TAPE AND REEL BGA 6X6 Search Results
TAPE AND REEL BGA 6X6 Result Highlights (4)
Part | ECAD Model | Manufacturer | Description | Download | Buy |
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OP177GSZ-REEL |
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OP177GS WITH TAPE AND REEL |
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OP249GSZ-REEL |
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OP249GS W/TAPE AND REEL |
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SMP04ESZ-REEL |
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SMP04ES W/TAPE AND REEL |
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OP249GSZ-REEL7 |
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OP249GS W/TAPE AND REEL |
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TAPE AND REEL BGA 6X6 Datasheets Context Search
Catalog Datasheet | MFG & Type | Document Tags | |
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577ns
Abstract: FIN212AC
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FIN212AC 12-Bit 40MHz 32-Terminal 42-Ball FIN212ACMLX FIN212ACGFX 577ns | |
TQFN 48 7X7
Abstract: QFN 5X5 tqfp 7x7 40 TQFN 5x5 LGA 4x5 bga 10x10 35x35 bga qfn 68 10x10 TQFP 14X20 qfn 8x8 reel
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10x10 25x25 10K/Reel TQFN 48 7X7 QFN 5X5 tqfp 7x7 40 TQFN 5x5 LGA 4x5 bga 10x10 35x35 bga qfn 68 10x10 TQFP 14X20 qfn 8x8 reel | |
AD5820
Abstract: ad6548
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T03762-0-1/13 AD5820 ad6548 | |
Untitled
Abstract: No abstract text available
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FIN212AC 12-Bit 12-Bit 40MHz 32-Terminal 42-Ball FIN212ACMLX FIN212ACGFX | |
PCB design for very fine pitch csp package
Abstract: Senju 179GHH 37K-1 B12-246 Modified Coffin-Manson Equation Calculations Senju metal solder paste 160 e7 Semicon volume 1 SSYZ015A
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SSYZ015A PCB design for very fine pitch csp package Senju 179GHH 37K-1 B12-246 Modified Coffin-Manson Equation Calculations Senju metal solder paste 160 e7 Semicon volume 1 SSYZ015A | |
DP1211
Abstract: 337 BGA footprint FIN212AC
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FIN212AC 12-Bit 40MHz 48MHz 32-Terminal 42-Ball FIN212ACMLX DP1211 337 BGA footprint | |
FIN212AC
Abstract: 30 pin flex cable lcd 5M cmos camera ipc-SM-782 mobile camera interface microcontroller DSO20 FIN212ACGFX FIN212ACMLX JESD22-A114 dsi LCD driver
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FIN212AC 12-Bit 12-Bit 40MHz 32-Terminal 42-Ball FIN212ACMLX FIN212ACGFX FIN212AC 30 pin flex cable lcd 5M cmos camera ipc-SM-782 mobile camera interface microcontroller DSO20 FIN212ACGFX FIN212ACMLX JESD22-A114 dsi LCD driver | |
smd transistor mark E13
Abstract: Modified Coffin-Manson Equation Calculations senju solder paste m10 f12 A10D10 P6K6 BGA reflow guide Senju metal flux T5 k5m6 K793 T4V4
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SSYZ015B smd transistor mark E13 Modified Coffin-Manson Equation Calculations senju solder paste m10 f12 A10D10 P6K6 BGA reflow guide Senju metal flux T5 k5m6 K793 T4V4 | |
Untitled
Abstract: No abstract text available
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FIN212AC 12-Bit FIN212AC | |
FIN212AC
Abstract: 5M cmos camera AN-5058 AN-5061 DP10 FIN212ACBFX FIN212ACGFX FIN212ACMLX MO-195 MO-220
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FIN212AC 12-Bit FIN212AC 5M cmos camera AN-5058 AN-5061 DP10 FIN212ACBFX FIN212ACGFX FIN212ACMLX MO-195 MO-220 | |
FIN212AC
Abstract: No abstract text available
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FIN212AC 12-Bit FIN212AC 42-Ball, 36-Ball, | |
xilinx topside marking
Abstract: xilinx part marking pcb footprint FS48, and FSG48 smd code v36 CF1752 reballing recommended layout CSG324 BGA reflow guide XC2VP7 reflow profile SMD MARKING CODE C1G
