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    TAPE AND REEL BGA 6X6 Search Results

    TAPE AND REEL BGA 6X6 Result Highlights (4)

    Part ECAD Model Manufacturer Description Download Buy
    OP177GSZ-REEL Analog Devices OP177GS WITH TAPE AND REEL Visit Analog Devices Buy
    OP249GSZ-REEL Analog Devices OP249GS W/TAPE AND REEL Visit Analog Devices Buy
    SMP04ESZ-REEL Analog Devices SMP04ES W/TAPE AND REEL Visit Analog Devices Buy
    OP249GSZ-REEL7 Analog Devices OP249GS W/TAPE AND REEL Visit Analog Devices Buy

    TAPE AND REEL BGA 6X6 Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    577ns

    Abstract: FIN212AC
    Text: FIN212AC 12-Bit Serializer / Deserializer Supporting Cameras and Small Displays Features Data & Control Bits Frequency Capability Interface µController Usage Selectable Edge Rates Standby Current Core Voltage VDDA/S I/O Voltage (VDDP) ESD (I/O to GND) Package


    Original     		PDF FIN212AC 12-Bit 40MHz 32-Terminal 42-Ball FIN212ACMLX FIN212ACGFX 577ns

    TQFN 48 7X7

    Abstract: QFN 5X5 tqfp 7x7 40 TQFN 5x5 LGA 4x5 bga 10x10 35x35 bga qfn 68 10x10 TQFP 14X20 qfn 8x8 reel
    Text: TAPE AND REEL PACKAGING DEVICE TYPE BODY SIZE PIN COUNT TAPE WIDTH TAPE PITCH REEL SIZE QUANTITY PER REEL ORIENTATION IN TAPE SOIC .150 8 12mm 8mm 13 inch 2500 FIGURE 2 SOIC .150 14 16mm 8mm 13 inch 2500 FIGURE 2 SOIC .150 16 16mm 8mm 13 inch 2500 FIGURE 2


    Original     		PDF 10x10 25x25 10K/Reel TQFN 48 7X7 QFN 5X5 tqfp 7x7 40 TQFN 5x5 LGA 4x5 bga 10x10 35x35 bga qfn 68 10x10 TQFP 14X20 qfn 8x8 reel

    AD5820

    Abstract: ad6548
    Text: Tape and Reel Packaging Introduction Specifications The electronics industry is making a tremendous investment in surfacemount technology. The reasons for this investment include cost savings resulting from automated component placement and increased density


    Original     		PDF T03762-0-1/13 AD5820 ad6548

    Untitled

    Abstract: No abstract text available
    Text: FIN212AC 12-Bit Serializer / Deserializer Supporting Cameras and Small Displays Description Features Data & Control Bits Frequency Capability Interface µController Usage Selectable Edge Rates Standby Current Core Voltage VDDA/S I/O Voltage (VDDP) ESD (I/O to GND)


    Original     		PDF FIN212AC 12-Bit 12-Bit 40MHz 32-Terminal 42-Ball FIN212ACMLX FIN212ACGFX

    PCB design for very fine pitch csp package

    Abstract: Senju 179GHH 37K-1 B12-246 Modified Coffin-Manson Equation Calculations Senju metal solder paste 160 e7 Semicon volume 1 SSYZ015A
    Text: MicroStar BGAt Packaging Reference Guide Literature Number: SSYZ015A Second Edition – September 1999 MicroStar BGA is a trademark of Texas Instruments Incorporated. Printed on Recycled Paper IMPORTANT NOTICE Texas Instruments and its subsidiaries TI reserve the right to make changes to their products or to discontinue


    Original     		PDF SSYZ015A PCB design for very fine pitch csp package Senju 179GHH 37K-1 B12-246 Modified Coffin-Manson Equation Calculations Senju metal solder paste 160 e7 Semicon volume 1 SSYZ015A

    DP1211

    Abstract: 337 BGA footprint FIN212AC
    Text: FIN212AC 12-Bit Serializer / Deserializer Supporting Cameras and Small Displays Features Data & Control Bits Frequency Capability Interface µController Usage Selectable Edge Rates Standby Current Core Voltage VDDA/S I/O Voltage (VDDP) ESD (I/O to GND) Package


    Original     		PDF FIN212AC 12-Bit 40MHz 48MHz 32-Terminal 42-Ball FIN212ACMLX DP1211 337 BGA footprint

