TECHNOLOGY ROADMAP Search Results

TECHNOLOGY ROADMAP Result Highlights (5)

Part	Manufacturer	Description	Download
CS-SATDRIVEX2-001	Amphenol Cables on Demand	Amphenol CS-SATDRIVEX2-001 Serial ATA Extension Cable - SATA II Drive Extension Cable with Power (6.0 Gbps) 1m	Datasheet
CS-SATDRIVEX2-002	Amphenol Cables on Demand	Amphenol CS-SATDRIVEX2-002 Serial ATA Extension Cable - SATA II Drive Extension Cable with Power (6.0 Gbps) 2m	Datasheet
CS-SATDRIVEX2-000.5	Amphenol Cables on Demand	Amphenol CS-SATDRIVEX2-000.5 Serial ATA Extension Cable - SATA II Drive Extension Cable with Power (6.0 Gbps) 0.5m	Datasheet
CS-SASDDP8282-000.5	Amphenol Cables on Demand	Amphenol CS-SASDDP8282-000.5 29 position SAS to SATA Drive Connector Dual Data Lanes Cable 0.5m	Datasheet
CS-SASDDP8282-001	Amphenol Cables on Demand	Amphenol CS-SASDDP8282-001 29 position SAS to SATA Drive Connector Dual Data Lanes Cable 1m	Datasheet

