teradyne z1800 tester manual
Abstract: dfp 740 Teradyne Teradyne spectrum teradyne tester test system xilinx jtag cable z1800 dfp cable XC2064 XC3090
Text: Programming Xilinx XC9500 on a Teradyne Z1800 or Spectrum Preface JTAG Programmer Troubleshooting Version 2.1i June 1999 Introduction Creating SVF Files Creating Teradyne Test Files Programming XC9500 on a Teradyne Z1800 or Spectrum R The Xilinx logo shown above is a registered trademark of Xilinx, Inc.
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XC9500
Z1800
XC9500
XC2064,
XC3090,
XC4005,
XC5210,
XC-DS501,
teradyne z1800 tester manual
dfp 740
Teradyne
Teradyne spectrum
teradyne tester test system
xilinx jtag cable
dfp cable
XC2064
XC3090
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teradyne z1800 tester manual
Abstract: XC2064 XC3090 XC4005 XC5210 XC9500 XC95108 Z1800
Text: Programming Xilinx XC9500 on a Teradyne Z1800 Preface Introduction Creating SVF Files Creating Teradyne Test Files JTAG Programmer Version 1.2 September1, 1998 Troubleshooting Printed in U.S.A. Programming XC9500 on a Teradyne Z1800 R The Xilinx logo shown above is a registered trademark of Xilinx, Inc.
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XC9500
Z1800
XC9500
XC2064,
XC3090,
XC4005,
XC5210,
XC-DS501,
teradyne z1800 tester manual
XC2064
XC3090
XC4005
XC5210
XC95108
Z1800
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teradyne z1800 tester manual
Abstract: dfp 740 Z1800 dfp cable teradyne tester test system teradyne XC2064 XC3090 XC4005 XC5210
Text: Programming Xilinx XC9500 on a Teradyne Z1800 Preface Introduction Creating SVF Files Creating Teradyne Test Files EZTag Version Troubleshooting June 16, 1997 Version 1.0 Printed in U.S.A. Programming XC9500 on a Teradyne Z1800 R The Xilinx logo shown above is a registered trademark of Xilinx, Inc.
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XC9500
Z1800
XC9500
XC2064,
XC3090,
XC4005,
XC5210,
XC-DS501,
teradyne z1800 tester manual
dfp 740
Z1800
dfp cable
teradyne tester test system
teradyne
XC2064
XC3090
XC4005
XC5210
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teradyne z1890
Abstract: Z1890 teradyne products intel 80486 architecture
Text: ON-BOARD PROGRAMMING EQUIPMENT TERADYNE Z1890 • ■ ■ ■ ■ ■ Cost-effective in-circuit test targets manufacturing defects Product function test and in-circuit process test combined in one platform Open architecture and built-in upgrade path Flexibility and high throughput
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Z1890
Z1890
teradyne z1890
teradyne products
intel 80486 architecture
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teradyne z1890
Abstract: Z1890 teradyne z1800 testing of diode 28F001BX 28F002BC 28F002BX 28F010 28F020
Text: ON-BOARD PROGRAMMING EQUIPMENT TERADYNE Z1890 • ■ ■ ■ ■ ■ Cost-effective in-circuit test targets manufacturing defects Product function test and in-circuit process test combined in one platform Open architecture and built-in upgrade path Flexibility and high throughput
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Z1890
Z1890
28F008BV,
28F008SA,
28F008SC,
28F800BV,
28F800CE,
28F800CV,
teradyne z1890
teradyne
z1800
testing of diode
28F001BX
28F002BC
28F002BX
28F010
28F020
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Z1800-Series
Abstract: teradyne INTEL 80486 DX2 80486DX2 z1800
Text: ON-BOARD PROGRAMMING EQUIPMENT TERADYNE Digital Function Processor • ■ ■ ■ ■ ■ Non-volatile memory and logic programming Program on-board flash on PCBs at the in-circuit test stage Supports Intel Flash memory, Lattice ISP, Altera 7000s, etc. Flexible, high-throughput dedicated
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7000s,
Z1800-Series
teradyne
INTEL 80486 DX2
80486DX2
z1800
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intel 8253
Abstract: 8253 teradyne 8253 intel Z1800-Series INTEL DX2 intel microsoft 28F001BX 28F002BC 28F002BX
Text: ON-BOARD PROGRAMMING EQUIPMENT TERADYNE Digital Function Processor • ■ ■ ■ ■ ■ Non-volatile memory and logic programming Program on-board flash on PCBs at the in-circuit test stage Supports Intel Flash memory, Lattice ISP, Altera 7000s, etc. Flexible, high-throughput dedicated
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7000s,
Z1800-Series
28F010,
