TA774SF Search Results

TA774SF Datasheets Context Search

Catalog Datasheet	MFG & Type	PDF	Document Tags
TE32D Abstract: EIA and EIAJ tape standards TE3212 EIA and EIAJ standards RC-1009B TA7745 Text: 6. PACKING INFORMATION To deliver flat IC packages, three package method are available: the same stick packages as the ordinary DIP type, taping, and embossed taping. 6-1 Stick Specifications for Flat Packages • Shape and dimensions Example: FLP type Fig. 6-1	OCR Scan	PDF	14-/16-pin TA7745F TA774SF TE32D EIA and EIAJ tape standards TE3212 EIA and EIAJ standards RC-1009B TA7745

Catalog Datasheet

MFG & Type

PDF

Document Tags

TE32D

Abstract: EIA and EIAJ tape standards TE3212 EIA and EIAJ standards RC-1009B TA7745
Text: 6. PACKING INFORMATION To deliver flat IC packages, three package method are available: the same stick packages as the ordinary DIP type, taping, and embossed taping. 6-1 Stick Specifications for Flat Packages • Shape and dimensions Example: FLP type Fig. 6-1

OCR Scan

PDF

14-/16-pin TA7745F TA774SF TE32D EIA and EIAJ tape standards TE3212 EIA and EIAJ standards RC-1009B TA7745