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    STACKED CHIP SCALE PACKAGE Search Results

    STACKED CHIP SCALE PACKAGE Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    TPH9R00CQH Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 150 V, 64 A, 0.009 Ohm@10V, SOP Advance / SOP Advance(N) Visit Toshiba Electronic Devices & Storage Corporation
    TPH2R408QM Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 80 V, 120 A, 0.00243 Ohm@10V, SOP Advance Visit Toshiba Electronic Devices & Storage Corporation
    XPH2R106NC Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 60 V, 110 A, 0.0021 Ω@10V, SOP Advance(WF) Visit Toshiba Electronic Devices & Storage Corporation
    XPH3R206NC Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 60 V, 70 A, 0.0032 Ω@10V, SOP Advance(WF) Visit Toshiba Electronic Devices & Storage Corporation
    TPH4R008QM Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 80 V, 86 A, 0.004 Ohm@10V, SOP Advance(N) Visit Toshiba Electronic Devices & Storage Corporation

    STACKED CHIP SCALE PACKAGE Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    signetics

    Abstract: No abstract text available
    Text: Data Sheet Signetics Signetics Flip Chip Package Data Sheet Signetics Stacked CSP Signetics Stacked Chip Scale Package Stacked CSP is a laminate-based, nearly chip-scale package containing at least two die that are stacked vertically. This package solution provides a very high silicon content


    Original     		PDF 696hr, 192hr, C/-65 C/100% 15PSIG, 168hrs signetics

    252633

    Abstract: INTEL STRATAFLASH 1.8V
    Text: 256-Mbit 1.8 Volt Intel StrataFlash Wireless Memory L18/L30 Stacked-Chip Scale Package (x16) 48F3300L0YDQ0 (x16), 48F3300L0ZDQ0 (x16) Datasheet Product Features • ■ ■ Stacked Chip Scale Package (Stacked-CSP) Architecture — 128-Mbit L18 Flash + 128-Mbit L18 Flash


    Original     		PDF 256-Mbit L18/L30) 48F3300L0YDQ0 48F3300L0ZDQ0 128-Mbit 48F3300L0YDQ0 48F3300L0ZDQ0 252633 INTEL STRATAFLASH 1.8V

    l18scsp

    Abstract: 128L18 48F3300L0YDQ0 48F3300L0ZDQ0 28F128L18 28F128L30 251902 RD48F3300L0YDQ0 INTEL STRATAFLASH
    Text: 256-Mbit 1.8 Volt Intel StrataFlash Wireless Memory L18/L30 Stacked-Chip Scale Package (x16) 48F3300L0YDQ0 (x16), 48F3300L0ZDQ0 (x16) Datasheet Product Features • ■ ■ Stacked Chip Scale Package (Stacked-CSP) Architecture — 128-Mbit L18 Flash + 128-Mbit L18 Flash


    Original     		PDF 256-Mbit L18/L30) 48F3300L0YDQ0 48F3300L0ZDQ0 128-Mbit l18scsp 128L18 48F3300L0YDQ0 48F3300L0ZDQ0 28F128L18 28F128L30 251902 RD48F3300L0YDQ0 INTEL STRATAFLASH

    29066

    Abstract: 28f3204
    Text: 3 Volt Advanced+ Stacked Chip Scale Package Memory 28F1602C3, 28F1604C3, 28F3204C3 Preliminary Datasheet Product Features • ■ ■ ■ Flash Memory Plus SRAM — Reduces Memory Board Space Required, Simplifying PCB Design Complexity Stacked Chip Scale Package Technology


    Original     		PDF 28F1602C3, 28F1604C3, 28F3204C3 16-Mbit 32-Mbit 29066 28f3204

    28F1602C3

    Abstract: 28F1604C3 28F3204C3 28F3208C3
    Text: 3 Volt Advanced+ Stacked Chip Scale Package Memory 28F1602C3, 28F1604C3, 28F3204C3, 28F3208C3 Preliminary Datasheet Product Features • ■ ■ ■ Flash Memory Plus SRAM — Reduces Memory Board Space Required, Simplifying PCB Design Complexity Stacked Chip Scale Package Technology


