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PCN0404 Abstract: SUMITOMO g700l sumitomo EME G700L G700L TQFP 144 PACKAGE Compound SUMITOMO mold compound TQFP 144 PACKAGE altera G700 Text: PROCESS CHANGE NOTICE PCN0404 ADDITIONAL MOLD COMPOUND FOR TQFP 144 PACKAGE Change Description: The Sumitomo G700L mold compound is being added as additional mold compound choice for selected Altera devices in thin quad flat pack TQFP 144 lead packages assembled by	Original	PDF	PCN0404 G700L PCN0404 SUMITOMO g700l sumitomo EME G700L TQFP 144 PACKAGE Compound SUMITOMO mold compound TQFP 144 PACKAGE altera G700
HI-3584APQT Abstract: HI-8010Q HI-3583APQT-15 sumitomo G700lx HI-3584APQI G700LX HI-3585PQTF HI-3584APQI-15 HI-8582PQIF Hi-3582APQI Text: 52 & 44 Lead Quad Flat Pack QFP MSL Improvement Product Change Notice PCN1006 (v1.0) October 01, 2010 Overview This notice describes the changes to the 52 & 44 Lead Quad Flat Pack (QFP) Package for the ARINC 429, MIL-STD 1553, and LCD Display Driver family of devices.	Original	PDF	PCN1006 6600CGL G700LX 84-1LMISR4 HI-3587PQTF HI-3587PQM HI-3587PQMF HI-3588PQI HI-3588PQIF HI-3588PQT HI-3584APQT HI-8010Q HI-3583APQT-15 sumitomo G700lx HI-3584APQI G700LX HI-3585PQTF HI-3584APQI-15 HI-8582PQIF Hi-3582APQI
SUMITOMO g700l Abstract: g700l a1007 Ablestik 5V995 JESD22-A103 JESD22-A110 TQFP-64 G700* sumitomo 5V995P Text: Integrated Device Technology, Inc. 6024 Silver Creek Valley Road, San Jose, CA - 95138 PRODUCT/PROCESS CHANGE NOTICE PCN PCN #: A1007-04 Product Affected: DATE: August 11, 2010 10.0mm x 10.0mm x 1.4mm TQFP-44 (Standard & Green) Date Effective: November 11, 2010	Original	PDF	A1007-04 TQFP-44 5T93GL101PFGI 5T93GL101PFGI8 5T93GL101PFI 5T93GL101PFI8 5T995APFI 5T995APFI8 5T995APPGI SUMITOMO g700l g700l a1007 Ablestik 5V995 JESD22-A103 JESD22-A110 TQFP-64 G700* sumitomo 5V995P
SUMITOMO g700l Abstract: C18045 8361J J-STD-020 G700* sumitomo JESD22-B105 G700L Text: 04/19/2006 PACKAGE RELIABILITY REPORT FOR ATK, 100 LQFP, 14x14x1.4mm Level 3 Dallas Semiconductor 4401 South Beltwood Parkway Dallas, TX 75244-3292 Prepared by: Ken Wendel Reliability Engineering Manager Dallas Semiconductor 4401 South Beltwood Pkwy. Dallas, TX 75244-3292	Original	PDF	14x14x1 SUMITOMO g700l C18045 8361J J-STD-020 G700* sumitomo JESD22-B105 G700L
SUMITOMO CRM1076 Abstract: sumitomo g770hcd JESD22-A113 SUMITOMO G631H cel9220 JESD22-A118 JESD22-A103 Ablebond 8600 sumitomo g770 G631H Text: Integrated Device Technology, Inc. 6024 Silver Creek Valley Road, San Jose, CA - 95138 PRODUCT/PROCESS CHANGE NOTICE PCN PCN #: A1004-01R1 DATE: 4-Jun-2010 Product Affected: 5mm x 5mm VFQFP-N-32 (Standard & Green) Refer to Attachment II for the affected part numbers	Original	PDF	A1004-01R1 4-Jun-2010 VFQFP-N-32 2-Jul-2010 S395CKLF 9LVRS395CKLFT 9LVRS395ENGKLF 9LVRS395ENGKLFT 9LVRS396AKLF 9LVRS396AKLFT SUMITOMO CRM1076 sumitomo g770hcd JESD22-A113 SUMITOMO G631H cel9220 JESD22-A118 JESD22-A103 Ablebond 8600 sumitomo g770 G631H
JESD22-A118 Abstract: SUMITOMO G631H cel9220 Ablebond 8600 sumitomo g770hcd SUMITOMO CRM1076 SUMITOMO G700 G631H sumitomo g770 sumitomo G700ly Text: Integrated Device Technology, Inc. 6024 Silver Creek Valley Road, San Jose, CA - 95138 PRODUCT/PROCESS CHANGE NOTICE PCN PCN #: A1004-01 DATE: 2-Apr-2010 Product Affected: 5mm x 5mm VFQFP-N-32 (Standard & Green) Refer to Attachment II for the affected part numbers	Original	PDF	A1004-01 2-Apr-2010 VFQFP-N-32 2-Jul-2010 S395CKLF 9LVRS395CKLFT 9LVRS395ENGKLF 9LVRS395ENGKLFT 9LVRS396AKLF 9LVRS396AKLFT JESD22-A118 SUMITOMO G631H cel9220 Ablebond 8600 sumitomo g770hcd SUMITOMO CRM1076 SUMITOMO G700 G631H sumitomo g770 sumitomo G700ly
SUMITOMO g700l Abstract: Ablestik 84-1LMIT1 G600 mold compound g700l G600 material composition sumitomo epoxy novolac SUMITOMO g600 bond wire gold 84-1LMIT1 Sumitomo EME6600D Text: SOT26 GaAs 20 Alpha Rd Chelmsford MA 01824 Tel:{978} 250-3343 Fax: {978} 250-3373 Product Information Product Environmental Data Sheet Date/Time Revision: Manufacture site: Product Number Product Name Product Mass Product Note February 25, 2005 Chelmsford MA	Original	PDF	EME6600D SUMITOMO g700l Ablestik 84-1LMIT1 G600 mold compound g700l G600 material composition sumitomo epoxy novolac SUMITOMO g600 bond wire gold 84-1LMIT1 Sumitomo EME6600D
g700l Abstract: G700LX JESD22-A108 G700* sumitomo jedec jesd22-a108 JESD A114 A114 transistor A114 100PF JESD22-A114 Text: RELIABILITY REPORT # 09-142 FOR SP508CF-L Six Layers Mask Change October 26, 2009 EXAR CORPORATION 48720 Kato Road, Fremont, CA 94538 Phone # 510 668-7000/ Fax # (510) 668-7022 Report #: 09-142 GENERAL INFORMATION CHIP DATA PACKAGE DATA FAB: Episil ASSEMBLY:	Original	PDF	SP508CF-L BA230466E 14x14x1 327x234 G700LX JESD22-A114 JESD22-A108 100PF g700l G700LX JESD22-A108 G700* sumitomo jedec jesd22-a108 JESD A114 A114 transistor A114 100PF JESD22-A114
sumitomo EME G700L Abstract: SUMITOMO g700l g700l Loctite 536 EME-G700 EME G700L lead frame cu C194 ablestick tqfp upsd Text: 05/12/06 µPSD ATK Assembly Qualification Test Report The following report summarizes the qualification testing of the uPSD family of µPSD Microcontrollers additional assembly and test locations AMKOR Technology Korea. To meet the increased product demand, and to enable flexibility for	Original	PDF