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    TRANSISTOR mcr 100-8

    Abstract: No abstract text available
    Text: MOTOROLA MC33389 SEMICONDUCTOR TECHNICAL DATA SBC System basis chip Advance Information Automotive System Basis Chip The MC33389 is a monolithic integrated circuit combining many functions frequently used by automotive ECUs. It incorporates a low speed fault


    Original     		PDF MC33389 MC33389 100mA 200mA 125kBaud MC33388 TRANSISTOR mcr 100-8

    Untitled

    Abstract: No abstract text available
    Text: iPEM 2.4 Gb SDRAM-DDR2 AS4DDR232M72PBG 32Mx72 DDR2 SDRAM iNTEGRATED Plastic Encapsulated Microcircuit FEATURES BENEFITS DDR2 Data rate = 667, 533, 400 Available in Industrial, Enhanced and Military Temp Package: • 255 Plastic Ball Grid Array PBGA , 25 x 32mm


    Original     		PDF AS4DDR232M72PBG 32Mx72 AS4DDR232M72PBG

    laptop motherboard chip level crb

    Abstract: CL-GD5320 LAPTOP Motherboard CHIP LEVEL book GD610 CL-GD610 gd5320 GD6340 gd510 CL-GD6410 cirrus logic gd610
    Text: CL-GD6420 Data Book FEATURES • Single-chip VGA controller ■ Pin-compatible with the CL-GD6410 in 2-DRAM applications High-Resolution LCD VGA Controller for Notebook Computers ■ Up to 1 Mbyte 2, 4, or 8 256K x 4 DRAM Video Memory ■ Extended resolution up to 1024 x 768 with 256 colors on


    Original     		PDF CL-GD6420 CL-GD6410 CL-GD6420 CL-GD6410, laptop motherboard chip level crb CL-GD5320 LAPTOP Motherboard CHIP LEVEL book GD610 CL-GD610 gd5320 GD6340 gd510 cirrus logic gd610

    Untitled

    Abstract: No abstract text available
    Text: W3H32M72E-XSB2X W3H32M72E-XSB2XF 256MB – 32M x 72 DDR2 SDRAM 208 PBGA Multi-Chip Package FEATURES BENEFITS  Data rate = 667, 533, 400  69% space savings vs. FPBGA  Package:  Reduced part count • 208 Plastic Ball Grid Array PBGA , 16 x 20mm


    Original     		PDF W3H32M72E-XSB2X W3H32M72E-XSB2XF 256MB

    Untitled

    Abstract: No abstract text available
    Text: W3H264M16E-XBX ADVANCED* 256MB – 2 x 64M x 16 DDR2 SDRAM 79 PBGA FEATURES BENEFITS  Data rate = 400 Mb/s, 533 Mb/s, 667 Mb/s*  Larger ball pitch for higher reliability  Package:  Footprint compatible with W3H64M16E • 79 Plastic Ball Grid Array PBGA , 11 x 14mm


    Original     		PDF W3H264M16E-XBX 256MB W3H64M16E 128MB"

    DNU-A13

    Abstract: No abstract text available
    Text: W3H64M16E-XBX 128MB – 64M x 16 DDR2 SDRAM 79 PBGA FEATURES BENEFITS  Data rate = 400 Mb/s, 533 Mb/s  Larger ball pitch for higher reliability  Package:  Pinout compatible with 2-Rank Version • 79 Plastic Ball Grid Array PBGA , 11 x 14mm


    Original     		PDF W3H64M16E-XBX 128MB DNU-A13 128MB"

    Untitled

    Abstract: No abstract text available
    Text: DUAL CHANNEL T1/E1/J1 LONG HAUL/ SHORT HAUL LINE INTERFACE UNIT IDT82V2082 FEATURES: • • • • • • • - Dual channel T1/E1/J1 long haul/short haul line interfaces Supports HPS Hitless Protection Switching for 1+1 protection without external relays


    Original     		PDF IDT82V2082 772KHz TBR12/13 82V2082

    Untitled

    Abstract: No abstract text available
    Text: i PEM 2.1 G b SDRAM-DDR2 Gb Austin Semiconductor, Inc. AS4DDR232M64PBG 32Mx64 DDR2 SDRAM iNTEGRATED Plastic Encapsulated Microcircuit BENEFITS FEATURES „ „ „ „ „ „ „ „ „ „ „ „ „ „ „ „ „ „ „ DDR2 Data rate = 667, 533, 400 Available in Industrial, Enhanced and Extended Temp


    Original     		PDF AS4DDR232M64PBG 32Mx64 AS4DDR232M64PBG

    CHN 703

    Abstract: CHN G4 112
    Text: IDT82V2048 OCTAL T1/E1 SHORT HAUL LINE INTERFACE UNIT FEATURES ♦ ♦ ♦ ♦ ♦ ♦ ♦ Fully integrated octal T1/E1 short haul line interface which supports 100Ω T1 twisted pair, 120Ω E1 twisted pair and 75Ω E1 coaxial applications Selectable single rail or dual rail mode and AMI or HDB3/B8ZS


