SN62MP100AGS90
Abstract: IPC-SF-818 multicore mp100 SN62MP100 prozone sc 01 cleaner multicore solder paste TR-NWT-000078 prozone solder powder Solder paste stencil life
Text: E-MAIL: info@angliac.com WEB: www.angliac.com REFLOW SOLDERING SOLDER PASTES / CLEANER SCREEN/STENCIL AND REWORK CLEANER HIGH SPEED PRINTING, NO CLEAN, PIN TESTABLE Multicore MP100 solder cream has been formulated as a pale soft residue product for printing and reflow in air, where process yield
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MP100
150mm
SC-01
500ml
SN62MP100AGS90
SC-01
CAT/0135
SN62MP100AGS90
IPC-SF-818
multicore mp100
SN62MP100
prozone sc 01 cleaner
multicore solder paste
TR-NWT-000078
prozone
solder powder
Solder paste stencil life
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loctite 3616
Abstract: No abstract text available
Text: Technical Data Sheet LOCTITE 3616 LOCTITE 3616 is designed for the bonding of surface mounted devices to printed circuit boards prior to wave soldering. Particularly suited to printing a range of dot heights with one stencil thickness and where high wet strength characteristics,
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M10/PK
650LMS
loctite 3616
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keyence
Abstract: ball valve servomotor
Text: AEM, Inc. 11525 Sorrento Valley Rd. San Diego, CA92121 Phone: 858 481-0210 Fax: (858)481-1123 www.aem-usa.com Precision Printer AEM Precision Printer Model P2002-2 DESCRIPTION AEM precision printer Model P2002-2 is specially designed for high precision screen/stencil printing of electrode on ceramic bars on pallets.
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CA92121
P2002-2
P2002-2
keyence
ball valve
servomotor
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QFN-48 LAND PATTERN
Abstract: QFN PACKAGE thermal resistance QFN-48 footprint qfn 48 7x7 footprint ipc-SM-782 thermal analysis on pcb SMD transistor Mo FOOTPRINT PCB qfn 48 7x7 stencil AN5060
Text: Optimum PCB and Stencil Layout for WirelessUSB QFN Package Introduction When designing a system board using the WirelessUSB™ LS/LR QFN chip for wireless product applications, there are several important factors to consider. It is advised to pay critical attention to PCB design and assembly aspects when
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MATERIAL SAFETY Solder powder
Abstract: No abstract text available
Text: M U LT I P R I N T A N D FA S T P R I N T S O L D E R C R E A M S MULTIPRINT SOLDER CREAMS • PRODUCES CLEAR RESIDUES - ELIMINATES THE NEED FOR CLEANING • IPC TYPE ‘L’ AND HIGH ACTIVITY VERSIONS • EXCELLENT TACK PERFORMANCE AND PRINTER OPEN TIME • SUITABLE FOR FINE PITCH HIGH SPEED STENCIL PRINTING APPLICATIONS
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SN62NC62AGS89
SN62NC72AGS89
500gm
MATERIAL SAFETY Solder powder
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Untitled
Abstract: No abstract text available
Text: M U LT I P R I N T A N D FA S T P R I N T S O L D E R C R E A M S MULTIPRINT SOLDER CREAMS • PRODUCES CLEAR RESIDUES - ELIMINATES THE NEED FOR CLEANING • IPC TYPE ‘L’ AND HIGH ACTIVITY VERSIONS • EXCELLENT TACK PERFORMANCE AND PRINTER OPEN TIME • SUITABLE FOR FINE PITCH HIGH SPEED STENCIL PRINTING APPLICATIONS
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SN62NC62AGS89
SN62NC72AGS89
500gm
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MARKING code mx stmicroelectronics
Abstract: J-STD-004 Marking STMicroelectronics QFN EMIF04-1502M8 JESD97
Text: EMIF04-1502M8 IPAD 4 line low capacitance EMI filter and ESD protection in Micro QFN package Main product characteristics 1 8 Where EMI filtering in ESD sensitive equipment is required: 7 GND 2 GND • LCD & CAMERA for Mobile phones 5 3 ■ Computers and printers
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EMIF04-1502M8
EMIF04-1502M8
MARKING code mx stmicroelectronics
J-STD-004
Marking STMicroelectronics QFN
JESD97
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MARKING code mx stmicroelectronics
Abstract: STMicroelectronics marking rule STMicroelectronics mx marking Marking STMicroelectronics QFN code mx stmicroelectronics
Text: EMIF06-1502M12 IPAD 6 line low capacitance EMI filter and ESD protection in Micro QFN package Main product characteristics 12 1 Where EMI filtering in ESD sensitive equipment is required: 11 2 • LCD & CAMERA for Mobile phones 9 Computers and printers