    FIN212AC

    Abstract: 30 pin flex cable lcd 5M cmos camera ipc-SM-782 mobile camera interface microcontroller DSO20 FIN212ACGFX FIN212ACMLX JESD22-A114 dsi LCD driver
    Text: FIN212AC 12-Bit Serializer / Deserializer Supporting Cameras and Small Displays Features Data & Control Bits Frequency Capability Interface µController Usage Selectable Edge Rates Standby Current Core Voltage VDDA/S I/O Voltage (VDDP) ESD (I/O to GND) Package


    Original     		PDF FIN212AC 12-Bit 12-Bit 40MHz 32-Terminal 42-Ball FIN212ACMLX FIN212ACGFX FIN212AC 30 pin flex cable lcd 5M cmos camera ipc-SM-782 mobile camera interface microcontroller DSO20 FIN212ACGFX FIN212ACMLX JESD22-A114 dsi LCD driver

    smd transistor mark E13

    Abstract: Modified Coffin-Manson Equation Calculations senju solder paste m10 f12 A10D10 P6K6 BGA reflow guide Senju metal flux T5 k5m6 K793 T4V4
    Text: MicroStar BGAt Packaging Reference Guide Literature Number: SSYZ015B Third Edition – September 2000 MicroStar BGA is a trademark of Texas Instruments Incorporated. Printed on Recycled Paper IMPORTANT NOTICE Texas Instruments and its subsidiaries TI reserve the right to make changes to their products or to discontinue


    Original     		PDF SSYZ015B smd transistor mark E13 Modified Coffin-Manson Equation Calculations senju solder paste m10 f12 A10D10 P6K6 BGA reflow guide Senju metal flux T5 k5m6 K793 T4V4

    Untitled

    Abstract: No abstract text available
    Text: Click to see this datasheet in Simplified Chinese! FIN212AC 12-Bit Serializer Deserializer with Multiple Frequency Ranges Features ƒ Low Power Consumption ƒ Low Power, Proprietary, CTL I/O Serial Interface ƒ Wide PLL Input Frequency Range ƒ Wide Parallel Supply Voltage Range: 1.65 to 3.6V


    Original     		PDF FIN212AC 12-Bit FIN212AC

    FIN212AC

    Abstract: 5M cmos camera AN-5058 AN-5061 DP10 FIN212ACBFX FIN212ACGFX FIN212ACMLX MO-195 MO-220
    Text: Click to see this datasheet in Simplified Chinese! FIN212AC 12-Bit Serializer Deserializer with Multiple Frequency Ranges Features ƒ Low Power Consumption ƒ Low Power, Proprietary, CTL I/O Serial Interface ƒ Wide PLL Input Frequency Range ƒ Wide Parallel Supply Voltage Range: 1.65 to 3.6V


    Original     		PDF FIN212AC 12-Bit FIN212AC 5M cmos camera AN-5058 AN-5061 DP10 FIN212ACBFX FIN212ACGFX FIN212ACMLX MO-195 MO-220

    FIN212AC

    Abstract: No abstract text available
    Text: FIN212AC 12-Bit Serializer Deserializer with Multiple Frequency Ranges Features Description ƒ ƒ ƒ ƒ ƒ ƒ Low Power Consumption The FIN212AC µSerDes is a low-power serializer / deserializer optimized for use in cell phone displays and camera paths. The device reduces a 12-bit data path to


    Original     		PDF FIN212AC 12-Bit FIN212AC 42-Ball, 36-Ball,

    xilinx topside marking

    Abstract: xilinx part marking pcb footprint FS48, and FSG48 smd code v36 CF1752 reballing recommended layout CSG324 BGA reflow guide XC2VP7 reflow profile SMD MARKING CODE C1G
    Text: Device Package User Guide [Guide Subtitle] [optional] UG112 v3.6 September 22, 2010 [optional] R R Xilinx is disclosing this user guide, manual, release note, and/or specification (the "Documentation") to you solely for use in the development of designs to operate with Xilinx hardware devices. You may not reproduce, distribute, republish, download, display, post, or transmit the


    Original     		PDF UG112 UG072, UG075, XAPP427, xilinx topside marking xilinx part marking pcb footprint FS48, and FSG48 smd code v36 CF1752 reballing recommended layout CSG324 BGA reflow guide XC2VP7 reflow profile SMD MARKING CODE C1G

