Please enter a valid full or partial manufacturer part number with a minimum of 3 letters or numbers

    TEPRO TO850 Search Results

    TEPRO TO850 Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    TEPRO

    Abstract: TEPRO TO850
    Text: TEPRO TYPE ELECTRa TECI-INIK ‘TO’ TO-220 STYLE THICK FILM HEAT SINK DEVICE FEATURES: 10-220 style package Miniature size Maximum power: size ratio High stability Optimum heat dissipation High temperature molding Noninductive TEPRO TYPE TO 816-850 Copper heat sink molded into TO 850 package


    Original     		PDF O-220 MIL-STD-202 MIL-STD-202 stab10-850 O850- TEPRO TEPRO TO850

    Untitled

    Abstract: No abstract text available
    Text: ELECTRO TECHNIK TO-220 STYLE THICK FILM HEAT SINK DEVICE FEATURES: TO-220 style package Miniature size Maximum power: size ratio High stability Optimum heat dissipation High temperature molding Noninductive TEPRO TYPE TO 816-850 Copper heat sink molded into TO 850 package


    OCR Scan     		PDF O-220 100ppm 50ppm MIL-STD-202 O-816 O-850