    Original     		PDF 28F1602C3, 28F1604C3, 28F3204C3, 28F3208C3 16-Mbit 32-Mbit 32-Mbit/4-Mbit, 16-Mbit/4-Mbit 28F1602C3 28F1604C3 28F3204C3 28F3208C3

    NAND FLASH BGA

    Abstract: BGA NAND Flash BGA PACKAGE thermal profile BGA-56P-M01 MCP NAND FBGA56 FBGA69 32M X 32 MEMORY FLASH BGA FBGA71
    Text: Stacked MCP Stacked Multi-Chip Package Stacked MCP is one of the most suitable chip scale packages for wireless applications. Its advantage is the compact stacked chip configuration. In the Flash memory and SRAM configuration, the pin layout can accomodate a 128 MB combination.Typical package construction


    Original     		PDF FBGA69) IR250 NAND FLASH BGA BGA NAND Flash BGA PACKAGE thermal profile BGA-56P-M01 MCP NAND FBGA56 FBGA69 32M X 32 MEMORY FLASH BGA FBGA71

    free mobile phone circuit diagram

    Abstract: mobile circuit diagram M6MGD137W34DWG MCE Semiconductor Mobile Phone Repeater repeater mobile circuit
    Text: Renesas LSIs RENESAS CONFIDENTIAL M6MGD137W34DWG 134,217,728-BIT 8,388,608-WORD BY 16-BIT CMOS FLASH MEMORY & 33,554,432-BIT (2,097,152-WORD BY 16-BIT) CMOS MOBILE RAM Stacked-CSP ( Chip Scale Package) Description The M6MGD137W34DWG is a Stacked Chip Scale Package


    Original     		PDF M6MGD137W34DWG 728-BIT 608-WORD 16-BIT) 432-BIT 152-WORD M6MGD137W34DWG 128M-bit 32M-bit free mobile phone circuit diagram mobile circuit diagram MCE Semiconductor Mobile Phone Repeater repeater mobile circuit

    Intel Stacked CSP

    Abstract: transistor a018 28F1602C3 28F1604C3 28F3204C3 28F3208C3 29066 28f160
    Text: 3 Volt Intel Advanced+ Stacked Chip Scale Package Memory 28F1602C3, 28F1604C3, 28F3204C3, 28F3208C3 Preliminary Datasheet Product Features • ■ ■ ■ Flash Memory Plus SRAM — Reduces Memory Board Space Required, Simplifying PCB Design Complexity Stacked Chip Scale Package Technology


    Original     		PDF 28F1602C3, 28F1604C3, 28F3204C3, 28F3208C3 Intel Stacked CSP transistor a018 28F1602C3 28F1604C3 28F3204C3 28F3208C3 29066 28f160

    29066

    Abstract: No abstract text available
    Text: 3 Volt Advanced+ Stacked Chip Scale Package Memory 28F1602C3, 28F1604C3, 28F3204C3, 28F3208C3 Preliminary Datasheet Product Features • ■ ■ ■ Flash Memory Plus SRAM — Reduces Memory Board Space Required, Simplifying PCB Design Complexity Stacked Chip Scale Package Technology


    Original     		PDF 28F1602C3, 28F1604C3, 28F3204C3, 28F3208C3 16-Mbit 32-Mbit 32-Mbit/8-Mbit 32-Mbit/4-Mbit, 29066

    Intel Stacked CSP

    Abstract: transistor 2N 5551 28F160C3 28F320C3 252636 RD28F1604C3BD70 2N2728
    Text: 3 Volt Intel Advanced+ Boot Block Flash Memory C3 Stacked-Chip Scale Package Family Datasheet Product Features • ■ ■ ■ Flash Memory Plus SRAM — Reduces Memory Board Space Required, Simplifying PCB Design Complexity Stacked-Chip Scale Package (StackedCSP) Technology