TECHNOLOGY ROADMAP Datasheets Context Search

Catalog Datasheet	Type	Document Tags	PDF
toshiba toggle mode nand Abstract: TC518128 TC518129 TC551001 equivalent 551664 TC518512 sgs-thomson power supply Toggle DDR NAND flash jeida 38 norm APPLE A5 CHIP Text: DRAM Technology n TOSHIBA DRAM TECHNOLOGY Toshiba DRAM Technology 2 DRAM Technology n DRAM TECHNOLOGY TRENDS Density Design Rule 64M→128M →256M →512M →1G 0.35µm →0.25 µm →0.20 µm →0.175 µm Cost Down, Yield Improvement High Bandwidth Multi - bit	Original	64M128M 66MHz 100MHz 200MHz) 500/600MHz 800MHz 400MHz 800MHz) X16/X18X32 PhotoPC550 toshiba toggle mode nand TC518128 TC518129 TC551001 equivalent 551664 TC518512 sgs-thomson power supply Toggle DDR NAND flash jeida 38 norm APPLE A5 CHIP	PDF
ATM transaction- ABSTRACT Abstract: intel organisational structure ATM SYSTEM PROJECT- ABSTRACT "LDAP" "ISP" server Text: Managing Enhanced Network Services: A Pragmatic View of Policy-Based Management John Vicente, Information Technology, Intel Corporation Harold Cartmill, Information Technology, Intel Corporation Glen Maxson, Information Technology, Intel Corporation Shelby Siegel, Information Technology, Intel Corporation	Original		PDF
lQFP256 Abstract: TEQFP208 QFP PACKAGE thermal resistance SEMICONDUCTOR PACKAGING ASSEMBLY TECHNOLOGY BGA and QFP Package LQFP-256 Text: Technical Analysis Low-Cost Packaging Technology Using QFP Low-Cost Packaging Technology Using QFP The combination of bus bar technology and TEQFP technology is currently receiving attention in the development of a semiconductor package that realizes function	Original		PDF
Willamette Abstract: project transistor tester Text: Intel Technology Journal Q199 Defect-Based Test: A Key Enabler for Successful Migration to Structural Test Sanjay Sengupta, MPG Test Technology, Intel Corp. Sandip Kundu, MPG Test Technology, Intel Corp. Sreejit Chakravarty, MPG Test Technology, Intel Corp.	Original	A4/T11 Willamette project transistor tester	PDF
IBM Microelectronics Abstract: SEMICONDUCTOR PACKAGING ASSEMBLY TECHNOLOGY Text: Customer Information IBM Microelectronics Technology Qualifications IBM Microelectronics Technology Qualifications Overview IBM Microelectronics Division performs well-defined, highly structured technology, package, and product qualifications. Our methodologies are based on over	Original		PDF
SMT roadmap Abstract: SMT Component Technology Road Map Capacitor tantalum 0402 Electrolytic Capacitors General Introduction technology roadmap NIC Components resistor Array chip resistors size 8 0402 electrolytic capacitor High Current SMT Ferrite Chip Beads 100PPM Text: SMT Component Technology Road Map Today The Future Technology Roadmap NIC Aluminum Electrolytic Capacitors Surface Mount aluminum electrolytic capacitors have become the area of largest growth for all electrolytic capacitors. • Larger case sizes: 8mm ~ 18mm diameters	Original	6800uF 400VDC SMT roadmap SMT Component Technology Road Map Capacitor tantalum 0402 Electrolytic Capacitors General Introduction technology roadmap NIC Components resistor Array chip resistors size 8 0402 electrolytic capacitor High Current SMT Ferrite Chip Beads 100PPM	PDF
0.18-um Abstract: 0.35uM STI CS100A CS70DL CS-80 pMOS NAND GATE 0.35Um CS70B Fujitsu inverter CG61 Text: CMOS PROCESS TECHNOLOGY 11 fujitsu-fme.com FUJITSU MICROELECTRONICS EUROPE www.fujitsu www.fujitsu fme.com ASIC & COT TECHNOLOGY ROADMAP Node 0.25um 0.18um CS70B 0.10um CS70DLS CS80DL 0.2 L gate [mm] CS70DL 0.13um CS80/CS80A ASIC/DRAM Half Pitch CS90A MPU	Original	CS70B CS70DL CS70DLS CS80DL CS80/CS80A CS90A CS100 CS90DLS CS100A/DL 0.18-um 0.35uM STI CS100A CS-80 pMOS NAND GATE 0.35Um CS70B Fujitsu inverter CG61	PDF