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UG112 UG072, UG075, XAPP427, xilinx topside marking xilinx part marking pcb footprint FS48, and FSG48 smd code v36 CF1752 reballing recommended layout CSG324 BGA reflow guide XC2VP7 reflow profile SMD MARKING CODE C1G | |
BFG95
Abstract: No abstract text available
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UG112 UG072, UG075, XAPP427, BFG95 | |
BlueCore5
Abstract: BLUECORE 4 EXT bcore-sp-005P CSR BC05 circuit diagram of bluetooth fm transmitter bcore-sp-003P BLUECORE5-fm CS-101482-SPP BCCMD bluetooth BC05 edr rs232
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CS-101570-DSP4 CS-101570-DSP8 BlueCore5 BLUECORE 4 EXT bcore-sp-005P CSR BC05 circuit diagram of bluetooth fm transmitter bcore-sp-003P BLUECORE5-fm CS-101482-SPP BCCMD bluetooth BC05 edr rs232 | |
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qfn 3x3 tray dimension
Abstract: XCDAISY BFG95 XC5VLX330T-1FF1738I pcb footprint FS48, and FSG48 WS609 jedec so8 Wire bond gap XC3S400AN-4FG400I FFG676 XC4VLX25 cmos 668 fcbga
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UG112 UG072, UG075, XAPP427, qfn 3x3 tray dimension XCDAISY BFG95 XC5VLX330T-1FF1738I pcb footprint FS48, and FSG48 WS609 jedec so8 Wire bond gap XC3S400AN-4FG400I FFG676 XC4VLX25 cmos 668 fcbga | |
xilinx part marking
Abstract: xilinx topside marking UG112 qfn 3x3 tray dimension FGG484 HQG160 reballing top marking 957 so8 FF1148 fcBGA PACKAGE thermal resistance
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UG112 UG072, UG075, XAPP427, xilinx part marking xilinx topside marking UG112 qfn 3x3 tray dimension FGG484 HQG160 reballing top marking 957 so8 FF1148 fcBGA PACKAGE thermal resistance | |
XILINX/part marking Hot
Abstract: SMT, FPGA FINE PITCH BGA 456 BALL PC84/PCG84 XCDAISY TT 2076 XC2VP7 reflow profile SPARTAN-II xc2s50 pq208 sn63pb37 solder SPHERES qfn 3x3 tray dimension HQG160
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UG112 UG072, UG075, XAPP427, XILINX/part marking Hot SMT, FPGA FINE PITCH BGA 456 BALL PC84/PCG84 XCDAISY TT 2076 XC2VP7 reflow profile SPARTAN-II xc2s50 pq208 sn63pb37 solder SPHERES qfn 3x3 tray dimension HQG160 | |
FIN210AC
Abstract: 13M-pixel Dp 104 DSO20 FIN210 FIN210ACGFX FIN210ACMLX JESD22-A114 337 BGA footprint PWS1.1
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FIN210AC 10-Bit 48MHz 10-bit 32-Terminal 42-Ball FIN210ACMLX FIN210ACGFX FIN210AC 13M-pixel Dp 104 DSO20 FIN210 FIN210ACGFX FIN210ACMLX JESD22-A114 337 BGA footprint PWS1.1 | |
Dp 104
Abstract: 30 pin flex cable lcd mobile camera interface microcontroller DSO20 FIN210 FIN210AC FIN210ACGFX FIN210ACMLX JESD22-A114 PWS1.1
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FIN210AC 10-Bit 48MHz 10-bit 32-Terminal 42-Ball FIN210ACMLX FIN210ACGFX Dp 104 30 pin flex cable lcd mobile camera interface microcontroller DSO20 FIN210 FIN210AC FIN210ACGFX FIN210ACMLX JESD22-A114 PWS1.1 | |
Untitled
Abstract: No abstract text available
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FIN210AC 10-Bit 48MHz 10-bit 32-Terminal 42-Ball FIN210ACMLX FIN210ACGFX | |
35x45mm
Abstract: 6X6 mlp
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FIN212AC 12-Bit FIN212AC 35x45mm 6X6 mlp | |
Untitled
Abstract: No abstract text available
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FIN212AC 12-Bit FIN212AC 32-Lead, 42-Ball, | |
FIN212AC
Abstract: FIN212ACGFX FIN212ACMLX MO-195 MO-220 AN-5058 AN-5061 13M-pixel
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FIN212AC 12-Bit FIN212AC FIN212ACGFX FIN212ACMLX MO-195 MO-220 AN-5058 AN-5061 13M-pixel | |
BGA 64 PACKAGE thermal resistance
Abstract: FCCSP CABGA 6x6 amkor flip fcBGA PACKAGE thermal resistance bga 9x9 Shipping Trays CABGA 8X8 BGA 256 PACKAGE power dissipation BGA 256 PACKAGE thermal resistance BGA45
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63Sn/37Pb) BGA 64 PACKAGE thermal resistance FCCSP CABGA 6x6 amkor flip fcBGA PACKAGE thermal resistance bga 9x9 Shipping Trays CABGA 8X8 BGA 256 PACKAGE power dissipation BGA 256 PACKAGE thermal resistance BGA45 |