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TC200 agilent Abstract: DC-20 TC200 GaAs MMIC ESD, Die Attach and Bonding Guidelines MTTF testing HB2A TC-200 Text: HB2A Process Reliability Summary Heterojunction Bipolar Transistor IC Process Application Note # 53 - Rev. A Marketing March 1999 1.0 Introduction Included in this application note are reliability test descriptions and the test results for: • • • •	Original	15PSIG) TC200 agilent DC-20 TC200 GaAs MMIC ESD, Die Attach and Bonding Guidelines MTTF testing HB2A TC-200	PDF

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TC200 agilent

Abstract: DC-20 TC200 GaAs MMIC ESD, Die Attach and Bonding Guidelines MTTF testing HB2A TC-200
Text: HB2A Process Reliability Summary Heterojunction Bipolar Transistor IC Process Application Note # 53 - Rev. A Marketing March 1999 1.0 Introduction Included in this application note are reliability test descriptions and the test results for: • • • •

Original

15PSIG) TC200 agilent DC-20 TC200 GaAs MMIC ESD, Die Attach and Bonding Guidelines MTTF testing HB2A TC-200

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