary of reliability test procedures and requirements for YAGEO Radial Type & Snap-in Type electrolytic capacitors. ITEM STANDARD CONDITIONS OF TEST PERFORMANCE 1 Robustness of Terminations :
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68-2-ch
C/105
Yageo electrolytic capacitor marking
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ELECTRO MAGNETIC INTERFERENCE CONTROL TECHNIQUES
Abstract: outgoing raw material inspection procedure RAW MATERIAL INSPECTION procedure
Text: VISHAY Vishay Semiconductors Reliability & Statistics Glossary Definitions Accelerated Life Test: A life test under conditions those are more severe than usual operating conditions. It is helpful, but not necessary, that a relationship between test severity and the probability
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19-Mar-04
ELECTRO MAGNETIC INTERFERENCE CONTROL TECHNIQUES
outgoing raw material inspection procedure
RAW MATERIAL INSPECTION procedure
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QT12C05
Abstract: QT12C01 QT60248 QT12C QT6C01 QT60160 TE2124 QT60000 QT60486
Text: lQ QT60240 TEMPERATURE TEST 1 Introduction 4. The temperature test has following test sequence: This document outlines the results of the temperature test for QT60240. This test and its results shall apply to the QT60000 chip family that includes QT60160,
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QT60240
QT60240.
QT60000
QT60160,
QT60240,
Q60168,
QT60248,
QT60486,
QT12C01
QT12C05,
QT12C05
QT60248
QT12C
QT6C01
QT60160
TE2124
QT60486
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AN557
Abstract: HI-200 HI-201 HI-201HS HI-303 HI-307 HI-390 HI-5042 HI201 cross reference
Text: Recommended Test Procedures for Analog Switches Application Note Introduction The following text describes the basic test procedures that can be used for most Intersil CMOS switches. Various test conditions are used with the various switches. Table 1 has
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AN557
HI-200
HI-201
HI-201HS
HI-303
HI-307
HI-390
HI-5042
HI201 cross reference
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Untitled
Abstract: No abstract text available
Text: D-Subminiature Adapter Test Kit & Hardware Adapter Test Kit Specially designed for EMI evaluation process • ■ Male/female adapter part Adapter Test Kit Easily plugged into equipment under testing conditions Hardware ■ Ideal for new products and retrofitting
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jackscrew
Abstract: No abstract text available
Text: D-Subminiature Adapter Test Kit & Hardware Adapter Test Kit Specially designed for EMI evaluation process Adapter Test Kit • Male/female adapter part ■ Easily plugged into equipment under testing conditions Hardware ■ Ideal for new products and retrofitting
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JESD22-A102-B
Abstract: JESD22-A113
Text: RF 1C ENVIRONMENTAL QUALIFICATION TESTS Group A Group Step Name Conditions Control A A A1 A1 A2 A2 A2 A2 B Packaging Initial Test Control Group Screen IR Reflow simulation Functional test Temp.Cvcle Functional test Life test Interim Test Life Test cont. Functional test
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480ss
125/lot)
JESD22-A113
20min
883-M1010
883-M2015
JESD22-A102-B
883-M3015
8S3-M2003
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Untitled
Abstract: No abstract text available
Text: AC TEST CIRCUITS AND WAVEFORMS The following test circuits and conditions represent SG S’s-THOM SON typical AC test procedures. The output loading for standard Low Power Schottky devices is a 15 pF capacitor. Experim ental evidence shows that test results using the additional dioderesistor load are within 0.2 ns of the capacitor only
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15MHz
SC-0009
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smd rnw
Abstract: ADG508A DG508A HI-508A HI-548 MAX358
Text: REVISIONS F V YR-M0-DA APPROVED 87-01-30 Change to military drawing format. Add device type 03. Device 01, case E, inactive for new design. Table I (device 01) change test condition for Ij|_- Table I (device 02): Delete test Rpgg ant^ ^CT' add test ÀRq s v change test conditions and limits for: «qs V CIS'
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1ES66.
MIL-BUL-103.
MIL-BUL-103
smd rnw
ADG508A
DG508A
HI-508A
HI-548
MAX358
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Untitled
Abstract: No abstract text available
Text: 8. Reliability 8. Reliability The reliability of surface mount devices is periodically checked and controlled according to the following table : Reliability of Surface Mount Devices Test Item Test Time Test Conditions Criteria External dimensions Physical dimensions m ust meet individual
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J24Hr<
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mil-std-202 method 112 test condition c
Abstract: No abstract text available
Text: Specifications and Test Circuits VISHAY Vishay Dale ENVIRONMENT L AND MECHANICAL SPECIFICATIONS DESCRIPTION LIMITS/CONDITIONS TEST PROCEDURES Thermal Cycle - 55°C, + 85°C, 5 cycles MIL-STD-202, Method 107, Condition A Gross Leak Test All units 100% leak tested
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MIL-STD-202,
108Atm.
1000g,
2000Hz,
mil-std-202 method 112 test condition c
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