    Original     		PDF 16Mbit 32Mbit RD38F1010C0ZTL0 RD38F1010C0ZBL0 RD28F3208C3T90 RD38F1020C0ZTL0 RD28F3208C3B90 Intel Stacked CSP transistor 2N 5551 28F160C3 28F320C3 252636 RD28F1604C3BD70 2N2728

    mobile circuit diagram

    Abstract: transistor marking A21 A20 marking M6MGD13TW34DWG a7 moe free mobile phone circuit diagram
    Text: RENESAS LSIs M6MGD13TW34DWG 134,217,728-BIT 8,388,608-WORD BY 16-BIT CMOS FLASH MEMORY & 33,554,432-BIT (2,097,152-WORD BY 16-BIT) CMOS MOBILE RAM Stacked-CSP ( Chip Scale Package) Description The M6MGD13TW34DWG is a Stacked Chip Scale Package The M6MGD13TW34DWG is suitable for a high performance


    Original     		PDF M6MGD13TW34DWG 728-BIT 608-WORD 16-BIT) 432-BIT 152-WORD M6MGD13TW34DWG 128M-bit mobile circuit diagram transistor marking A21 A20 marking a7 moe free mobile phone circuit diagram

    free mobile phone circuit diagram

    Abstract: mobile phone circuit diagram mobile circuit diagram a7 moe
    Text: Renesas LSIs M6MGB/T64BM17AWG 67,108,864-BIT 4,194,304-WORD BY 16-BIT CMOS FLASH MEMORY 16,777,216-BIT (1,048,576-WORD BY 16-BIT) CMOS MOBILE RAM & Stacked-CSP ( Chip Scale Package) Description The M6MGB/T64BM17AWG is suitable for a high performance The M6MGB/T64BM17AWG is a Stacked Chip Scale


    Original     		PDF M6MGB/T64BM17AWG 864-BIT 304-WORD 16-BIT) 216-BIT 576-WORD M6MGB/T64BM17AWG 64M-bit free mobile phone circuit diagram mobile phone circuit diagram mobile circuit diagram a7 moe

    M6MGD137W34DWG-P

    Abstract: mobile circuit diagram MCE Semiconductor
    Text: Renesas LSIs M6MGD137W34DWG-P 134,217,728-BIT 8,388,608-WORD BY 16-BIT CMOS FLASH MEMORY & 33,554,432-BIT (2,097,152-WORD BY 16-BIT) CMOS MOBILE RAM Stacked-CSP ( Chip Scale Package) Description The M6MGD137W34DWG-P is a Stacked Chip Scale Package The M6MGD137W34DWG-P is suitable for a high


    Original     		PDF M6MGD137W34DWG-P 728-BIT 608-WORD 16-BIT) 432-BIT 152-WORD M6MGD137W34DWG-P 128M-bit mobile circuit diagram MCE Semiconductor

    mobile circuit diagram

    Abstract: mobile phone circuit diagram free mobile phone circuit diagram transistor marking A21 A20 marking
    Text: Renesas LSIs M6MGB/T64BM34CWG 67,108,864-BIT 4,194,304-WORD BY 16-BIT CMOS FLASH MEMORY 33,554,432-BIT (2,097,152-WORD BY 16-BIT) CMOS MOBILE RAM & Stacked-CSP ( Chip Scale Package) Description The M6MGB/T64BM34CWG is a Stacked Chip Scale The M6MGB/T64BM34CWG is suitable for a high


