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    TC83230-0019 Search Results

    TC83230-0019 Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    10119109-220019LF Amphenol Communications Solutions BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Double Row, 20 Positions, 2.54 mm (0.100in) Pitch. Visit Amphenol Communications Solutions
    51710-019LF Amphenol Communications Solutions PwrBlade®, Power Supply Connectors, 2P 16S 4P Vertical Header. Visit Amphenol Communications Solutions
    10147605-00019LF Amphenol Communications Solutions Minitek 1.0mm Vertical SMT Header, 19 Positions, Tin Plating, Natural Color Visit Amphenol Communications Solutions
    10119109-510019LF Amphenol Communications Solutions BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Double Row, 10 Positions, 2.54 mm (0.100in) Pitch. Visit Amphenol Communications Solutions
    67000-019LF Amphenol Communications Solutions Berg Duflex Housing, single row, 19 Position. Visit Amphenol Communications Solutions

    TC83230-0019 Datasheets (2)

    Part ECAD Model Manufacturer Description Curated Datasheet Type PDF
    TC83230-0019 Toshiba SINGLE-CHIP CMOS LSI FOR CALCULATORS WITH PRINTERS Scan PDF
    TC83230-0019 Toshiba Scan PDF