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    SUMITOMO G600 Search Results

    SUMITOMO G600 Result Highlights (2)

    Part ECAD Model Manufacturer Description Download Buy
    RJE01G6002 Amphenol Communications Solutions Modular Jack - Right Angle, Input Output Connectors 6P6C, Without Shield. Visit Amphenol Communications Solutions
    RJE01G6001 Amphenol Communications Solutions Modular Jack - Right Angle, Input Output Connectors 6P6C, Without Shield. Visit Amphenol Communications Solutions

    SUMITOMO G600 Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    PCN0512

    Abstract: G600 mold compound SUMITOMO g600 Nitto MP8000 EP1800I SUMITOMO-G600 altera EPM7032S mold compound altera EPM7032B ep600i
    Text: PROCESS CHANGE NOTIFICATION PCN0512 IMPLEMENTING STANDARD SUMITOMO-G600 SERIES MOLD COMPOUND FOR PLCC PACKAGES Change Description: Altera will implement a standard Sumitomo-G600 series mold compound on its Plastic J-Lead Chip Carrier PLCC packages. All devices in PLCC packages assembled at ASE Malaysia


    Original     		PDF PCN0512 SUMITOMO-G600 MP8000 EPC1064 EPC1064V EPC1213 EPC1441 PCN0512 G600 mold compound SUMITOMO g600 Nitto MP8000 EP1800I altera EPM7032S mold compound altera EPM7032B ep600i

    G600 mold compound

    Abstract: SUMITOMO g600 g600 CDSOT23 CDNBS16-T03 CDNBS16-T03C CDNBS16-T05 CDNBS16-T05C CDNBS16-T08 CDNBS16-T08C
    Text: CHIP DIODES Bourns Manufacturers Representatives Corporate Distributor Product Managers Americas Sales Team Asia Sales Team Europe Sales Team November, 2009 Bourns Diode Products Addition of Second Wafer Fabrication Location and Change to Sumitomo’s Green Mold Compound


    Original     		PDF CDNBS16-T03 CDNBS16-T03C CDNBS16-T05 CDNBS16-T05C CDNBS16-T08 CDNBS16-T08C CDNBS16-T12 CDNBS16-T12C CDNBS16-T15 CDNBS16-T15C G600 mold compound SUMITOMO g600 g600 CDSOT23 CDNBS16-T03 CDNBS16-T03C CDNBS16-T05 CDNBS16-T05C CDNBS16-T08 CDNBS16-T08C

    G600 mold compound

    Abstract: CDNBS08-T15 SUMITOMO g600 DIODES SGS CD143A-SR05 CD143A-SR12 CD143A-SR70 CDNBS08-T03 CDNBS08-T03C CDNBS08-T05C
    Text: CHIP DIODES Bourns Manufacturers Representatives Corporate Distributor Product Managers Americas Sales Team Asia Sales Team Europe Sales Team Revised October 7, 2009 Bourns Diode Products Addition of Second Wafer Fabrication Location and Change to Sumitomo’s Green Mold Compound


    Original     		PDF CD143A-SR70 CD143A-SR05 CD143A-SR12 CDSOT23-SRV05-4 CDNBS08-T03 CDNBS08-T03C CDNBS08-T05 CDNBS08-T05C CDNBS08-T08 CDNBS08-T08C G600 mold compound CDNBS08-T15 SUMITOMO g600 DIODES SGS CD143A-SR05 CD143A-SR12 CD143A-SR70 CDNBS08-T03 CDNBS08-T03C CDNBS08-T05C

    PCN0702

    Abstract: SUMITOMO G700 SUMITOMO G600 SUMITOMO EME G700 sumitomo 6300h mold compound SUMITOMO EME G600 EME G600 material properties G600 mold compound mp8000ch4 sumitomo G700 Tg
    Text: Revision: 1.2.0 PROCESS CHANGE NOTIFICATION PCN0702 UPDATE MOLD COMPOUND CHANGE FOR PQFP, PDIP, AND RQFP PACKAGES Change Description: This is an update to PCN0702, published March, 2007. Altera is implementing mold compound material changes on the Plastic Quad Flat Pack PQFP , Plastic Dual In-Line


    Original     		PDF PCN0702 PCN0702, 6300HJ G700M PCN0702 MP8000CH4 48hrs) X10-5 UL-94 SUMITOMO G700 SUMITOMO G600 SUMITOMO EME G700 sumitomo 6300h mold compound SUMITOMO EME G600 EME G600 material properties G600 mold compound sumitomo G700 Tg