    Original     		PDF M6MGB/T64BM34CWG 864-BIT 304-WORD 16-BIT) 432-BIT 152-WORD M6MGB/T64BM34CWG 64M-bit mobile circuit diagram mobile phone circuit diagram free mobile phone circuit diagram transistor marking A21 A20 marking

    transistor marking A19

    Abstract: transistor marking A21 making a10
    Text: Renesas LSIs M6MGB/T64BS8AWG-P 67,108,864-BIT 4,194,304-WORD BY 16-BIT CMOS FLASH MEMORY 8,388,608-BIT (524,288-WORD BY 16-BIT) CMOS SRAM & Stacked-CSP (Chip Scale Package) Description The RENESAS M6MGB/T64BS8AWG-P is a Stacked Chip Scale Package (S-CSP) that contents 64M-bit Flash memory


    Original     		PDF M6MGB/T64BS8AWG-P 864-BIT 304-WORD 16-BIT) 608-BIT 288-WORD M6MGB/T64BS8AWG-P 64M-bit 67-pin transistor marking A19 transistor marking A21 making a10

    Untitled

    Abstract: No abstract text available
    Text: Renesas LSIs M6MGB/T64BS4AWG-P 67,108,864-BIT 4,194,304-WORD BY 16-BIT CMOS FLASH MEMORY 4,194,304-BIT (262,144-WORD BY 16-BIT) CMOS SRAM & Stacked-CSP (Chip Scale Package) Description The M6MGB/T64BS4AWG-P is a Stacked Chip Scale Package (S-CSP) that contents 64M-bit Flash memory and


    Original     		PDF M6MGB/T64BS4AWG-P 864-BIT 304-WORD 16-BIT) 304-BIT 144-WORD M6MGB/T64BS4AWG-P 64M-bit 67-pin

    RENESAS tft application notes

    Abstract: transistor marking A21 renesas sram marking
    Text: Renesas LSIs RENESAS M6MGB/T64BS8AWG CONFIDENTIAL 67,108,864-BIT 4,194,304-WORD BY 16-BIT CMOS FLASH MEMORY 8,388,608-BIT (524,288-WORD BY 16-BIT) CMOS SRAM & Stacked-CSP (Chip Scale Package) Description The RENESAS M6MGB/T64BS8AWG is a Stacked Chip Scale Package (S-CSP) that contents 64M-bit Flash memory


    Original     		PDF M6MGB/T64BS8AWG 864-BIT 304-WORD 16-BIT) 608-BIT 288-WORD M6MGB/T64BS8AWG 64M-bit 67-pin RENESAS tft application notes transistor marking A21 renesas sram marking

    transistor marking A21

    Abstract: mobile phone circuit diagram A20 marking mobile circuit diagram M6MGD13TW34DWG-P
    Text: Renesas LSIs M6MGD13TW34DWG-P 134,217,728-BIT 8,388,608-WORD BY 16-BIT CMOS FLASH MEMORY & 33,554,432-BIT (2,097,152-WORD BY 16-BIT) CMOS MOBILE RAM Stacked-CSP ( Chip Scale Package) Description The M6MGD13TW34DWG-P is a Stacked Chip Scale Package (S-CSP) that contents 128M-bit Flash memory and


    Original     		PDF M6MGD13TW34DWG-P 728-BIT 608-WORD 16-BIT) 432-BIT 152-WORD M6MGD13TW34DWG-P 128M-bit 32M-bit transistor marking A21 mobile phone circuit diagram A20 marking mobile circuit diagram

    AP-657

    Abstract: Intel Stacked CSP 28F1602C3 28F3204C3 29066
    Text: E PRODUCT PREVIEW 3 VOLT ADVANCED+ STACKED CHIP SCALE PACKAGE MEMORY 16-Mbit Flash + 2-Mbit SRAM - 28F1602C3 32-Mbit Flash + 4-Mbit SRAM - 28F3204C3 n n n n n Flash Memory Plus SRAM  Reduces Board Design Complexity n Stacked Die, Chip Scale Package  Smallest Possible Memory


    Original     		PDF 16-Mbit 28F1602C3 32-Mbit 28F3204C3 28F1602C3, AP-657 Intel Stacked CSP 28F1602C3 28F3204C3 29066

