BGA 328
Abstract: No abstract text available
Text: u Chapter 8 Tape and Reel CHAPTER 8 TAPE AND REEL Introduction Design and Materials Device Count per Reel Reel Dimensions and Labels Tape Dimensions Packages and Packing Publication Revision A 3/1/03 8-1 u Chapter 8 Tape and Reel INTRODUCTION AMD offers a tape-and-reel packing container for PLCC, SOIC,
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44-Lead
48-Lead
80-Lead
BGA 328
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LGA 1150
Abstract: No abstract text available
Text: CSP TAPE & REEL Chip Scale Packages for Memory Products Tape and Reel Shipping Media INTRODUCTION Surface mounting packages can be supplied with Tape and Reel packing. The reels are standard 330mm diameter and contain between 250 and 2500 devices. The packages supplied on Tape and Reel are listed in Table 1 that shows the Tape Width and Part Pitch
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330mm
LGA 1150
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Untitled
Abstract: No abstract text available
Text: CSP TAPE & REEL Chip Scale Packages for Memory Products Tape and Reel Shipping Media INTRODUCTION Surface mounting packages can be supplied with Tape and Reel packing. The reels are standard 330mm diameter and contain between 250 and 2500 devices. The packages supplied on Tape and Reel are listed in Table 1 that shows the Tape Width and Part Pitch
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330mm
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639X
Abstract: LGA 1150
Text: CSP TAPE & REEL Chip Scale Packages for Memory Products Tape and Reel Shipping Media INTRODUCTION Surface mounting packages can be supplied with Tape and Reel packing. The reels are standard 330mm diameter 150mm for SBGA and contain between 250 and 2500 devices.
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330mm
150mm
639X
LGA 1150
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MO-205
Abstract: TAPE AND REEL BGA 54-BALL
Text: Revised May 2001 BGA Tape and Reel Specifications Tape and Reel Quantities Package Code GX Package Description Package Drawing Number Tape and Reel Container Quantity 54-Ball Fine-Pitch Ball Grid Array FBGA , JEDEC MO-205, 5.5mm Wide BGA54A 2500 96-Ball Fine-Pitch Ball Grid Array (FBGA), JEDEC MO-205, 5.5mm Wide
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BGA54A
96-Ball
MO-205,
BGA96A
114-Ball
54-Ball
BGA114A
MO-205
TAPE AND REEL BGA
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Untitled
Abstract: No abstract text available
Text: Technical Brief 347 Tape and Reel Specification for Integrated Circuits Introduction Many Surface Mounted Devices SMDs are being packaged for shipment in embossed tape and wound onto reels. The Intersil tape and reel specifications are in compliance with
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EIA-481
TB347
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948D
Abstract: FC-09A
Text: FC-09A 2 x 2 mm MOSFET BGA Tape and Reel Dimensions FC-09A MOSFET BGA Packaging Configuration: Figure 1 Packaging Description: FC-09A MOSFET BGA parts are shipped in tape and reel. The carrier tape is made from a dissipative carbon filled polycarbonate resin. The cover tape is a multilayer film
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FC-09A
177cm
948D
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948d
Abstract: No abstract text available
Text: FC-12A 2 x 2.5 mm MOSFET BGA Tape and Reel Dimensions FC-12A MOSFET BGA Packaging Configuration: Figure 1 Packaging Description: FC-12A MOSFET BGA parts are shipped in tape and reel. The carrier tape is made from a dissipative carbon filled polycarbonate resin. The cover tape is a multilayer film
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FC-12A
177cm
948d
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QFn 64 tape carrier
Abstract: Techwell 7x7x1 TB347 MO-169 1748 QFN
Text: Technical Brief 347 Author: Laszlo Nemeth Tape and Reel Specification for Integrated Circuits Introduction Many surface mounted devices SMD are being packaged for shipment in embossed tape and wound onto reels. The Intersil Tape and Reel specifications are in compliance with