    Ablebond 84-1*SR4

    Abstract: Ablebond 84-1LMISR4 ablebond 8290 84-1lmisr4 Ablebond SUMITOMO g600 Sumitomo 6730B SP491ECN-L SP3232EEN-L sp26lv431
    Text: PRODUCT CHANGE NOTICE PCN PART NUMBER(S): PCN No.: 09-0911-01 REFER TO ATTACHMENT A DATE: December 7, 2009 PART DESCRIPTION: See www.exar.com LEVEL OF CHANGE: [ ] Level I, Customer Approval. [X ] Level II, Customer Information. PRODUCT ATTRIBUTE AFFECTED:


    Original     		PDF SOICN-14 SOICN-16 6730B-L 84-1LMISR4 Abl691AEN-L/TR SP26LV432CN-L SP26LV432CN-L/TR SP26LV431CN-L SP26LV431CN-L/TR Ablebond 84-1*SR4 Ablebond 84-1LMISR4 ablebond 8290 84-1lmisr4 Ablebond SUMITOMO g600 Sumitomo 6730B SP491ECN-L SP3232EEN-L sp26lv431

    1076ns

    Abstract: sumitomo 1076NS SP3232ECP-L SUMITOMO g600 SP3232ECP SP491ECP-L G600 SP202ECP-L SP202EEP-L SP232ACP-L
    Text: PRODUCT CHANGE NOTICE PCN PART NUMBER(S): PCN No.: 08-0929-01 Refer to Attachment A DATE: September 29, 2008 PART DESCRIPTION: See www.exar.com LEVEL OF CHANGE: [X] Level I, Customer Approval. [ ] Level II, Customer Information. PRODUCT ATTRIBUTE AFFECTED:


    Original     		PDF G0006-6 SP231ACP-L SP491CS-L SP491ECP-L SP491EEP-L SP491ES-L SP202ECP-L SP202EEP-L SP232ACP-L SP232AEP-L 1076ns sumitomo 1076NS SP3232ECP-L SUMITOMO g600 SP3232ECP SP491ECP-L G600 SP202ECP-L SP202EEP-L SP232ACP-L

    Sumitomo EME-G600 material

    Abstract: EME-G600 SUMITOMO EME-G600 SUMITOMO G600 EME G600 G600 mold compound MP8000AN Nitto Q3-6646 Compound
    Text: Simtek Corporation Product Change Notification [PCN] Home page: http://www.simtek.com E-mail: information@simtek.com 4250 Buckingham Drive, Suite 100 Colorado Springs CO 80907 USA 719-531-9444 fax 719-531-9481 PCN # 10059 00 PCN Status Final PCN Date July 12, 2006


    Original     		PDF EME-G600 MP8000-AN Q3-6646] Sumitomo EME-G600 material EME-G600 SUMITOMO EME-G600 SUMITOMO G600 EME G600 G600 mold compound MP8000AN Nitto Q3-6646 Compound

    SUMITOMO g600f

    Abstract: G600F sumitomo epoxy G600F of bakelite material dali G600 Dissolve Oxygen 3540C
    Text: RESISTOR NETWORKS Bourns Manufacturers Representatives Corporate Distributor Product Managers Americas Sales Team Asia Sales Team Europe Sales Team Bourns Internal Bourns Plant Managers June, 2010 Thin Film on Silicon Resistor Networks Models 2NBS, 2QSP Mold Material Change


    Original     		PDF G600F. G600F N1031 KA/2010/30950A-04 SUMITOMO g600f sumitomo epoxy G600F of bakelite material dali G600 Dissolve Oxygen 3540C

    Ablestik 84-1

    Abstract: Ablestik Ablestik LMISR4 SUMITOMO g600 Ablestik 84-1 lmis-r4 LMISR4 G600 mold compound G600 mold compound unisem 6300h sumitomo 6300h mold compound
    Text: October 26, 2009 CN-102609 Customer Notification M02045-2Y04-T and M02045G-2Y04-T Second Assembly Site Dear Valued Customer: This notification is for the purpose of informing you of a second assembly site for the M02045-2Y04-T and M02045G-2Y04-T, 16 pin SOIC package.


