Untitled
Abstract: No abstract text available
Text: General-purpose Diodes - Taping Specifications Taping Specifications Taping Name 1.35 ±0.4 1.1±0.2 1.5 ±0.2 +0.4 2.0 ±0.5 5.5 13 ±0.5 1,800 pcs. 4.0 ±0.1 Pull out direction 2.0 per reel 21±0.8 R1.0 2.6 5.1–0.1 Marking of Part No., Lot No., quantity, etc.
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melf smd dimensions
Abstract: BFQ67-GS08
Text: VISHAY Vishay Semiconductors Tape and Reel Standards Taping of RF Transistors and Diodes Taping of SMT Devices Vishay’s Transistors in SMD packages are available in an antistatic 8 mm blister tape in accordance with DIN IEC 268–3 for automatic component insertion.
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OT-143R
OT-23
OT-343
OT-143
02-Apr-04
OT-490
BFQ67-GS08
BFQ67-GS18
melf smd dimensions
BFQ67-GS08
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Taping of Diodes
Abstract: taping
Text: Taping of Diodes www.vishay.com Vishay Semiconductors Taping of Diodes AXIAL LEAD COMPONENTS Diodes and rectifiers with axial leads are normally delivered in taped form according to IEC 286-1 see figure 1 . The cathode side is designated by a colored tape. Taped
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OD-57
OD-64
DO-35
DO-41
27-Feb-14
Taping of Diodes
taping
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marking code w2 sot323
Abstract: marking code vishay label marking code w2 sot23 MARKING W2 SOT23 SOD80 marking DO214AC DO219AB DO35
Text: Taping of Diodes 2 Vishay Semiconductors Taping of Diodes 2 AXIAL LEAD COMPONENTS Diodes and rectifiers with axial leads are normally delivered in taped form according to IEC 286-1 see figure 1 . The cathode side is designated by a colored tape. Taped devices
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09-Sep-08
marking code w2 sot323
marking code vishay label
marking code w2 sot23
MARKING W2 SOT23
SOD80 marking
DO214AC
DO219AB
DO35
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marking code w2 sot23
Abstract: MARKING W2 SOT23 SOD80 marking SOD64 DO214AC DO219AB DO35 DO41 W2 SOT23
Text: Taping of Diodes 1 Vishay Semiconductors Taping of Diodes 1 AXIAL LEAD COMPONENTS Diodes and rectifiers with axial leads are normally delivered in taped form according to IEC 286-1 see figure 1 . The cathode side is designated by a colored tape. Taped devices
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09-Sep-08
marking code w2 sot23
MARKING W2 SOT23
SOD80 marking
SOD64
DO214AC
DO219AB
DO35
DO41
W2 SOT23
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RF smd code SOT143 Package
Abstract: No abstract text available
Text: Vishay Telefunken Tape and Reel Standards Taping of RF Transistors and Diodes Taping of SMT Devices Vishay’s Transistors in SMD packages are available in an antistatic 8 mm blister tape in accordance with DIN IEC 268–3 for automatic component insertion. The blister tape is a plastic strip with impressed component
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OT143
OT143R
OT343
BFQ67-GS08
BFQ67-GS18
RF smd code SOT143 Package
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4001 smd
Abstract: BFQ67-GS08 diodes 4001
Text: Vishay Semiconductors Tape and Reel Standards Taping of RF Transistors and Diodes Taping of SMT Devices Vishay’s Transistors in SMD packages are available in an antistatic 8 mm blister tape in accordance with DIN IEC 268–3 for automatic component insertion. The blister tape is a plastic strip with impressed component
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OT143
OT143R
OT343
BFQ67-GS08
BFQ67-GS18
4001 smd
BFQ67-GS08
diodes 4001
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SMD Dioden
Abstract: sod-80 SMD MELF SMD melf smd dimensions diode melf smd smd-diodes 14 do-214aa DO-214AA package DIL-16 DO-214AA diode
Text: Packaging – Verpackungsvorschriften Taping of axial devices Gurtung axialer Bauelemente Most of Diotec’s diodes and rectifiers are supplied taped with marked polarity facing the same direction. For device dimensions refer to the relevant data sheet.