    BFG95

    Abstract: No abstract text available
    Text: Device Package User Guide UG112 v3.7 September 5, 2012 R R Notice of Disclaimer The information disclosed to you hereunder (the “Materials”) is provided solely for the selection and use of Xilinx products. To the maximum extent permitted by applicable law: (1) Materials are made available "AS IS" and with all faults, Xilinx hereby DISCLAIMS ALL


    Original     		PDF UG112 UG072, UG075, XAPP427, BFG95

    BlueCore5

    Abstract: BLUECORE 4 EXT bcore-sp-005P CSR BC05 circuit diagram of bluetooth fm transmitter bcore-sp-003P BLUECORE5-fm CS-101482-SPP BCCMD bluetooth BC05 edr rs232
    Text: Features ƒ ƒ ƒ ƒ ƒ ƒ ƒ Single Chip Bluetooth v2.1 + EDR System Fully Qualified Bluetooth v2.1 + EDR system Integrated FM Radio Receiver with RDS Demodulator Stereo Audio Output Stage Full-speed Bluetooth Operation with Full Piconet Support Scatternet Support


    Original     		PDF CS-101570-DSP4 CS-101570-DSP8 BlueCore5 BLUECORE 4 EXT bcore-sp-005P CSR BC05 circuit diagram of bluetooth fm transmitter bcore-sp-003P BLUECORE5-fm CS-101482-SPP BCCMD bluetooth BC05 edr rs232

    qfn 3x3 tray dimension

    Abstract: XCDAISY BFG95 XC5VLX330T-1FF1738I pcb footprint FS48, and FSG48 WS609 jedec so8 Wire bond gap XC3S400AN-4FG400I FFG676 XC4VLX25 cmos 668 fcbga
    Text: Device Package User Guide [Guide Subtitle] [optional] UG112 v3.5 November 6, 2009 [optional] R R Xilinx is disclosing this user guide, manual, release note, and/or specification (the "Documentation") to you solely for use in the development of designs to operate with Xilinx hardware devices. You may not reproduce, distribute, republish, download, display, post, or transmit the


    Original     		PDF UG112 UG072, UG075, XAPP427, qfn 3x3 tray dimension XCDAISY BFG95 XC5VLX330T-1FF1738I pcb footprint FS48, and FSG48 WS609 jedec so8 Wire bond gap XC3S400AN-4FG400I FFG676 XC4VLX25 cmos 668 fcbga

    xilinx part marking

    Abstract: xilinx topside marking UG112 qfn 3x3 tray dimension FGG484 HQG160 reballing top marking 957 so8 FF1148 fcBGA PACKAGE thermal resistance
    Text: Device Package User Guide [Guide Subtitle] [optional] UG112 v3.2 March 17, 2009 [optional] R R Xilinx is disclosing this user guide, manual, release note, and/or specification (the "Documentation") to you solely for use in the development of designs to operate with Xilinx hardware devices. You may not reproduce, distribute, republish, download, display, post, or transmit the


    Original     		PDF UG112 UG072, UG075, XAPP427, xilinx part marking xilinx topside marking UG112 qfn 3x3 tray dimension FGG484 HQG160 reballing top marking 957 so8 FF1148 fcBGA PACKAGE thermal resistance

    XILINX/part marking Hot

    Abstract: SMT, FPGA FINE PITCH BGA 456 BALL PC84/PCG84 XCDAISY TT 2076 XC2VP7 reflow profile SPARTAN-II xc2s50 pq208 sn63pb37 solder SPHERES qfn 3x3 tray dimension HQG160
    Text: Device Package User Guide [Guide Subtitle] [optional] UG112 v3.4 June 10, 2009 [optional] R R Xilinx is disclosing this user guide, manual, release note, and/or specification (the "Documentation") to you solely for use in the development of designs to operate with Xilinx hardware devices. You may not reproduce, distribute, republish, download, display, post, or transmit the


    Original     		PDF UG112 UG072, UG075, XAPP427, XILINX/part marking Hot SMT, FPGA FINE PITCH BGA 456 BALL PC84/PCG84 XCDAISY TT 2076 XC2VP7 reflow profile SPARTAN-II xc2s50 pq208 sn63pb37 solder SPHERES qfn 3x3 tray dimension HQG160

    FIN210AC

    Abstract: 13M-pixel Dp 104 DSO20 FIN210 FIN210ACGFX FIN210ACMLX JESD22-A114 337 BGA footprint PWS1.1
    Text: FIN210AC 10-Bit Serializer / Deserializer Supporting Cameras and Small Displays up to 48MHz Features Data & Control Bits Frequency Capability Interface µController Usage Selectable Edge Rates Standby Current Core Voltage VDDA/S I/O Voltage (VDDP) ESD (I/O to GND)