    Original     		PDF IDT82V2048 CTR12/ on3/25/2002 CHN 703 CHN G4 112

    spdif jack 6 pin

    Abstract: VRM Section of laptop Motherboard INTEL 845 MOTHERBOARD CIRCUIT diagram STAC9700 STAC9721 STAC9750 STAC9752 STAC9753 STAC9756 STAC9766
    Text: DATASHEET TWO-CHANNEL, 20-BIT, AC’97 2.3 CODECS WITH HEADPHONE DRIVE, SPDIF OUTPUT MICROPHONE & JACK SENSING Description IDT's STAC9752/9753 are general purpose 20-bit, full duplex, audio CODECs conforming to the analog component specification of AC'97 Audio CODEC 97


    Original     		PDF 20-BIT, 20-bit STAC9750 STAC9766 STAC9700, STAC9721, STAC9756 STAC9753) STAC9752) STAC9752/9753 spdif jack 6 pin VRM Section of laptop Motherboard INTEL 845 MOTHERBOARD CIRCUIT diagram STAC9700 STAC9721 STAC9752 STAC9753 STAC9756 STAC9766

    W3H32M72E-XSBX

    Abstract: calibration definition
    Text: White Electronic Designs W3H32M72E-XSBX PRELIMINARY* 32M x 72 DDR2 SDRAM 208 PBGA Multi-Chip Package FEATURES Data rate = 667*, 533, 400 Programmable CAS latency: 3, 4, 5, or 6 Package: Posted CAS additive latency: 0, 1, 2, 3 or 4 • 208 Plastic Ball Grid Array PBGA , 18 x 20mm


    Original     		PDF W3H32M72E-XSBX W3H32M72E-XSBX calibration definition

    S3F828BX

    Abstract: S3F8285X S3F8289X
    Text: S3C828BX/F828BX /C8289X/F8289X /C8285X/F8285X 8-BIT CMOS MICROCONTROLLERS USER'S MANUAL Revision 1.5 Important Notice The information in this publication has been carefully checked and is believed to be entirely accurate at the time of publication. Samsung assumes no


    Original     		PDF S3C828BX/F828BX /C8289X/F8289X /C8285X/F8285X SEG23/P4 SEG25/P4 SEG27/P5 SEG10/P6 SEG12/P6 SEG14/P6 SEG16/P6 S3F828BX S3F8285X S3F8289X

    IST13

    Abstract: No abstract text available
    Text: CR16MNS5, CR16MFS5, and CR16MPS5 are Obsolete Devices CR16MES5,CR16MES9,CR16MFS5,CR16MFS9, CR16MHS5,CR16MHS9,CR16MNS5,CR16MNS9, CR16MPS5,CR16MUS5,CR16MUS9 6MPS5/CR16MUS5/CR16MUS9 Family of CompactRISC 16-Bit Microcontrollers


    Original     		PDF CR16MNS5, CR16MFS5, CR16MPS5 CR16MES5 CR16MES9 CR16MFS5 CR16MFS9, CR16MHS5 CR16MHS9 CR16MNS5 IST13

    446H

    Abstract: 451H RDN11 GR-253-CORE GR-499-CORE IDT82P2821 640-Pin
    Text: 21 +1 Channel High-Density T1/E1/J1 Line Interface Unit IDT82P2821 Version 3 February 6, 2009 6024 Silver Creek Valley Road, San Jose, California 95138 Telephone: 1-800-345-7015 or 408-284-8200• TWX: 910-338-2070 • FAX: 408-284-2775 Printed in U.S.A.


    Original     		PDF IDT82P2821 640-pin BH640) BHG640) 82P2821 446H 451H RDN11 GR-253-CORE GR-499-CORE IDT82P2821

    Untitled

    Abstract: No abstract text available
    Text: White Electronic Designs W3H32M72E-XSBX PRELIMINARY* 32M x 72 DDR2 SDRAM 208 PBGA Multi-Chip Package FEATURES „ Data rate = 667, 533, 400 „ Programmable CAS latency: 3, 4, 5, or 6 „ Package: „ Posted CAS additive latency: 0, 1, 2, 3 or 4 • 208 Plastic Ball Grid Array PBGA , 18 x 20mm


    Original     		PDF W3H32M72E-XSBX W3H32M72E-XSBX 667Mbs

    Untitled

    Abstract: No abstract text available
    Text: INVERSE MULTIPLEXING FOR ATM IDT82V2608 Version - 2 December 8, 2003 2975 Stender Way, Santa Clara, California 95054 Telephone: 800 345-7015 • • FAX: (408) 492-8674 Printed in U.S.A. 2003 Integrated Device Technology, Inc. DISCLAIMER Integrated Device Technology, Inc. reserves the right to make changes to its products or specifications at any time, without notice, in order to improve design or performance