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EIA-481
TB347
QFn 64 tape carrier
Techwell
7x7x1
MO-169
1748 QFN
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f948
Abstract: F63TNR FDZ6966
Text: FC-12A 2 x 2.5 mm MOSFET BGA with 12 balls Tape and Reel Data FC-12A MOSFET BGA Packaging Configuration: Figure 1.0 Moisture Sensitive Sticker Packaging Description: FC-12A MOSFET BGA parts are shipped in tape and reel. The carrier tape is made from a dissipative carbon filled
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FC-12A
177cm
f948
F63TNR
FDZ6966
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FC-09A
Abstract: f948 F63TNR FDZ6966 corrugated box spec
Text: FC-09A 2 x 2 mm MOSFET BGA with 9 balls Tape and Reel Data FC-09A MOSFET BGA Packaging Configuration: Figure 1.0 Moisture Sensitive Sticker Packaging Description: FC-09A MOSFET BGA parts are shipped in tape and reel. The carrier tape is made from a dissipative carbon filled
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FC-09A
177cm
f948
F63TNR
FDZ6966
corrugated box spec
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TQFN 48 7X7
Abstract: QFN 5X5 tqfp 7x7 40 TQFN 5x5 LGA 4x5 bga 10x10 35x35 bga qfn 68 10x10 TQFP 14X20 qfn 8x8 reel
Text: TAPE AND REEL PACKAGING DEVICE TYPE BODY SIZE PIN COUNT TAPE WIDTH TAPE PITCH REEL SIZE QUANTITY PER REEL ORIENTATION IN TAPE SOIC .150 8 12mm 8mm 13 inch 2500 FIGURE 2 SOIC .150 14 16mm 8mm 13 inch 2500 FIGURE 2 SOIC .150 16 16mm 8mm 13 inch 2500 FIGURE 2
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10x10
25x25
10K/Reel
TQFN 48 7X7
QFN 5X5
tqfp 7x7
40 TQFN 5x5
LGA 4x5
bga 10x10
35x35 bga
qfn 68 10x10
TQFP 14X20
qfn 8x8 reel
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SM-69
Abstract: ods-1072 ODS-1079 ODS-1306 PQFN-12 sm2 1056 SOIC-AC90 W1 sot 363 M513 SM-46
Text: Tape and Reel Packaging for Surface Mount Components M513 V11 Introduction M/A-COM supplies integrated circuits, diodes, and related surface mount components in tape wound on standard 7-inch, 8-inch, 10-inch, and 13-inch diameter reels. This application note documents the reel and tape
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10-inch,
13-inch
08-mm
15-mm
PQFN-12,
MO-220,
PQFN-16,
PQFN-20,
SM-69
ods-1072
ODS-1079
ODS-1306
PQFN-12
sm2 1056
SOIC-AC90
W1 sot 363
M513
SM-46
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ods-1072
Abstract: SM-69 ODS-1056 VHHC W1 sot 363 M513 MO-220 MSOP-10 PQFN-12 ODS-54
Text: Tape and Reel Packaging for Surface Mount Components M513 V9 Introduction M/A-COM supplies integrated circuits, diodes, and related surface mount components in tape wound on standard 7-inch, 8-inch, 10-inch, and 13-inch diameter reels. This application note documents the reel and tape
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10-inch,
13-inch
08-mm
15-mm
PQFN-12,
MO-220,
PQFN-16,
PQFN-20,
ods-1072
SM-69
ODS-1056
VHHC
W1 sot 363
M513
MO-220
MSOP-10
PQFN-12
ODS-54
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Untitled
Abstract: No abstract text available
Text: Tape and Reel Specifications Description Loading the Reel Surface-mounted devices are packaged in embossed tape and wound onto reels for shipment in compliance with Electronics Industries Association Standard EIA-481 Rev. A. Empty pockets are not permitted between the first and last
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EIA-481
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intel 04195
Abstract: BGA package tray 40 x 40 uBGA device MARKing intel F800B3 T1234567 04195 Material Handling Systems Shipping Trays 28F008S3 28F160B3
Text: 4.0 4.1 THE µBGA* PACKAGE SHIPPING MEDIA, HANDLING, AND DEVICE MARKINGS Shipping Media Overview NOTE: Please refer to the web-based Mechanical Spec for most up to date information at: 4.2 Shipping Media 4.2.1 Tape and Reel The µBGA package shipped in Tape and Reel
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paC/85
intel 04195
BGA package tray 40 x 40
uBGA device MARKing intel
F800B3
