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    SPICE MODEL TUNNEL DIODE Search Results

    SPICE MODEL TUNNEL DIODE Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    CUZ24V Toshiba Electronic Devices & Storage Corporation Zener Diode, 24 V, USC Visit Toshiba Electronic Devices & Storage Corporation
    XCUZ13V Toshiba Electronic Devices & Storage Corporation Zener Diode, 13.0 V, USC Visit Toshiba Electronic Devices & Storage Corporation
    XCUZ36V Toshiba Electronic Devices & Storage Corporation Zener Diode, 36.0 V, USC Visit Toshiba Electronic Devices & Storage Corporation
    CUZ12V Toshiba Electronic Devices & Storage Corporation Zener Diode, 12 V, USC Visit Toshiba Electronic Devices & Storage Corporation
    MUZ5V6 Toshiba Electronic Devices & Storage Corporation Zener Diode, 5.6 V, USM Visit Toshiba Electronic Devices & Storage Corporation

    SPICE MODEL TUNNEL DIODE Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    TUNNEL DIODE

    Abstract: mbd1057 MBD3057 MBD2057 MBD-1057 Characteristics curve of diode TUNNEL DIODE spice model "tunnel diode" diode tunnel tunnel
    Text: 1 Spice Model for Metelics Tunnel Diode Spice does not contain a model for the Tunnel Diode. To correct this omission, use the macromodel shown below. Anode 1 C1 G1 Cathode (2) G1 models the reverse and forward bias IV curve. The model does not accurately represent the negative


    Original     		PDF MBD1057 MBD1057 3E-12 7203328E-5 MBD2057 MBD3057 MBD4057 MBD5057 TUNNEL DIODE MBD-1057 Characteristics curve of diode TUNNEL DIODE spice model "tunnel diode" diode tunnel tunnel

    Tunnel diode

    Abstract: MBD1057 DATASHEET TUNNEL DIODE "tunnel diode" MBD3057 TUNNEL DIODE spice model Characteristics curve of diode MBD2057 switch diode tunnel MBD-1057
    Text: Spice Model for Metelics Tunnel Diode 1 Spice does not contain a model for the Tunnel Diode. To correct this omission, use the macromodel shown below. E1, R1, D2 and G1 model the reverse bias curve and the forward bias curve through the valley. D1 models the forward bias curve beyond the valley. The model does not accurately represent the negative differential


    Original     		PDF MBD1057 MBD1057 3E-12 263E-6 3533E-3 688E-3 Tunnel diode DATASHEET TUNNEL DIODE "tunnel diode" MBD3057 TUNNEL DIODE spice model Characteristics curve of diode MBD2057 switch diode tunnel MBD-1057

    spice model Tunnel diode

    Abstract: dpsN TUNNEL DIODE spice model
    Text: 0.6 µm Process XT06 MIXED-SIGNAL FOUNDRY EXPERTS 0.6 Micron Modular Trench Isolated SOI CMOS Technology Description The XT06 Series completes X-FAB's 0.6 Micron Modular Mixed Signal Technology. XT06 uses dielectric isolation on SOI wafers. This allows unrestricted 60 V high and low side operation


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    CMOS

    Abstract: hv 102 mos fet transistor varactor diode model in ADS bsim3 ADS varactor diode 0.18 micron 1.8V pspice model BSIM3V3 bsim3 model bsim3 model for 0.18 micron technology for hspice N-Channel jfet 100V depletion
    Text: 0.6 m CMOS Process XC06 MIXED-SIGNAL FOUNDRY EXPERTS 0.6 Micron Modular Mixed Signal Technology Description Key Features The XC06 Series completes X-FAB‘s 0.6 Micron Modular Mixed Signal Technology with embedded Non Volatile Memory and High Voltage options.