    Original     		PDF CN-102609 M02045-2Y04-T M02045G-2Y04-T M02045G-2Y04-T, Ablestik 84-1 Ablestik Ablestik LMISR4 SUMITOMO g600 Ablestik 84-1 lmis-r4 LMISR4 G600 mold compound G600 mold compound unisem 6300h sumitomo 6300h mold compound

    Sumitomo CRM1076NS

    Abstract: SUMITOMO g600 CRM1076NS Compound R3589DR-S TISPA79R241DR-S J-STD-22 R3680DR-S crm1076 bourns R3679DR-S
    Text: THYRISTOR SURGE PROTECTORS August 2007 Bourns Manufacturers Representatives Corporate Distributor Product Managers Americas Sales Team Asia Sales Team Europe Sales Team PCN Tracking Number 45 New Assembly/Test Site & Green Mold Compound Bourns is qualifying an additional assembly/test site for manufacture of overvoltage protectors in


    Original     		PDF MS012, TISP3082F3DR-S TISP3125F3DR-S TISP3150F3DR-S TISP3180F3DR-S TISP3290F3DR-S TISP3380F3DR-S TISP4072F3DR-S TISP4125F3DR-S TISP4150F3DR-S Sumitomo CRM1076NS SUMITOMO g600 CRM1076NS Compound R3589DR-S TISPA79R241DR-S J-STD-22 R3680DR-S crm1076 bourns R3679DR-S

    Sumitomo CRM1076NS

    Abstract: SUMITOMO g600 G600 mold compound r3589 J-STD-22 G600 JEDEC 95 CRM1076NS TISP4072F3DR-S r36041
    Text: THYRISTOR SURGE PROTECTORS August 2007 Bourns Manufacturers Representatives Corporate Distributor Product Managers Americas Sales Team Asia Sales Team Europe Sales Team PCN Tracking Number 45 New Assembly/Test Site & Green Mold Compound Bourns is qualifying an additional assembly/test site for manufacture of overvoltage protectors in


    Original     		PDF MS012, TISP3082F3DR-S TISP3125F3DR-S TISP3150F3DR-S TISP3180F3DR-S TISP3290F3DR-S TISP3380F3DR-S TISP4072F3DR-S TISP4125F3DR-S TISP4150F3DR-S Sumitomo CRM1076NS SUMITOMO g600 G600 mold compound r3589 J-STD-22 G600 JEDEC 95 CRM1076NS TISP4072F3DR-S r36041

    ablebond 84-3J

    Abstract: SUMITOMO g600f CRM-1151 ablebond 8006ns sumitomo EME G600 sumitomo crm ablebond ablestik 8006ns 84-3j hi-1579psm SUMITOMO CRM-1151
    Text: MIL-STD-1553 Bus Transceivers Plastic SOIC Package Transfer Product Change Notice PCN1201 v1.0 January 20, 2012 Overview The purpose of this notification is to describe the changes to the 20 Pin Plastic Small Outline ESOIC-WB packages for the MIL-STD-1553 family of devices.


    Original     		PDF MIL-STD-1553 PCN1201 20L-SOIC ablebond 84-3J SUMITOMO g600f CRM-1151 ablebond 8006ns sumitomo EME G600 sumitomo crm ablebond ablestik 8006ns 84-3j hi-1579psm SUMITOMO CRM-1151

    6730B-L

    Abstract: Sumitomo 6730B G600 mold compound unisem SUMITOMO g600 G600 SP310ACT-L SP310AET-L SP310ECT SP310ECT-L 6730B
    Text: PRODUCT CHANGE NOTICE PCN PART NUMBER(S): PCN No.: 08-1107-01 Refer to Attachment A DATE: 12/08/08 PART DESCRIPTION: See www.exar.com LEVEL OF CHANGE: [X] Level I, Customer Approval. [ ] Level II, Customer Information. PRODUCT ATTRIBUTE AFFECTED: [ ] [ ]


    Original     		PDF 6730B-L SP310ACT-L SP310AET-L SP310ECT SP310ECT-L SP310EET-L SP385ECT-L SP385EET-L SP312ACT-L SP312AET-L Sumitomo 6730B G600 mold compound unisem SUMITOMO g600 G600 SP310ACT-L SP310AET-L SP310ECT SP310ECT-L 6730B

    SUMITOMO G631

    Abstract: g631 G-631 G631* sumitomo XR17D152IM-F SUMITOMO g600 sumitomo g63 14X14X1 G600 XR17C152CM-F
    Text: PRODUCT CHANGE NOTICE PCN PART NUMBER(S): PCN No.: 10-0126-01 Refer to Attachment A DATE: February 22, 2010 PART DESCRIPTION: Please see www.exar.com. LEVEL OF CHANGE: [X] Level I, Customer Approval. [ ] Level II, Customer Information. PRODUCT ATTRIBUTE AFFECTED:


    Original     		PDF 14X14X1 G0006-6 XR17D152IM-F XR17D152CM-F XR17D152CMTR-F XR17C152CM-F SUMITOMO G631 g631 G-631 G631* sumitomo XR17D152IM-F SUMITOMO g600 sumitomo g63 G600 XR17C152CM-F

    CRM-1076DJ-G

    Abstract: SUMITOMO g600f G600F sumitomo crm 1076dj greatek SUMITOMO EME G CRM1076DJ 100-Lead-LQFP LQFP Package CRM*1076
    Text: 100-Lead Quad Flat Pack QFP Package Transfer Product Change Notice PCN1003 (v1.0) April 22, 2010 Overview This notice describes the changes to the 100-Lead Quad Flat Pack (QFP) Package for the HI-8045PQx LCD Display Driver family of devices. Description


    Original     		PDF 100-Lead HI-8045PQx PCN1003 JESD46-C, QR-1003 CRM-1076DJ-G SUMITOMO g600f G600F sumitomo crm 1076dj greatek SUMITOMO EME G CRM1076DJ 100-Lead-LQFP LQFP Package CRM*1076

    CRM1076E

    Abstract: STMicroelectronics TRACEABILITY code XC18V02VQ44C part marking SUMITOMO G700 stmicroelectronics traceability datecode format stmicroelectronics soic marking code stmicroelectronics XC18V01SO20C sumitomo g700 type XC18V04VQ44C0901
    Text: XC18V00 Series In-System Programmable Configuration PROMs R DS026 v4.1 December 15, 2003 Features • • Dual configuration modes - In-system programmable 3.3V PROMs for configuration of Xilinx FPGAs - Endurance of 20,000 program/erase cycles - • •


    Original     		PDF XC18V00 DS026 5PM5A0233 5BM5A0233 SCD0901. PCN2003-04A PCN2003-04 CRM1076E STMicroelectronics TRACEABILITY code XC18V02VQ44C part marking SUMITOMO G700 stmicroelectronics traceability datecode format stmicroelectronics soic marking code stmicroelectronics XC18V01SO20C sumitomo g700 type XC18V04VQ44C0901

    copper bond wire

    Abstract: crm-1076NS CRM1076NS Sumitomo CRM1076NS J-STD-22 0834 CRM1076 r3589 SUMITOMO g600 G600
    Text: THYRISTOR SURGE PROTECTORS May, 2008 Bourns Manufacturers Representatives Corporate Distributor Product Managers Americas Sales Team Asia Sales Team Europe Sales Team Thyristor Surge Protector Product Change Notification PCN Tracking Number 46 — Change from Gold to Copper Wire


    Original     		PDF 150mil) MS012, TISP3125F3DR-S TISP3150F3DR-S TISP3180F3DR-S TISP3290F3DR-S TISP3380F3DR-S TISP4072F3DR-S TISP4125F3DR-S TISP4150F3DR-S copper bond wire crm-1076NS CRM1076NS Sumitomo CRM1076NS J-STD-22 0834 CRM1076 r3589 SUMITOMO g600 G600

    CRM1076NS

    Abstract: J-STD-22 r3589 Sumitomo CRM1076NS CS thyristor G600 CRM1076N
    Text: THYRISTOR SURGE PROTECTORS May, 2008 Bourns Manufacturers Representatives Corporate Distributor Product Managers Americas Sales Team Asia Sales Team Europe Sales Team Thyristor Surge Protector Product Change Notification PCN Tracking Number 46 — Change from Gold to Copper Wire


    Original     		PDF 150mil) MS012, TISP3125F3DR-S TISP3150F3DR-S TISP3180F3DR-S TISP3290F3DR-S TISP3380F3DR-S TISP4072F3DR-S TISP4125F3DR-S TISP4150F3DR-S CRM1076NS J-STD-22 r3589 Sumitomo CRM1076NS CS thyristor G600 CRM1076N

    CRM-1076DJ-G

    Abstract: CRM*1076 CRM-1076 SUMITOMO g600f CRM1076DJ sumitomo crm 1076dj ABLEBONd 84-1 sumitomo crm
    Text: 52-Lead Quad Flat Pack QFP Package Change & Transfer Product Change Notice PCN1103 (v1.0) December 01, 2011 Overview This notice describes the package changes to the 52 Lead Quad Flat Pack (QFP) Package for all of Holt’s ARINC 429, MILSTD 1553, and LCD Display Driver family of devices.