T1234567
04195
Material Handling Systems
Shipping Trays
28F008S3
28F160B3
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k1 522
Abstract: VFBGA EIA-481-B 07JAN200 pd0002
Text: PD0002 Packing information Chip scale packages for memory products tape and reel shipping media Introduction Surface mounting packages can be supplied with tape and reel packing. The reels are standard 330 mm 13” diameter, 180 mm (7”) for very small packages, and
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PD0002
k1 522
VFBGA
EIA-481-B
07JAN200
pd0002
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PQFN-32
Abstract: STQFN-14 ODS-1056 PQFN-12 PQFN-24 SM-46 STQFN-12 SOW-24 ODS-1072 MO-229
Text: Application Note M513 Tape and Reel Packaging for Surface Mount Components Rev. V15 Introduction M/A-Com Technology Solutions supplies integrated circuits, diodes, and related surface mount components in tape wound on standard 7-inch, 8-inch, 10-inch, and 13-inch diameter reels. This application note documents the reel and
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10-inch,
13-inch
08-mm
15-mm
MSOP-10
ODS-54
ODS-120
SOIC-16
SOW-16)
SOIC-24
PQFN-32
STQFN-14
ODS-1056
PQFN-12
PQFN-24
SM-46
STQFN-12
SOW-24
ODS-1072
MO-229
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f 948
Abstract: TOP 948 f948
Text: FC-36A 5.5 x 5 mm MOSFET BGA Tape and Reel Dimensions FC-36A MOSFET BGA Packaging Configuration: Figure 1 F63TNR Label Packaging Description: Antistatic Cover Tape FC-36A MOSFET BGA parts are shipped in tape. The carrier tape is made from a dissipative carbon filled
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FC-36A
F63TNR
330cm
f 948
TOP 948
f948
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Untitled
Abstract: No abstract text available
Text: S PEC I FI C AT I ON SHE E T Tape and Reel Tap e a n d R ee l UltraLite designs Available Now Reel only Optimized for high speed assembly of small components Confor ms to EIA-481 Peak Tape and Reel designs protect your high-value, small components through your high-speed assembly processes. Available for a
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EIA-481
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FDZ6966
Abstract: F63TNR SK 150 BGA
Text: FC-18A 2.5 x 4 mm MOSFET BGA with 18 balls Tape and Reel Data FC-18A MOSFET BGA Packaging Configuration: Figure 1.0 Packaging Description: Moisture Sens itive Sticker Antistatic Cover Tape FC-18A MOSFET BGA parts are shipped in tape. The carrier tape is made from a dissipative carbon filled
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FC-18A
177cm
FDZ6966
F63TNR
SK 150 BGA
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AT 30B
Abstract: F63TNR FC-30B FDZ6966 D9942
Text: FC-30B 4 x 3.5 mm MOSFET BGA with 30 balls Tape and Reel Data FC-30B MOSFET BGA Packaging Configuration: Figure 1.0 Moisture Sensitive Sticker Packaging Description: Antistatic Cover Tape FC-30B MOSFET BGA parts are shipped in tape. The carrier tape is made from a dissipative carbon filled
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FC-30B
330cm
AT 30B
F63TNR
FDZ6966
D9942
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948c
Abstract: No abstract text available
Text: FC-18A 2.5 x 4 mm MOSFET BGA Tape and Reel Dimensions FC-18A MOSFET BGA Packaging Configuration: Figure 1 Packaging Description: FC-18A MOSFET BGA parts are shipped in tape. The carrier tape is made from a dissipative carbon filled polycarbonate resin. The cover tape is a multilayer film
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FC-18A
177cm
948c
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F63TNR
Abstract: FDZ6966 F942B
Text: FC-36A 5 x 5.5 mm MOSFET BGA with 36 balls Tape and Reel Data FC-36A MOSFET BGA Packaging Configuration: Figure 1.0 Moisture Sensitive Sticker Packaging Description: Antistatic Cover Tape FC-36A MOSFET BGA parts are shipped in tape. The carrier tape is made from a dissipative carbon filled
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FC-36A
330cm
F63TNR
FDZ6966
F942B
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