486DX-CPU Abstract: tamagawa 486DX transistors mos retrograde well 0.35 Text: MOS Scaling: Transistor Challenges for the 21st Century Scott Thompson, Portland Technology Development, Intel Corp. Paul Packan, Technology Computer Aided Design, Intel Corp. Mark Bohr, Portland Technology Development, Intel Corp. Index words: SDE, transistor, scaling	Original		PDF
802.16e wimax chip Abstract: fujitsu asic cpe wimax FUJITSU FRAM Text: WiMAX Technology and Deployment Fujitsu Perspective George Wu Director of Marketing Technology Solutions/ASSP Fujitsu Microelectronics America, Inc. Information Technology Association of America ITAA Webcast – October 19, 2004 10/19/04 1 Agenda • •	Original	16REVd 802.16e wimax chip fujitsu asic cpe wimax FUJITSU FRAM	PDF
intel motherboard repair Abstract: intel bios ic intel motherboard display problem repairing T7400 dual core intel microsoft WADE-8066 GME965 Q965 T7400 X3100 Text: White Paper Intel Technology in Gaming Equipment Intel Technology in Gaming Equipment Addressing the performance, security, availability and long life cycle needs of the gaming industry White Paper Intel Technology in Gaming Equipment Table of Contents Executive Summary .3	Original	0408/TLH/OCG/XX/PDF 319611-001US intel motherboard repair intel bios ic intel motherboard display problem repairing T7400 dual core intel microsoft WADE-8066 GME965 Q965 T7400 X3100	PDF
x86 addressing mode Abstract: 32-bit microprocessor architecture intel x86 processor architecture x86 processor architecture intel x86-64 gprs abstract interrupts of x86 microprocessor how to define amd athlon 64 app abstract Text: X86-64TM TECHNOLOGY WHITE PAPER Advanced Micro Devices, Inc. x86-64TM Technology White Paper ADVANCED MICRO DEVICES, INC. One AMD Place Sunnyvale, CA 94088 Contact: Sean Cleveland Public Relations 408 749-5980 sean.cleveland@amd.com Page 1 X86-64TM TECHNOLOGY WHITE PAPER	Original	X86-64TM 64-bit x86-64 x86 addressing mode 32-bit microprocessor architecture intel x86 processor architecture x86 processor architecture intel x86-64 gprs abstract interrupts of x86 microprocessor how to define amd athlon 64 app abstract	PDF
chang capacitor Abstract: capacitor huang Text: 2012 KEMET Institute of Technology www.kemet.com/kit What is KEMET Institute of Technology KIT KIT is a FREE technology workshop based on classroom instruction, live discussion, and factory tours covering details on how capacitors are made, how they work, and their applications.	Original		PDF
TMS320DM643x Abstract: DM6435 Camera processors dm6437 technology roadmap tms320dm6446 video port top video port communication AEC-Q100 ARM926 Texas Instruments Automotive Processors TMS320DM6435 Text: TECHNICAL BRIEF DaVinci Technology Background and Specifications Executive Summary DaVinci technology is the first integrated portfolio of DSP-based processors, software, tools, and support for developing a To further illustrate DaVinci technology, the following components have been optimized to work interdependently for digital video end equipments:	Original		PDF
DEPLETION Abstract: No abstract text available Text: Technology Roadmap Year Technology Products Voltage 1992 Pulse-doped High Power MESFETs 1 Watt MMICs 4 Watt MMICs +5/-5 +9/-5 1993 Heterostructure GaAs FETs 0.5 Watt FETs 1-2 Watt FETs +5/-S +5/-5 1994 GaAsHBT MMICs DC-10GHz MMICs +5 1995 Double Heterostructure GaAsFETs	OCR Scan	DC-10GHz DEPLETION	PDF