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EMIF06-1502M12
EMIF06-1502M12
MARKING code mx stmicroelectronics
STMicroelectronics marking rule
STMicroelectronics mx marking
Marking STMicroelectronics QFN
code mx stmicroelectronics
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marking g4
Abstract: No abstract text available
Text: EMIF04-1502M8 IPAD 4 line low capacitance EMI filter and ESD protection in Micro QFN package Main product characteristics 1 8 Where EMI filtering in ESD sensitive equipment is required: 7 2 GND GND • LCD & CAMERA for Mobile phones 5 3 ■ Computers and printers
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EMIF04-1502M8
EMIF04-1502M8
marking g4
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EMIF06-1502M12
Abstract: JESD97 J-STD-004
Text: EMIF06-1502M12 IPAD 6 line low capacitance EMI filter and ESD protection in Micro QFN package Main product characteristics 12 1 Where EMI filtering in ESD sensitive equipment is required: 11 2 • LCD & CAMERA for Mobile phones 9 Computers and printers
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EMIF06-1502M12
EMIF06-1502M12
JESD97
J-STD-004
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EMIF06-1005M12
Abstract: JESD97
Text: EMIF06-1005M12 IPAD 6 line low capacitance EMI filter and ESD protection in Micro QFN package Main product characteristics 12 1 Where EMI filtering in ESD sensitive equipment is required: 11 2 • LCD and CAMERA for Mobile phones 9 Computers and printers
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EMIF06-1005M12
EMIF06-1005M12
JESD97
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marking G4
Abstract: EMIF04-1502M8 JESD97 qfn stencil
Text: EMIF04-1502M8 IPAD 4 line low capacitance EMI filter and ESD protection in Micro QFN package Main product characteristics 8 Where EMI filtering in ESD sensitive equipment is required: 7 1 G ND 2 GND • LCD & CAMERA for Mobile phones 6 3 ■ Computers and printers
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EMIF04-1502M8
EMIF04-1502M8
marking G4
JESD97
qfn stencil
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EMIF06-1502M12
Abstract: JESD97 MARKING code mx stmicroelectronics mark MX ST
Text: EMIF06-1502M12 IPAD 6 line low capacitance EMI filter and ESD protection in Micro QFN package Main product characteristics 12 1 Where EMI filtering in ESD sensitive equipment is required: 11 2 • LCD & CAMERA for Mobile phones 9 Computers and printers
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EMIF06-1502M12
EMIF06-1502M12
JESD97
MARKING code mx stmicroelectronics
mark MX ST
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MARKING code mx stmicroelectronics
Abstract: EMIF04-1005M8 EMIF04-1502M8 JESD97
Text: EMIF04-1005M8 IPAD 4 line low capacitance EMI filter and ESD protection in Micro QFN package Main product characteristics 8 Where EMI filtering in ESD sensitive equipment is required: 7 1 G ND 2 GND • LCD & CAMERA for Mobile phones 6 3 ■ Computers and printers
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EMIF04-1005M8
EMIF04-1502M8
MARKING code mx stmicroelectronics
EMIF04-1005M8
JESD97
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EMIF06-1005M12
Abstract: JESD97 MARKING code mx stmicroelectronics
Text: EMIF06-1005M12 IPAD 6 line low capacitance EMI filter and ESD protection in Micro QFN package Main product characteristics 12 1 Where EMI filtering in ESD sensitive equipment is required: 11 2 • LCD and CAMERA for Mobile phones 9 Computers and printers
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EMIF06-1005M12
EMIF06-1005M12
JESD97
MARKING code mx stmicroelectronics
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ESDALC6V1-1M2
Abstract: N SOD882 Date Code Formats diodes St Microelectronics JESD97
Text: ESDALC6V1-1M2 Single line low capacitance TRANSIL for ESD protection Applications Where transient overvoltage protection in ESD sensitive equipment is required, such as: • Computers ■ Printers ■ Communication systems ■ Cellular phone handsets and accessories
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OD882
ESDALC6V1-1M2
N SOD882
Date Code Formats diodes St Microelectronics
JESD97
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AN1005
Abstract: paste profile C-200 IPC-A-610C X-RAY INSPECTION
