micromodule
Abstract: ST1305B 24x8 memory card circuit diagram
Text: ST1305B Memory Card IC 192 bit High Endurance EEPROM With Secure Logic Access Control DATA BRIEFING 1 Memory Divided Into: 1 • 1 Single Supply Voltage 5 V 1 ■ – 16 bits of Circuit Identification – 48 bits of Card Identification – 48 bits of Count Data
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ST1305B
DS05B07
micromodule
ST1305B
24x8
memory card circuit diagram
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ST1305B
Abstract: memory card circuit diagram
Text: ST1305B Memory Card IC 192 bit High Endurance EEPROM With Secure Logic Access Control DATA BRIEFING 1 Memory Divided Into: 1 • 1 Single Supply Voltage 5 V 1 ■ – 16 bits of Circuit Identification – 48 bits of Card Identification – 48 bits of Count Data
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ST1305B
DS05B07
ST1305B
memory card circuit diagram
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ST1305B
Abstract: 064d
Text: ST1305B High Endurance CMOS 192 bit EEPROM With Secure Logic Access Control BRIEF DATA • Memory Divided Into: 2 Programming Time: 5 ms 2 ■ Figure 1. Delivery Forms 2 Single 5 V Supply Voltage 2 ■ – 16 bits of Circuit Identification – 48 bits of Card Identification
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ST1305B
AI02468
ST1305B
AI02467
064d
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ST1305B
Abstract: ST1331 ST1333 ST1335 ST1336 ST16ST2G ST1200 ST133X
Text: Memory with Security for Memory Cards PRE-PAYMENT, VENDING, TELEPHONE CARDS, ID, TOKENS The ST133x family is a new and better alternative to all current telephone pre-payment ICs. These devices can be implemented in current systems by using an appropriate security module
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ST133x
ST16ST2G)
ST1305B
FLSC9815/0998
ST1200
ST1331
ST1333
ST1335
ST1336
ST16ST2G
ST1200
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MEXICO FUSE
Abstract: ST1335 AN1010 ST1305 ST1305B 128D AN1031R
Text: AN1010 APPLICATION NOTE Changing from the ST1305 to the ST1335 In Your Application The evolution of the application, from one that uses the ST1305 to one that uses the ST1335, is a relatively straightforward process. This document highlights the issues, and shows how the ST1335 is fully compatible with the ST1305 if the fields have been used in the conventional manner. First, the principle features
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AN1010
ST1305
ST1335
ST1335,
ST1335
ST1305
MEXICO FUSE
AN1010
ST1305B
128D
AN1031R
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ST1335
Abstract: AN1010 ST1305 ST1305B AN1031R st 104d
Text: AN1010 APPLICATION NOTE Changing from the ST1305 to the ST1335 In Your Application The evolution of the application, from one that uses the ST1305 to one that uses the ST1335, is a relatively straightforward process. This document highlights the issues, and shows how the ST1335 is fully compatible with the ST1305 if the fields have been used in the conventional manner. First, the principle features
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AN1010
ST1305
ST1335
ST1335,
ST1335
ST1305
AN1010
ST1305B
AN1031R
st 104d
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MIL-STD 833 test method 3015
Abstract: ST1305 M14C04 M14C16 ST1200 ST1305B ST1331 ST1333 ST1335 ST1336
Text: D10, D15, D20, D22, C20, C30 MICROMODULES Memory Micromodules General Information for D1, D2 and C Packaging • Micromodules were developed specifically for embedding in Smartcards and Memory Cards ■ The Micromodule provides: potting side contact side – Support for the chip
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footprint so44
Abstract: 9977 IC SOCKET TSOP48 TSOP32 FOOTPRINT ST1355 52 pin plcc socket ST19GF34 PSDSoft ST19AF08 serial flash 256Mb fast erase spi
Text: MEMORY SELECTOR Leading Edge Memories • 1999 GO Why a Broad Range? Leading Edge Memories OTP and UV EPROMs Flash Memories Serial and Parallel EEPROMs ASM and Memory Card ICs Memory Systems and NVRAMs BROAD RANGE STMicroelectronics is a world leader in non-volatile memories, manufacturing a broad
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operat911)
D-90449
BRMEMSEL/0699
footprint so44
9977
IC SOCKET TSOP48
TSOP32 FOOTPRINT
ST1355
52 pin plcc socket
ST19GF34
PSDSoft
ST19AF08
serial flash 256Mb fast erase spi
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SMARTCARD micromodule assembly
Abstract: ST14C02 M14C04 M14C16 M14C32 M14C64 ST1200 ST1305B ST1331 ST1333
Text: SUPER 35 MM MICROMODULES Super 35 mm Micromodules for Smartcards and Memory Cards DATA BRIEFING • Micromodules were developed specifically for embedding in Smartcards and Memory Cards ■ The Micromodule provides: potting side 1 1 1 1 1 1 – Support for the chip
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2702 eprom
Abstract: ST1305B ST1331 ISO/IEC 7816-1 micromodule MICROMODULES M14C04 M14C16 ST1200 ST1333
Text: D10, D15, D20, D22, C20, C30 MICROMODULES Memory Micromodules General Information for D1, D2 and C Packaging • Micromodules were developed specifically for embedding in Smartcards and Memory Cards ■ The Micromodule provides: potting side contact side – Support for the chip
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TAG 9109
Abstract: M35080 M95256 equivalent TSOP48 outline EEPROM 16MB NVRAM 1KB TSOP40 "dual access" "nonvolatile memory" -RFID ST1335 asm eagle
Text: MEMORY SELECTOR Leading Edge Memories • Fall 1998 GO Why a Broad Range? Leading Edge Memories Flash Memories Serial and Parallel EEPROMs Application Specific Memories UV and OTP EPROMs Non-Volatile RAMs BROAD RANGE STMicroelectronics is a world leader in
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286-CJ103
TAG 9109
M35080
M95256 equivalent
TSOP48 outline
EEPROM 16MB
NVRAM 1KB
TSOP40
"dual access" "nonvolatile memory" -RFID
ST1335
asm eagle
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1305B
Abstract: No abstract text available
Text: ST1305B Memory Card IC 192 bit High Endurance EEPROM With Secure Logic Access Control DATA BRIEFING • Single S upply Voltage 5 V ■ M em ory Divided Into: - 16 bits of C ircuit Identification - 48 bits of Card Identification - 48 bits of C ount Data -
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OCR Scan
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ST1305B
ST1305B
1305B
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