28F001BX,
28F020,
28F002BC,
28F002BL,
28F002BV,
28F002BX,
intel 8253
8253
teradyne
8253 intel
INTEL DX2
intel microsoft
28F001BX
28F002BC
28F002BX
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Untitled
Abstract: No abstract text available
Text: XFrame Integrated Software Development Environment for XStation HS™ Automated X-Ray Inspection Systems ½ Fastest program development via built-in inspection wizards ½ Uses Teradyne's D2B™ and Alchemist™ software for performing CAD preparation activities
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AT-160-1103
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Teradyne connector
Abstract: 470-2075-100 470-2105-100 337 BGA footprint 471-2045-100 471-1045-100 471-1025-100 470-2235-100 BGA PROFILING Teradyne
Text: TB-2082 DFM and SMT Assembly Guideline Revision “C“ Specification Revision Status Revision SCR No. Description Initial Date “-“ “A” 33277 36994 J. Marvin J. Proulx 1/16/01 10/19/01 “B” “C” 39831 42921 Initial Release Update stencil design, JEDEC tray info, add weight
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TB-2082
Teradyne connector
470-2075-100
470-2105-100
337 BGA footprint
471-2045-100
471-1045-100
471-1025-100
470-2235-100
BGA PROFILING
Teradyne
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Untitled
Abstract: No abstract text available
Text: D2B Strategist Test & Inspection Strategy Management Software • Accelerates new product introduction by optimizing test strategies early in the design cycle • Enables Users to reduce the cost of test by helping to define the most efficient test and inspection strategy
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STG-D2B-STG-2010-00
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LSI Logic teradyne
Abstract: No abstract text available
Text: TestStation SE 8862 In-Circuit Test System The Natural Z1800-Series™ Replacement System • Provides direct Z18xx program migration • Wireless personality plate allows use of existing fixture • Graphical, easy-touse programming and debug environments
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Z1800-Seriesâ
Z18xx
Z18xx
Z1800Series'
STG-TSSE-2010-00
LSI Logic teradyne
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Untitled
Abstract: No abstract text available
Text: Agilent Medalist i5000 Program and Fixture Conversion Solution Solution Overview Industry Challenges Product Summary Converting production lines from one ICT platform to another can be expensive and time-consuming for any PCBA assembly operation. The capital cost of the
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i5000
5989-3858EN
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CC-3
Abstract: No abstract text available
Text: TM CC3 Lightning Flash/ ISP Programmer High-speed channel card for flash memory and ISP device programming on Spectrum Manufacturing Test Systems Minimize cycle time for flash and ISP programming Combine in-circuit test and device programming, decreasing
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8800P009-0300-2
CC-3
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PRBS31
Abstract: CONN CRD 19 Teradyne connector waveform variable time delay with connector
Text: Hspice Differential IO Kit User’s Manual Simulation of Lattice SC Product LVDS and other differential Interfaces OVERVIEW The Lattice HSpice IO Kit contains a collection of HSpice model files that allow LVDS and other differential data link simulation across a PCB module or backplane hardware system. Examples of other differential
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564-0383-553
Abstract: 494-5010-002 teradyne connectors Teradyne connector
Text: The Very High Density Metric High Speed Differential VHDM -HSD connector system is designed for differential pair architecture applications that require very high interconnect density and higher speed signal integrity than the standard VHDM system in a single ended
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74697-10x2
74696-10x2
74697-25x2
74696-25x2
74651-10x2
74650-10x2
74651-25x2
74650-25x2
467-5010-x02
467-5110-x02
564-0383-553
494-5010-002
teradyne connectors
Teradyne connector
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teradyne tester test system
Abstract: No abstract text available