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    TUNNEL DIODE

    Abstract: oscillator tunnel diode "tunnel diode" oscillator "tunnel diode" tunnel diode application TUNNEL DIODE spice model DATASHEET TUNNEL DIODE Design Guidelines for Quartz Crystal Oscillators negative resistance amplifier oscillator tunnel diode datasheet
    Text: Crystal Oscillator Design And Negative Resistance by Anthony M Scalpi, Cypress Semiconductor Timing is a critical part of almost every electronics application. Communication and data transfer generally require a reference signal or source to enable system synchronization


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    hot wire anemometer

    Abstract: TA7802 G43-87 THE POWER OF MYTH JESD 51-7, ambient measurement FLUID level measurement kapton 5413 G30-88 G38-87 G42-88
    Text: u Chapter 5 Package Characterization CHAPTER 5 PACKAGE CHARACTERIZATION Introduction Terminology Measurement Methods Thermal Characterization Parameter ψJT Thermal Test Boards Thermal Data Reports Electrical Characterization Methodology Bond Wire Series Inductance and Resistance


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    high resolution reflective optocoupler

    Abstract: 894nm motion sensor doppler effect Balluff ROTARY ENCODER vcsel 1300nm VCSEL multimode 1300nm vcsel spice model motion DOPPLER 1550nm vcsels VCSEL
    Text: VCSELs in Various Sensor Applications By: Dr. Jim Tatum First published in Proceedings of Sensors Expo 2005 FINISAR CORPORATION January 9, 2007 Contents VCSEL 101 ƒ What is a VCSEL? Where is it used? Why? VCSEL Sensor Attributes ƒ Advantages, Uniqueness, etc.


    Original     		PDF 850nm 1300nm 780nm 1550nm 1999m 650nm 1550nm high resolution reflective optocoupler 894nm motion sensor doppler effect Balluff ROTARY ENCODER vcsel 1300nm VCSEL multimode 1300nm vcsel spice model motion DOPPLER 1550nm vcsels VCSEL

    CMOS

    Abstract: No abstract text available
    Text: 1.0 m CMOS Process XC10 MIXED-SIGNAL FOUNDRY EXPERTS One Micron Modular Mixed Signal Technology Description Key Features Applications Quality Assurance Deliverables The XC10 Series is X-FAB‘s One-Micron Modular Mixed Signal Technology. Main target applications


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    NMOS depletion pspice model

    Abstract: NMOS MODEL PARAMETERS SPICE "X-Fab" Core cell library PSPICE MODEL R2R bsim3 ADS bsim3 model SPECTRE MODEL QS 100 NPN Transistor RP20 analog devices transistor tutorials
    Text: 1.0 m CMOS Process XC10 MIXED-SIGNAL FOUNDRY EXPERTS One Micron Modular Mixed Signal Technology Description Key Features Applications Quality Assurance Deliverables The XC10 Series is X-FAB‘s One-Micron Modular Mixed Signal Technology. Main target applications


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    AN-1059

    Abstract: IRF6603 IRF6607 mathematical calculator chip PD-94574A
    Text: Application Note AN-1059 DirectFET Technology Thermal Model and Rating Calculator Table of Contents Page Introduction. 2 Equivalent circuits . 3 Thermal resistance values . 3


    Original     		PDF AN-1059 AN-1059 IRF6603 IRF6607 mathematical calculator chip PD-94574A

    hot electron devices

    Abstract: SGS-Thomson ball grid array VLSI Vision
    Text: CHAPTER 6 TOWARDS THE FUTURE “Tomorrow will differ from yesterday. It will be new and depend on us. It is to be invented more than discovered” 6.1 VISION Vision 2000 By the year 2000, be among the top world suppliers and be recognized as the “best-inclass” in service and environmental protection,


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    AN1059

    Abstract: mathematical calculator chip AN-1059 IRF6601 IRF6602 IRF6603 IRF6604 IRF6607 IRF6608 IRF6618
    Text: Application Note AN-1059 DirectFET Thermal Model and Rating Calculator By Doug Butchers Table of Contents Page Introduction . 1 Thermal Circuit for DirectFETs in application . 1


    Original     		PDF AN-1059 AN1059 mathematical calculator chip AN-1059 IRF6601 IRF6602 IRF6603 IRF6604 IRF6607 IRF6608 IRF6618

    LMC662 equivalent spice model

    Abstract: LMV211 LF356 FET input op-amp LF356 op-amp application fast photodiode amplifier photodiode amplifier AN1244 LF356 LF411 LMH6624
    Text: Photodiode Amplifiers: Changing Light Into Electricity INTRODUCTION [slide 1] MODERATOR: Hello and welcome to National Semiconductor’s Online Seminar. We recommend using Internet Explorer for viewing these events. Please select your preferred media player,