Text: Application Note AN1005 RoHS Compliant ClearONE Printed Circuit Assembly Guidelines Introduction The standard ClearONE terminator is the industry leader in performance and reliability. The need to provide a lead free solution for resistor terminator networks in compliance with the RoHS initiative has
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AN1005
AN1005
paste profile
C-200
IPC-A-610C
X-RAY INSPECTION
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thermal printer 2 inch
Abstract: hermetic packages PCB land Solder paste stencil life IPC-A610A paste profile pcb board pin in paste X-RAY INSPECTION RT1400B6 SN63
Text: Note Number AN-C1-PCAG-A Printed Circuit Assembly Guidelines PRINTED CIRCUIT ASSEMBLY GUIDELINES APPLICATION NOTE INTRODUCTION Use of industry leading circuit deposition methods and equipment enables us to provide the highest packaging density and reliability while eliminating
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OMAP4
Abstract: LASER based Four ZONE security system water filling station circuit diagram Senju eco solder paste mobile nokia circuit diagram eco solder paste primavera OMAP35xx lf4300 solder dipping pop
Text: Application Report SPRAAV2 – April 2008 PCB Assembly Guidlines for 0.4mm Package-On-Package PoP Packages, Part II Keith Gutierrez and Gerald Coley .
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OMAP35xx
OMAP4
LASER based Four ZONE security system
water filling station circuit diagram
Senju eco solder paste
mobile nokia circuit diagram
eco solder paste
primavera
lf4300
solder dipping pop
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Untitled
Abstract: No abstract text available
Text: Manufactured for Chip Quik, Inc. by SMT International, LLC AMTECH P.O. Box 989 Deep River, CT 06417 Toll free: 800.435.0317 Phone: 860.526.8300 Fax: 860.526.8243 www.amtechsolder.com Advanced SMT Solder An ISO 9001 Certified Company Product Data Sheet For Chip Quik Pt. # SMD291SNL, SMD291SNL10
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SMD291SNL,
SMD291SNL10
700to1
000Kcps
450Kcps
IPC-TM-650
SoakTemp140-200Â
SoakTime60-90Sec
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alpha solder paste PROFILE
Abstract: SN63 qfn stencil MO-220* pattern qfn Package solder stop mask stencil MO-220 jedec package MO-220 QFN 20 jedec MO-220 LP3
Text: v00.0902 APPLICATION NOTES PCB DESIGN AND ASSEMBLY FOR QFN PACKAGES Introduction The need for low-cost surface mount plastic packages that operate to high frequency with low package thermal resistance has led to the development of Quad Flatpack No-Lead QFN packages. The industry standard description
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MO-220
CPF-16.
CPF-24.
alpha solder paste PROFILE
SN63
qfn stencil
MO-220* pattern
qfn Package
solder stop mask
stencil
jedec package MO-220 QFN 20
jedec MO-220 LP3
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Untitled
Abstract: No abstract text available
Text: SMT International, LLC P.O. Box 989 Deep River, CT 06417 Toll Free: 800.435.0317 Phone: 860.526.8243 Fax: 860.526.8243 AMTECH Advanced SMT Solder Products www.amtechsolder.com An ISO 9001 Certified Company Product Data Sheet for Chip Quik Pt # SMD4300AX10 w/lead
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SMD4300AX10
900Kcps
450Kcps
IPC-TM-650
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Untitled
Abstract: No abstract text available
Text: G EIM IM U M c o r p c h a t C la s s A A m p lif ie r w i t h g In d e p e n d e n t G a in B lo c k s . oi m 508 LP508 DATA SHEET FEATURES DESCRIPTION • 1 |xV input referred noise The LP508 is an 8 pin Class A am plifier utilizing Gennum 's proprietary low voltage bipolar JFET technology. It consists of
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OCR Scan
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LP508
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Untitled
Abstract: No abstract text available
Text: GENNUM C O R P O R A T I Low Current Quad Inverting Amplifiers O N 509 LX5G9 PRELIMINARY DATA SHEET FEATURES DESCRIPTION • The LX509 consists of 4 independent low noise, low current 2 1 0 |xA typical current drain • 4 inverting opamps; B with 6 dB greater drive current
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OCR Scan
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LX509
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