Text: ,TATION j-t With U k ia P in JJ Teradyne TestStation Systems High Quality In-Circuit Testing Teradyne - A Company you can Count On With 30+ years of ICT experience and over 6,000+ systems installed, Teradyne's TestStation™ is the preferred solution for discerning manufacturers who value test quality. Test
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2012-All
STG-TS0-2011-01
teradyne tester test system
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teradyne tester test system
Abstract: No abstract text available
Text: ^Jest ^ ,TATIONrïWith UltraPinJIJ Teststation PXI Expansion Board Industry's Most Integrated PXI/ICT Solution Key Features: • Plugs directly into TestStation Instru ment Backplane ■ Supports 4 PXI In The TestStation™ PXI struments Expansion Board ex
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100MHz
STG-PXI-2012-01
teradyne tester test system
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Untitled
Abstract: No abstract text available
Text: | U ‘ |)ESIGN-to-ßmLD; D2B Design-to-Build Software Software Applications that Optimize PCBA Test and Inspection Efficiencies Key Features: • Enables manufac turers to drive down and control the "Cost of Test" ■ A simple software tool for all your test
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Mod14
10W2010
2B-2012-00
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Untitled
Abstract: No abstract text available
Text: e s t S t a t i o n rr 7 - - - / With U/tmPinJJ^ Scan Pathfinder Boundary Scan Option Boundary Scan Test Generation and Diagnostic Software for TestStation™ and GR228X Test Systems Key Features: • Comprehensive shorts and opens testing for boards with limited test
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GR228X
STG-SCANPF-2011-01
2011-All
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Teradyne connector 72 pin
Abstract: No abstract text available
Text: H D M /H U M 2 mm Backplane Interconnection System ^ H ig h -d e n s ity 2 m m c o n t a c t sp a c in g : 2 0 c o n ta c ts p er lin e a r c m * S ta n d a r d a n d s h ie ld e d d a u g h te r b o a r d c o n n e c t o r o p t io n s v M o d u la r c o m p o n e n t s for
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-1217-Cbackplane
0896-BHP-5000
Teradyne connector 72 pin
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Untitled
Abstract: No abstract text available
Text: ^ H S T ^ iTAT10Nr r With U kraHnJJ TestStation Duo Concurrent In-Circuit Test Systems Provides Fastest ICT Test Throughput, Lowers High Volume Production Costs Key Features: • Twice the through put of traditional in circuit testers ■ Lower capital equip
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iTAT10Nr
2011-All
STG-TSDU0-2011-02
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Untitled
Abstract: No abstract text available
Text: ysr^i rEST \T A T IO N rr ~ ' -“«“ / / TestStation TSR Rackmount In-Circuit Test Systems A utom ation Solution fo r High Volume Manufacturers Key Features: • M odularized Tera- dyne ICT hardw a re com ponents ■ S tandard in te g ra tion solutions
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2011-All
STG-TSR-2011-01
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Teradyne connector
Abstract: 85158 press tool 7990 mounting block 890036 pc repair MANUAL 220-13400
Text: m olex Application Tooling In order to insert a typical row of connectors excluding the Daughtercard modules , it is necessary to select the individual insertion tools and then pick the appropriate tooling holder (See also examples below): 1. Determine the combination of signal modules and power
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J-206
Teradyne connector
85158
press tool
7990 mounting block
890036
pc repair MANUAL
220-13400
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Untitled
Abstract: No abstract text available
Text: ,T A T I O N r r With UkraPinJ^j^ TestStation Multi-Function Application Board Expand F u n c tio n a lity of y o u r T e s tS ta tio n S y ste m with Flexible A p p lic a tio n M o du les Key Features: • Plugs directly into TestStation Instru ment Backplane
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100MHz
STG-TSMFBOARD-2011-01
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