Teradyne connector 72 pin
Abstract: No abstract text available
Text: H D M /H U M 2 mm Backplane Interconnection System ^ H ig h -d e n s ity 2 m m c o n t a c t sp a c in g : 2 0 c o n ta c ts p er lin e a r c m * S ta n d a r d a n d s h ie ld e d d a u g h te r b o a r d c o n n e c t o r o p t io n s v M o d u la r c o m p o n e n t s for
|
OCR Scan
|
-1217-Cbackplane
0896-BHP-5000
Teradyne connector 72 pin
|
PDF
|
Untitled
Abstract: No abstract text available
Text: HIGH DENSITY PLUS Modular Daughterboard-to-Backplane INTERCONNECTION SYSTEM FEATURES A N D BENEFITS • M o d u la r c o n n e c to rs — s ig n a l, p o w e r , p o la r iz in g a n d g u id a n c e ■ ■ U p t o six ro w s o f c o n ta c ts o n 0 .1 0 0 " g rid
|
OCR Scan
|
QQN-280,
E-0593
KW-93-2009
|
PDF
|
Teradyne connector
Abstract: 85158 press tool 7990 mounting block 890036 pc repair MANUAL 220-13400
Text: m olex Application Tooling In order to insert a typical row of connectors excluding the Daughtercard modules , it is necessary to select the individual insertion tools and then pick the appropriate tooling holder (See also examples below): 1. Determine the combination of signal modules and power
|
OCR Scan
|
J-206
Teradyne connector
85158
press tool
7990 mounting block
890036
pc repair MANUAL
220-13400
|
PDF
|
Untitled
Abstract: No abstract text available
Text: FEATURES AND SPECIFICATIONS Features and Benefits • Pins pass through backplane to allow rear side mating of cards or cables ■ Gold contacts at both ends for excellent contact mating ■ Surface Mount Compatible Reference Information Product Specification: PS-73670-9999
|
Original
|
PS-73670-9999
E29179
73650-XXXX
73809-02XX
73810-12XX
|
PDF
|
liquid crystal polymer dielectric
Abstract: No abstract text available
Text: FEATURES AND SPECIFICATIONS Features and Benefits • Pins pass through backplane to allow rear side mating of cards or cables ■ Gold contacts at both ends for excellent mating ■ Surface Mount Compatible Reference Information Product Specification: PS-73670-9999
|
Original
|
PS-73670-9999
E29179
73809-02XX
73810-12XX
liquid crystal polymer dielectric
|
PDF
|
C72500
Abstract: No abstract text available
Text: FEATURES AND SPECIFICATIONS Backplane Connector Systems Features and Benefits • Similar features as the 73632 unshielded version ■ 6-row 2mm connector provides 25 shielded contacts per linear centimeter over 63 real signals per inch ■ Space-efficient contact shields reduce crosstalk while leveraging the number of usable signal pins
|
Original
|
|
PDF
|
Teradyne connector
Abstract: No abstract text available
Text: FEATURES AND SPECIFICATIONS Features and Benefits • Pins pass through backplane to allow rear side mating of cards or cables ■ Gold contacts at both ends for excellent contact mating ■ Surface Mount Compatible Backplane Connector Systems Reference Information
|
Original
|
PS-73670-9999
E29179
73809-02XX
73810-12XX
Teradyne connector
|
PDF
|
Untitled
Abstract: No abstract text available
Text: 2.00mm .079" Pitch HDM* Board-to-Board Backplane Header FEATURES AND SPECIFICATIONS • ■ ■ ■ 2 keys) and makes metallic sound when card is in wrong slot Guide pin provides ± 1.9mm of capture prior to plastic mating Can use 1 guide pin in center of connector or on both ends
|
Original
|
|
PDF
|
C72500
Abstract: 48-18
Text: Backplane Connectors C FEATURES AND SPECIFICATIONS Features and Benefits • High density 2mm metric connector in the same form factor as Futurebus ■ 6-row connector provides 30 contacts per linear centimeter over 75 per inch ■ Designed for high-density/high-speed applications
|
Original
|
available00
C72500
48-18
|
PDF
|
Untitled
Abstract: No abstract text available
Text: Features and Benefits • Similar features as the 73642 header ■ Eye of the needle press fit for high reliability ■ Metal hex key offers 8 coding combinations 64 with ■ ■ ■ ■ 2 keys and makes metallic sound when card is in wrong slot Guide pin provides ± 1.9mm of capture prior to plastic
|
Original
|
|
PDF
|
Untitled
Abstract: No abstract text available
Text: Backplane Connectors C FEATURES AND SPECIFICATIONS Features and Benefits • High density 2mm metric connector in the same form factor as Futurebus ■ 6-row connector provides 30 contacts per linear centimeter over 75 per inch ■ Designed for high-density/high-speed applications
|
Original
|
PS-73670-9999
E29179
|
PDF
|
teradyne
Abstract: C72500
Text: Backplane Connectors C FEATURES AND SPECIFICATIONS Features and Benefits • High-density 2.00mm metric connector in the same form factor as Futurebus ■ 6-row 2mm connector provides 30 contacts per linear centimeter over 75 per inch ■ Designed for high-density, high-speed applications