    Original     		PDF 52-Lead PCN1103 QR-1003 100-Lead QR-1131 44-Lead CRM-1076DJ-G CRM*1076 CRM-1076 SUMITOMO g600f CRM1076DJ sumitomo crm 1076dj ABLEBONd 84-1 sumitomo crm

    CRM1076DJ

    Abstract: CRM-1076DJ-G crm1076 SUMITOMO g600f LQFP-100 footprint ABLEBONd 84-1 Holt 3717p 100LQFP CRM*1076
    Text: 44-Lead Quad Flat Pack QFP Footprint & Package Change Product Change Notice PCN1102 (v1.0) December 01, 2011 Overview This notice describes the footprint and package changes to the 44 Lead Quad Flat Pack (QFP) Package for all of Holt’s ARINC family of devices.


    Original     		PDF 44-Lead PCN1102 QR-1003 100-Lead QR-1131 CRM1076DJ CRM-1076DJ-G crm1076 SUMITOMO g600f LQFP-100 footprint ABLEBONd 84-1 Holt 3717p 100LQFP CRM*1076

    JESD22-B105

    Abstract: JESD22-B102 JEDEC hast code 0528
    Text: 12/18/2008 RELIABILITY REPORT FOR DS2434, Rev D1 Maxim Integrated Products 4401 South Beltwood Parkway Dallas, TX 75244-3292 Prepared by: Ken Wendel Director, Reliability Engineering Maxim Integrated Products 4401 South Beltwood Pkwy. Dallas, TX 75244-3292


    Original     		PDF DS2434, J-STD20A) DS2434 6710S CDA194 94-V0 ZU540101AD JESD22-B102, JESD22-B105 JESD22-B102 JEDEC hast code 0528

    sumitomo crm epoxy

    Abstract: EME G600 CRM 1076NS SUMITOMO EME G600 sumitomo epoxy 1076 epoxy CRM1076NS Sumitomo CRM1076NS sumitomo crm crm-1076NS CRM1076NS
    Text: High-Speed DMOS Quad FET Analog Switch Arrays LLC SD5000 / SD5001 / SD5002 SD5400 / SD5401 / SD5402 FEATURES • • • • • • DESCRIPTION Low PropagatiomTime . . . . . . . . . . . . . . . . . . . . 600 psec Low On Resistance Low Insertion Loss Low Capacitance:


    Original     		PDF SD5000 SD5001 SD5002 SD5400 SD5401 SD5402 SD5000N SD5001N SD5002N sumitomo crm epoxy EME G600 CRM 1076NS SUMITOMO EME G600 sumitomo epoxy 1076 epoxy CRM1076NS Sumitomo CRM1076NS sumitomo crm crm-1076NS CRM1076NS

    JESD22-C101

    Abstract: JESD22-A115 MIL-STD-883-2011 0732 g600 G600 mold compound UL flammability test ABLEBOND 8200T Ablestik 8290 SUMITOMO g600 UL JESD22A-115
    Text: 2/27/2008 RELIABILITY REPORT FOR DS1099, Rev A3 8" Maxim Integrated Products 4401 South Beltwood Parkway Dallas, TX 75244-3292 Prepared by: Don Lipps Staff Reliability Engineer Maxim Integrated Products 4401 South Beltwood Pkwy. Dallas, TX 75244-3292 Email: don.lipps@dalsemi.com


    Original     		PDF DS1099, MIL-STD-883-2011 JESD22-C101 JESD22-A115 MIL-STD-883-2011 0732 g600 G600 mold compound UL flammability test ABLEBOND 8200T Ablestik 8290 SUMITOMO g600 UL JESD22A-115

    sumitomo g770

    Abstract: G770* G770 mold compound Sumitomo 1000 JESD47E G770 mold compound G770* sumitomo G770 APP4132 Maxim date code DS2431 SUYIN 4 pin battery contact connector G770 sumitomo
    Text: Maxim > App Notes > 1-Wire devices Keywords: SFN, attachment, IC package, 1-Wire, 1Wire, calibration, authentication, monitoring, accessory, consumable, electromechanical contact Nov 26, 2007 APPLICATION NOTE 4132 Attachment methods for the electro-mechanical SFN package


    Original     		PDF DS2431 1024-Bit DS2432 DS28E01-100 com/an4132 AN4132, APP4132, Appnote4132, sumitomo g770 G770* G770 mold compound Sumitomo 1000 JESD47E G770 mold compound G770* sumitomo G770 APP4132 Maxim date code DS2431 SUYIN 4 pin battery contact connector G770 sumitomo