    Original     		PDF IDT82V2608 BB208) 82V2608

    ether H5

    Abstract: futaba vfd 9 GP1219A01A Futaba VFD display futaba vfd circuit diagram 256X64 Futaba VFD futaba 4 digit Futaba protocol futaba display 126
    Text: TENTATIVE VACUUM FLUORESCENT DISPLAY MODULE ENGINEERING PROPOSAL GP1219A01A EVALUATION □ ACCEPTED WITHOUT ANY CHANGE □ THE FOLLOWING CHANGE IS REQUIRED April 1 , 2008 Engineering Group Electronic Components Division ISSUED Yasuo Ohno BY CHECKED BY CHECKED


    Original     		PDF GP1219A01A GP1219A01A 256Kbit 256x64 ether H5 futaba vfd 9 Futaba VFD display futaba vfd circuit diagram Futaba VFD futaba 4 digit Futaba protocol futaba display 126

    Untitled

    Abstract: No abstract text available
    Text: White Electronic Designs W3H32M64E-XSBX 32M x 64 DDR2 SDRAM 208 PBGA Multi-Chip Package FEATURES „ Data rate = 667, 533, 400 „ Write latency = Read latency - 1* tCK „ Package: „ Commercial, Industrial and Military Temperature Ranges „ Organized as 32M x 64, user configurable as 2 x


    Original     		PDF W3H32M64E-XSBX 667Mbs

    W3H32M72E

    Abstract: BA0BA12
    Text: White Electronic Designs W3H32M72E-XSBX 32M x 72 DDR2 SDRAM 208 PBGA Multi-Chip Package FEATURES  Data rate = 667, 533, 400  Programmable CAS latency: 3, 4, 5, or 6  Package:  Posted CAS additive latency: 0, 1, 2, 3 or 4 • 208 Plastic Ball Grid Array PBGA , 18 x 20mm


    Original     		PDF W3H32M72E-XSBX 667Mbs 533Mbs) 650ps, -550ps, 500ps. W3H32M72E BA0BA12

    hy5rs123235b

    Abstract: HY5RS123235BFP HY5RS123235
    Text: HY5RS123235BFP 512Mbit 16Mx32 GDDR3 SDRAM HY5RS123235BFP This document is a general product description and is subject to change without notice. Hynix Semiconductor does not assume any responsibility for use of circuits described. No patent licenses are implied.


    Original     		PDF HY5RS123235BFP 512Mbit 16Mx32) HY5RS123235BFP hy5rs123235b HY5RS123235

    Untitled

    Abstract: No abstract text available
    Text: Lattica ispLSI and pLSI 1032 ;Semiconductor I Corporation High-Density Programmable Logic Functional Block Diagram Features HIGH-DENSITY PROGRAMMABLE LOGIC — High Speed Global Interconnect — 6000 PLD Gates — 64 I/O Pins, Eight Dedicated Inputs — 192 Registers


    OCR Scan     		PDF Military/883 1032-60LJI 84-Pin 1032-60LTI 100-Pin MILITARY/883 1032-60LG/883

    Untitled

    Abstract: No abstract text available
    Text: Lattice ispLSr 1032 H I Semiconductor •■■ Corporation In-System Programmable High Density PLD Functional Block Diagram Features • HIGH-DENSITY PROGRAMMABLE LOGIC — High Speed Global Interconnect — 6000 PLD Gates — 64 I/O Pins, Eight Dedicated Inputs


    OCR Scan     		PDF Military/883 84-Pin 1032-60LJ 1Q32-6GLT 100-Pin 1032-60LJI 1032-60LTI

    Untitled

    Abstract: No abstract text available
    Text: Lattice ispLSr and pLSI 1032 I Semiconductor I Corporation High-Density Programmable Logic Functional Block Diagram Features HIGH-DENSITY PROGRAMMABLE LOGIC — High Speed Global Interconnect — 6000 PLD Gates — 64 I/O Pins, Eight Dedicated Inputs — 192 Registers


    OCR Scan     		PDF Military/883 1032-60LT 100-Pin 1032-60LJI 84-Pin 1032-60LTI MILITARY/883

    1032-60LJ

    Abstract: 1032-60LJI 1032-60LTI 1032-90LJ 1032-90LT smd JSs 13 smd JSs 24
    Text: Lattice ispLSI 1032 I Semiconductor I Corporation In-System Programmable High Density PLD Functional Block Diagram Features HIGH-DENSITY PROGRAMMABLE LOGIC — High Speed Global Interconnect — 6000 PLD Gates — 64 I/O Pins, Eight Dedicated Inputs — 192 Registers


    OCR Scan     		PDF Military/883 100-Pin 1032-60LJ 84-Pin 1Q32-6GLT 1032-60LJI 1032-60LTI 1032-90LJ 1032-90LT smd JSs 13 smd JSs 24