ferroelectric Abstract: No abstract text available Text: Technology Note FRAM Technology Backgrounder An overview of FRAM Technology – Updated Dec. 2000 Overview Figure 1. Perovskite Ferroelectric Crystal Established memory technologies are divided into two categories. First are nonvolatile memories. Traditionally, systems use them in read-only or readmostly applications since they are difficult to write.	Original		PDF
hypertransport Abstract: No abstract text available Text: W H I T E P A P E R HyperTransport Technology: Simplifying System Design AMD Technology Evangelism ADVANCED MICRO DEVICES, INC. One AMD Place Sunnyvale, CA 94088 Page 1 HyperTransport™ Technology: Simplifying System Design October 2002 W H I T E P A P E R	Original		PDF
BLC5G22LS-100 Abstract: BLC5G22-100 LDMOS LDMOS Technology for RF Power Amplifiers BLC5G22 metallization LDMOS digital BLF4G22-100 ldmos pa driver BLF5G22-180 Text: 5th Generation LDMOS Philips’ 0.4 µm technology for base station RF PAs sets the standard in W-CDMA ampliﬁer efﬁciency For RF power ampliﬁers PAs and base station manufacturers, our 5th generation LDMOS technology is a major advance. This technology offers key advantages for	Original		PDF
Toshiba Rambus IC Abstract: CL-GD5462 LG concurrent RDRAM ic laptop motherboard TV toshiba dramatic macronix nintendo CL-GD546 NEC rdram concurrent 8mb toshiba graphics 3d graphics Text: la RAMBUS 64-MEGABIT RAMBUS DRAM TECHNOLOGY DIRECTIONS 64M Ram bus D R A M Technology Directions 64M Rambus DRAM Technology Directions In Septem ber of 1995, an unprecedented announcem ent h it the PC industry. Six leading DRAM suppliers — H itachi, LG Semicon, NEC, Oki, S am sung an d Toshiba	OCR Scan	64-MEGABIT 64Mbit 533MHz Toshiba Rambus IC CL-GD5462 LG concurrent RDRAM ic laptop motherboard TV toshiba dramatic macronix nintendo CL-GD546 NEC rdram concurrent 8mb toshiba graphics 3d graphics	PDF
waveguide selective switch Abstract: quartz optical properties MSI nichrome resistor A1203 Thin Film Capacitors AI and Au wirebonding NICHROME wire 0.005 mm2 microwave circulators ATT Wireless Services coupler ATT coupler conductor Text: MIC Technology Vishay Electro-Films An Introduction To Substrate PIMICTM Passive Intergrated Micro-Electron Interconnect Circuitry Technology Thin film microwave integrated circuits have been evolving from a simple substrate medium which carries microwave/	Original	02-Dec-04 waveguide selective switch quartz optical properties MSI nichrome resistor A1203 Thin Film Capacitors AI and Au wirebonding NICHROME wire 0.005 mm2 microwave circulators ATT Wireless Services coupler ATT coupler conductor	PDF
MX 0541 Abstract: phone 14 pin vga camera pinout mx 0541 b nintendo nintendo ds 5 pin vga camera pinout suyin SAMSUNG NAND FLASH TRANSLATION LAYER FTL SAMSUNG NAND FLASH TRANSLATION LAYER Sram PANASONIC Memory card 32kbyte SAMSUNG NAND FTL Text: SmartMediaTM Application Memory Product & Technology Division 2000.3.15 Product Planning & Application Engineering The Leader in Memory Technology ELECTRONICS TM-SSFDC SmartMedia SmartMediaTM -SSFDC Pin Pin Configuration Configuration Consistent Pin-out for all densities : 2MB ~ 128MB	Original	128MB 16MB-3 17Pin SMA01U HPC-SV03 SMA02U SMA03U CBS51U MX 0541 phone 14 pin vga camera pinout mx 0541 b nintendo nintendo ds 5 pin vga camera pinout suyin SAMSUNG NAND FLASH TRANSLATION LAYER FTL SAMSUNG NAND FLASH TRANSLATION LAYER Sram PANASONIC Memory card 32kbyte SAMSUNG NAND FTL	PDF
R5F72543 Abstract: r5f61725 SH7724 R5F2136Can R5F72543RKBGV R5F35L83 R8A77240D500BG 2332 prom R5F70834AD80FTV R5F70835 Text: Renesas MPU & MCU General Catalog 2009.10 2009.10 Renesas MPU & MCU General Catalog Renesas MPU & MCU General Catalog RJJ01B0001-1200 2009. Renesas Technology Corp., All rights reserved. Printed in Japan. Colophon 11.1 Renesas Technology www.renesas.com	Original	RJJ01B0001-1200 REJ01B0008-1200 R5F72543 r5f61725 SH7724 R5F2136Can R5F72543RKBGV R5F35L83 R8A77240D500BG 2332 prom R5F70834AD80FTV R5F70835	PDF
atmel 444 Abstract: phase sequence checker for thyristor EN190000 schlumberger sentry15 certificate c7025 8361H C7025 JESD22-A102-B schlumberger Atmel Moisture sensitivity level Text: QUALPACK AT55.8k QUALPACK SUMMARY OF QUALIFICATION INFORMATION FOR TECHNOLOGY/PRODUCT LINE AT55.8k This document presents an overview of our qualification policy and the reliability qualification results for this technology. ATMEL Rousset Rev A/ March 2000	Original	S1650) EN190000 200mA 180mA Mil-std-883 atmel 444 phase sequence checker for thyristor schlumberger sentry15 certificate c7025 8361H C7025 JESD22-A102-B schlumberger Atmel Moisture sensitivity level	PDF
wireless cam 208c Abstract: R8J73 SH77343 HD6417760BP200ADV HD6417751RBP200V HD64F7144F50V HD6417705F133BV HD6417709SHF200BV HD64F7145FW50V HD6417760BL200ADV Text: SuperH Family of Microcontrollers and Microprocessors 2007.4 Renesas Technology America SuperH® Family of Microcontrollers & Microprocessors 2007 Catalog • One of the world’s leading ITDM Integrated Device and Technology Manufacturer companies serving the global market	Original	0407/10K/VIP/PF/SP REU01B0019-0701 wireless cam 208c R8J73 SH77343 HD6417760BP200ADV HD6417751RBP200V HD64F7144F50V HD6417705F133BV HD6417709SHF200BV HD64F7145FW50V HD6417760BL200ADV	PDF
idt CMOS RAM Abstract: R4700 Text: Integrated Device Technology, Inc. Corporate Backgrounder Corporate Profile Integrated Device Technology, Inc. IDT is an international designer, manufacturer and marketer of microprocessors and integrated circuits for a range of growth markets, including desktop computer, workstation/server, graphics/visualization,	Original		PDF

TECHNOLOGY ROADMAP Search Results

TECHNOLOGY ROADMAP Result Highlights (5)

TECHNOLOGY ROADMAP Datasheets Context Search

toshiba toggle mode nand

ATM transaction- ABSTRACT

lQFP256

Willamette

IBM Microelectronics

SMT roadmap

0.18-um

486DX-CPU

802.16e wimax chip

intel motherboard repair

x86 addressing mode

chang capacitor

TMS320DM643x

DEPLETION

ferroelectric

hypertransport

BLC5G22LS-100

Toshiba Rambus IC

waveguide selective switch

MX 0541

R5F72543

atmel 444

wireless cam 208c

idt CMOS RAM