|
Original
|
|
PDF
|
C72500
Abstract: Teradyne connector
Text: 2.00mm .079" Pitch HDM* Board-to-Board Daughterboard Receptacle FEATURES AND SPECIFICATIONS Features and Benefits • High-density 2.00mm metric connector in the same form factor as Futurebus ■ 6-row 2mm connector provides 30 contacts per linear centimeter (over 75 per inch)
|
Original
|
Copper244
C72500
Teradyne connector
|
PDF
|
Untitled
Abstract: No abstract text available
Text: FEATURES AND SPECIFICATIONS Features and Benefits • Duckpin compliant zone is only 2.5mm long to permit Backplane Connector Systems installation of headers from front and rear of midplanes into the same holes ■ Enables orthogonal packaging North-South on front,
|
Original
|
PS-73670-9999
E29179
|
PDF
|
|
|
Untitled
Abstract: No abstract text available
Text: 2.00mm .079" Pitch HDM* Board-to-Board Stacking Header FEATURES AND SPECIFICATIONS Features and Benefits For parallel board packaging Available in press-fit or solder tail Up to 32mm board-to-board stack heights For Mezzanine cards, parallel backplanes and bridge board
|
Original
|
Sign2-1100
|
PDF
|
Untitled
Abstract: No abstract text available
Text: Features and Benefits • Duckpin compliant zone is only 2.5mm long to permit installation of headers from front and rear of midplanes into the same holes ■ Enables orthogonal packaging North-South on front, East-West on rear ■ Requires midplanes 5mm thick
|
Original
|
PS-73670-9999
E29179
|
PDF
|
Teradyne connector 72 pin
Abstract: No abstract text available
Text: FEATURES AND SPECIFICATIONS Features and Benefits • Duckpin compliant zone is only 2.5mm long to permit Backplane Connector Systems installation of headers from front and rear of midplanes into the same holes ■ Enables orthogonal packaging North-South on front,
|
Original
|
PS-73670-9999
E29179
Mechani9-1016
73799-XXXX
Teradyne connector 72 pin
|
PDF
|
Untitled
Abstract: No abstract text available
Text: m o le x FEATURES AND SPECIFICATIONS Features and Benefits Electrical HDM* • High-density 2.00mm metric connector in the same form factor as Futurebus Voltage: 1000V Current: 1,0A Board-to-Board ■ 6-row 2mm connector provides 30 contacts per linear centimeter over 75 per inch
|
OCR Scan
|
|
PDF
|
Untitled
Abstract: No abstract text available
Text: Features and Benefits • Similar features as the 73632 unshielded version ■ 6-row 2mm connector provides 25 shielded contacts per linear centimeter over 63 real signals per inch ■ Space-efficient contact shields reduce crosstalk while lever■ ■ ■
|
Original
|
PS-73670-9999
E29179
|
PDF
|
Untitled
Abstract: No abstract text available
Text: 2.00mm .079" Pitch HDM* Board-to-Board Stacking Header FEATURES AND SPECIFICATIONS Features and Benefits For parallel board packaging Available in press-fit or solder tail Up to 32mm board-to-board stack heights For Mezzanine cards, parallel backplanes, and bridge
|
Original
|
PS-73670-9999
E29179
|
PDF
|
Teradyne connector 72 pin
Abstract: b 939 a c 939 Teradyne connector
Text: Backplane Connectors FEATURES AND SPECIFICATIONS Features and Benefits • High-density 2mm, 6-row connector provides 30 contacts per linear centimeter over 75 per inch ■ Designed for high-density/high-speed applications ■ HDM header modules can mate interchangeably with
|
Original
|
PS-73670-9999
E29179
Teradyne connector 72 pin
b 939 a
c 939
Teradyne connector
|
PDF
|
Untitled
Abstract: No abstract text available
Text: Backplane Connectors FEATURES AND SPECIFICATIONS Features and Benefits • High-density 2mm, 6-row connector provides 30 contacts per linear centimeter over 75 per inch ■ Designed for high-density/high-speed applications ■ HDM header modules can mate interchangeably with
|
Original
|
|
PDF
|
Untitled
Abstract: No abstract text available
Text: FEATURES AND SPECIFICATIONS Features and Benefits For parallel board packaging Available in press-fit or solder tail Up to 32mm board-to-board stack heights Mezzanine card to facilitate blind mate Surface Mount Compatible Electrical Current: 1.0A Contact Resistance:
|
Original
|
PS-73670-9999
E29179
|
PDF
|
Untitled
Abstract: No abstract text available
Text: FEATURES AND SPECIFICATIONS Features and Benefits • Similar features as the 73642 header ■ Eye of the needle press-fit for high reliability ■ Metal hex key offers 8 coding combinations 64 with ■ ■ ■ Backplane Connector Systems ■ 2 keys and makes metallic sound when card is in
|
Original
|
|
PDF
|