    FA18 transistor

    Abstract: No abstract text available
    Text: Renesas LSIs M6MGB/T64BS4AWG 67,108,864-BIT 4,194,304-WORD BY 16-BIT CMOS FLASH MEMORY 4,194,304-BIT (262,144-WORD BY 16-BIT) CMOS SRAM & Stacked-CSP (Chip Scale Package) Description The M6MGB/T64BS4AWG is a Stacked Chip Scale Package (S-CSP) that contents 64M-bit Flash memory and 4M-bit


    Original     		PDF M6MGB/T64BS4AWG 864-BIT 304-WORD 16-BIT) 304-BIT 144-WORD M6MGB/T64BS4AWG 64M-bit 67-pin FA18 transistor

    mobile phone circuit diagram

    Abstract: mobile circuit diagram transistor marking A21
    Text: Renesas LSIs M6MGB/T64BM34CWG-P 67,108,864-BIT 4,194,304-WORD BY 16-BIT CMOS FLASH MEMORY 33,554,432-BIT (2,097,152-WORD BY 16-BIT) CMOS MOBILE RAM & Stacked-CSP ( Chip Scale Package) Description The M6MGB/T64BM34CWG-P is a Stacked Chip Scale Package (S-CSP) that contents 64M-bit Flash memory and


    Original     		PDF M6MGB/T64BM34CWG-P 864-BIT 304-WORD 16-BIT) 432-BIT 152-WORD M6MGB/T64BM34CWG-P 64M-bit 32M-bit mobile phone circuit diagram mobile circuit diagram transistor marking A21

    Stacked Chip Scale Package

    Abstract: T166S2BWG 98000H-9FFFFH MITSUBISHI GATE ARRAY
    Text: MITSUBISHI LSIs M6MGB/T166S2BWG 16,777,216-BIT 1,048,576 -WORD BY 16-BIT CMOS 3.3V-ONLY FLASH MEMORY & 2,097,152-BIT (131,072-WORD BY 16-BIT) CMOS SRAM Stacked-CSP (Chip Scale Package) DESCRIPTION FEATURES The MITSUBISHI M6MGB/T166S2BWG is a Stacked Chip


    Original     		PDF M6MGB/T166S2BWG 216-BIT 16-BIT 152-BIT 072-WORD 16-BIT) M6MGB/T166S2BWG 16M-bits 72-pin Stacked Chip Scale Package T166S2BWG 98000H-9FFFFH MITSUBISHI GATE ARRAY

    M6MGB/T166S4BWG

    Abstract: M6MGT166S4
    Text: MITSUBISHI LSIs M6MGB/T166S4BWG 16,777,216-BIT 1,048,576 -WORD BY 16-BIT CMOS 3.3V-ONLY FLASH MEMORY & 4,194,304-BIT (262,144-WORD BY 16-BIT) CMOS SRAM Stacked-CSP (Chip Scale Package) DESCRIPTION FEATURES The MITSUBISHI M6MGB/T166S4BWG is a Stacked Chip


    Original     		PDF M6MGB/T166S4BWG 216-BIT 16-BIT 304-BIT 144-WORD 16-BIT) M6MGB/T166S4BWG 16M-bits 72-pin M6MGT166S4

    Untitled

    Abstract: No abstract text available
    Text: PRODUCT PREVIEW 3 VOLT ADVANCED+ STACKED CHIP SCALE PACKAGE MEMORY 16-Mbit Flash + 2-M bit SRAM - 28F1602C3 32-M bit Flash + 4-M bit SRAM - 28F3204C3 • Flash Memory Plus SRAM — Reduces Board Design Complexity ■ Stacked Die, Chip Scale Package — Smallest Possible Memory


    OCR Scan     		PDF 16-Mbit 28F1602C3 28F3204C3 32-Mbit 28F1602C3,