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DO-214AC
DO-214AA
SMD Dioden
sod-80 SMD
MELF SMD
melf smd dimensions
diode melf smd
smd-diodes
14 do-214aa
DO-214AA package
DIL-16
DO-214AA diode
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Untitled
Abstract: No abstract text available
Text: Variable Capacitance Diodes MA2Z377 MA377 Silicon epitaxial planar type Unit: mm 0.30+0.10 –0.05 For VCO of UHF band radio 5˚ (0.4) 1.7±0.10 • S-Mini type package, allowing downsizing of equipment and automatic insertion through the taping package
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MA2Z377
MA377)
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MA2S376
Abstract: No abstract text available
Text: Variable Capacitance Diodes MA2S376 Silicon epitaxial planar type Unit : mm For VCO of a UHF radio 0.15 min. + 0.05 • Small series resistance rD • SS-mini type package, allowing downsizing of equipment and automatic insertion through the taping package
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MA2S376
MA2S376
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SC-76A
Abstract: 76A marking MA2Z377 MA377 SC76A
Text: Variable Capacitance Diodes MA2Z377 MA377 Silicon epitaxial planar type Unit: mm 0.30+0.10 –0.05 For VCO of UHF band radio 5˚ • S-Mini type package, allowing downsizing of equipment and automatic insertion through the taping package (0.4) 1.7±0.10
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MA2Z377
MA377)
SC-76A
SC-76A
76A marking
MA2Z377
MA377
SC76A
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MA2Z377
Abstract: MA377 220VR
Text: Variable Capacitance Diodes MA2Z377 MA377 Silicon epitaxial planar type Unit: mm 0.30+0.10 –0.05 For VCO of UHF band radio 5˚ • S-Mini type package, allowing downsizing of equipment and automatic insertion through the taping package (0.4) 1.7±0.10
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MA2Z377
MA377)
MA2Z377
MA377
220VR
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MA2S376
Abstract: No abstract text available
Text: Variable Capacitance Diodes MA2S376 Silicon epitaxial planar type Unit : mm For VCO of a UHF radio 0.15 min. + 0.05 • Small series resistance rD • SS-mini type package, allowing downsizing of equipment and automatic insertion through the taping package
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MA2S376
MA2S376
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cd 4074 B
Abstract: MA2Z365 MA365
Text: Variable Capacitance Diodes MA2Z365 MA365 Silicon epitaxial planar type Unit : mm INDICATES CATHODE 2 + 0.1 1 • The largest capacitance ratio of 14 (CD(2V) / CD(25V) • S-mini type package, allowing downsizing of equipment and automatic insertion through the taping package
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MA2Z365
MA365)
cd 4074 B
MA2Z365
MA365
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Untitled
Abstract: No abstract text available
Text: MA111 Band Switching Diodes MA80WA, MA80WK Silicon epitaxial planer type Unit : mm For band switching 2.1±0.1 voltage dependence of diode capacity CD ● S-Mini package, with two elements incorporated enabling down-siz- ing of the equipment and automatic insertion through taping
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MA111
MA80WA
MA80WK
SC-70
MA80WA,
100MHz
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MA2Z376
Abstract: MA376
Text: Variable Capacitance Diodes MA2Z376 MA376 Silicon epitaxial planar type Unit: mm 0.30+0.10 –0.05 For VCO of UHF band radio 5˚ • Small series resistance rD • S-Mini type package, allowing downsizing of equipment and automatic insertion through the taping package
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MA2Z376
MA376)
MA2Z376
MA376
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Untitled
Abstract: No abstract text available
Text: Standard Taping Specifications 1. Features of Standard Taping Specifications H itach i silico n diode taping sp ecificatio n s are classified into three major categories according to the types o f automatic mounting machines of set manufacturers. 1 Horizontal type taping
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Untitled
Abstract: No abstract text available
Text: SANYO Taping S p e c i f i c a t i o n of Diodes CD Axial taping w Taping Suffix Pack ing 26 BT Box for zigzag bended type 52 ATI Box for zigzag bended type 5, OOOPcs/box 3 , OOOPcs/box) GMA01-BT DSF10TB-AT1 CP type taping o o o TB TA TA T w o - o u t e r - 1eads on the hole side
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GMA01-BT
DSF10TB-AT1
DCA010-TA
DCF010-Q
DSA14E-TR
500Pcs/reelj
750Pcs/ree1
DBB08)
DBB08E-TM
750Pcs/reel)
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Untitled
Abstract: No abstract text available
Text: SAfiYO Taping S p e c i f i c a t i o n CD Axial of Diodes taping Taping S u f f i x 1? 26mm BT 52mm ATI Pack i ng Box f o r z i g z a g bended type Box f o r bended type zigzag BT or AT 1 : 3 , O O O p c s / 5 , 0 0 0 p c s / b o x . CD CP t y pe taping o
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LFB01-
DSA14E-
500Pcs/ree1
750Pcs/reel
DBB08C-TM
750Pc
MT9E0125TR
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Untitled
Abstract: No abstract text available
Text: TAPING STYLE OF K & T-PACK TYPE DIODES DIMENSIONS OF TAPING K-PACK STYLE Symbol Dimensions 6.8 ±0.1 B 10.1 ±0.1 Ko 2.8 ±0.1 P1 8.0 ±0.1 + Do + 1.5 ±0.1 Po 4.0 ± 0.1 E 1.75 ±0.1 P2 2.0 ±0.1 F 7.5 ±0.1 W1 13.3 ±0.1 W 16.0 ±0.3 T 0.2 ±0.05 K1 3.0 ±0.1
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MS5C7854
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Untitled
Abstract: No abstract text available
Text: TAPING STYLE OF SC TYPE DIODES Symbol 2 . 6 5+0.1 A2 1.8 +0.l Bl 5.6 ±0.l B2 3.15±0.l K o 2.7 +0.1 PI 4.0 +0.1 > D o DIMENSIONS OP TAPING Dimensions and Angle A1 <§ Po *1.5 ± 1 - 1 P 0 4.0 ±0.1 E 1.75+0.1 P2 2.0 ±0.05 F 5.5 ±0.05 W1 9.5 ± ; - 3 W
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MS5C7853
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Untitled
Abstract: No abstract text available
Text: URFACE-MOUNT DEVICES ECTIFIER DIODES POWER TRANSISTORS OWER MOSFET IDAC SURGE ABSORBERS POWER ICs OUTLINE DIMENSIONS BASIC ORDERING QUANTITIES AND PACKING FORM Code No. Taping STANDARD FORMING LIST OF DISCONTINUED PARTS
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list zener
Abstract: No abstract text available
Text: Contents Page List of Types 4 Alphanumerical List of Types 5 Technical Information 7 Packaging & Taping 22 Small Signal Diodes 27 Tuner Diodes 81 Schottky Diodes 102 Dual Zener Diodes 139 Zener Diodes 144 Voltage Stabilizers 223 Addresses 235 3
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Untitled
Abstract: No abstract text available
Text: SURFACE-MOUNT DEVICES RECTIFIER DIODES "W E R TRANSISTORS OWER MOSFET SIDAC SURGE ABSORBERS OWER ICs 'UTLINE DIMENSIONS BASIC ORDERING QUANTITIES AND PACKING FORM Code No. Taping STANDARD FORMING LIST OF DISCONTINUED PARTS
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