    Original     		PDF FIN210AC 10-Bit 48MHz 10-bit 32-Terminal 42-Ball FIN210ACMLX FIN210ACGFX FIN210AC 13M-pixel Dp 104 DSO20 FIN210 FIN210ACGFX FIN210ACMLX JESD22-A114 337 BGA footprint PWS1.1

    Dp 104

    Abstract: 30 pin flex cable lcd mobile camera interface microcontroller DSO20 FIN210 FIN210AC FIN210ACGFX FIN210ACMLX JESD22-A114 PWS1.1
    Text: FIN210AC 10-Bit Serializer / Deserializer Supporting Cameras and Small Displays up to 48MHz Features Data & Control Bits Frequency Capability Interface µController Usage Selectable Edge Rates Standby Current Core Voltage VDDA/S I/O Voltage (VDDP) ESD (I/O to GND)


    Original     		PDF FIN210AC 10-Bit 48MHz 10-bit 32-Terminal 42-Ball FIN210ACMLX FIN210ACGFX Dp 104 30 pin flex cable lcd mobile camera interface microcontroller DSO20 FIN210 FIN210AC FIN210ACGFX FIN210ACMLX JESD22-A114 PWS1.1

    Untitled

    Abstract: No abstract text available
    Text: FIN210AC 10-Bit Serializer / Deserializer Supporting Cameras and Small Displays up to 48MHz Description Features Data & Control Bits Frequency Capability Interface µController Usage Selectable Edge Rates Standby Current Core Voltage VDDA/S I/O Voltage (VDDP)


    Original     		PDF FIN210AC 10-Bit 48MHz 10-bit 32-Terminal 42-Ball FIN210ACMLX FIN210ACGFX

    35x45mm

    Abstract: 6X6 mlp
    Text: FIN212AC 12-Bit Serializer Deserializer with Multiple Frequency Ranges Features Description ƒ ƒ ƒ ƒ ƒ ƒ Low Power Consumption The FIN212AC µSerDes is a low-power serializer / deserializer optimized for use in cell phone displays and camera paths. The device reduces a 12-bit data path to


    Original     		PDF FIN212AC 12-Bit FIN212AC 35x45mm 6X6 mlp

    Untitled

    Abstract: No abstract text available
    Text: FIN212AC 12-Bit Serializer Deserializer with Multiple Frequency Ranges Features Description ƒ ƒ ƒ ƒ ƒ ƒ Low Power Consumption The FIN212AC µSerDes is a low-power serializer / deserializer optimized for use in cell phone displays and camera paths. The device reduces a 12-bit data path to


    Original     		PDF FIN212AC 12-Bit FIN212AC 32-Lead, 42-Ball,

    FIN212AC

    Abstract: FIN212ACGFX FIN212ACMLX MO-195 MO-220 AN-5058 AN-5061 13M-pixel
    Text: FIN212AC 12-Bit Serializer Deserializer with Multiple Frequency Ranges Features Description ƒ ƒ ƒ ƒ ƒ ƒ Low Power Consumption The FIN212AC µSerDes is a low-power serializer / deserializer optimized for use in cell phone displays and camera paths. The device reduces a 12-bit data path to


    Original     		PDF FIN212AC 12-Bit FIN212AC FIN212ACGFX FIN212ACMLX MO-195 MO-220 AN-5058 AN-5061 13M-pixel

    BGA 64 PACKAGE thermal resistance

    Abstract: FCCSP CABGA 6x6 amkor flip fcBGA PACKAGE thermal resistance bga 9x9 Shipping Trays CABGA 8X8 BGA 256 PACKAGE power dissipation BGA 256 PACKAGE thermal resistance BGA45
    Text: LAMINATE data sheet fcCSP Features: fcCSP Packages: Amkor Technology is now offering the Flip Chip CSP fcCSP package — a flip chip solution in a CSP package format. This package construction utilizes eutectic tin/lead (63Sn/37Pb) flip chip interconnect


    Original     		PDF 63Sn/37Pb) BGA 64 PACKAGE thermal resistance FCCSP CABGA 6x6 amkor flip fcBGA PACKAGE thermal resistance bga 9x9 Shipping Trays CABGA 8X8 BGA 256 PACKAGE power dissipation BGA 256 PACKAGE thermal resistance BGA45