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    ISO STANDARDS SHEET METAL THINNING

    Abstract: TRANSISTOR SUBSTITUTION 1993 MARKING CODE N-CHANNEL MOS FIELD EFFECT TRANSISTOR SGS-Thomson zener smd eurotherm ST marking code crolles eurotherm 451 ALL TYPE IC DATA AND manual substitution BOOK IEC 68-2-27 spectrometer U.S.A Eurotherm Controls
    Text: SURE 7 Semiconductor Users Reliability Evaluation Quality and Reliability Program Published by SGS-THOMSON Quality and Reliability Management “YOU HAVE MY WORD ON IT” As I noted in SURE 6, service is the number one strategic priority at SGS-THOMSON. We consider service as a


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    qfn 3x3 tray dimension

    Abstract: XCDAISY BFG95 XC5VLX330T-1FF1738I pcb footprint FS48, and FSG48 WS609 jedec so8 Wire bond gap XC3S400AN-4FG400I FFG676 XC4VLX25 cmos 668 fcbga
    Text: Device Package User Guide [Guide Subtitle] [optional] UG112 v3.5 November 6, 2009 [optional] R R Xilinx is disclosing this user guide, manual, release note, and/or specification (the "Documentation") to you solely for use in the development of designs to operate with Xilinx hardware devices. You may not reproduce, distribute, republish, download, display, post, or transmit the


    Original     		PDF UG112 UG072, UG075, XAPP427, qfn 3x3 tray dimension XCDAISY BFG95 XC5VLX330T-1FF1738I pcb footprint FS48, and FSG48 WS609 jedec so8 Wire bond gap XC3S400AN-4FG400I FFG676 XC4VLX25 cmos 668 fcbga

    xilinx topside marking

    Abstract: xilinx part marking pcb footprint FS48, and FSG48 smd code v36 CF1752 reballing recommended layout CSG324 BGA reflow guide XC2VP7 reflow profile SMD MARKING CODE C1G
    Text: Device Package User Guide [Guide Subtitle] [optional] UG112 v3.6 September 22, 2010 [optional] R R Xilinx is disclosing this user guide, manual, release note, and/or specification (the "Documentation") to you solely for use in the development of designs to operate with Xilinx hardware devices. You may not reproduce, distribute, republish, download, display, post, or transmit the


    Original     		PDF UG112 UG072, UG075, XAPP427, xilinx topside marking xilinx part marking pcb footprint FS48, and FSG48 smd code v36 CF1752 reballing recommended layout CSG324 BGA reflow guide XC2VP7 reflow profile SMD MARKING CODE C1G

    xilinx part marking

    Abstract: xilinx topside marking UG112 qfn 3x3 tray dimension FGG484 HQG160 reballing top marking 957 so8 FF1148 fcBGA PACKAGE thermal resistance
    Text: Device Package User Guide [Guide Subtitle] [optional] UG112 v3.2 March 17, 2009 [optional] R R Xilinx is disclosing this user guide, manual, release note, and/or specification (the "Documentation") to you solely for use in the development of designs to operate with Xilinx hardware devices. You may not reproduce, distribute, republish, download, display, post, or transmit the


    Original     		PDF UG112 UG072, UG075, XAPP427, xilinx part marking xilinx topside marking UG112 qfn 3x3 tray dimension FGG484 HQG160 reballing top marking 957 so8 FF1148 fcBGA PACKAGE thermal resistance

    XILINX/part marking Hot

    Abstract: SMT, FPGA FINE PITCH BGA 456 BALL PC84/PCG84 XCDAISY TT 2076 XC2VP7 reflow profile SPARTAN-II xc2s50 pq208 sn63pb37 solder SPHERES qfn 3x3 tray dimension HQG160
    Text: Device Package User Guide [Guide Subtitle] [optional] UG112 v3.4 June 10, 2009 [optional] R R Xilinx is disclosing this user guide, manual, release note, and/or specification (the "Documentation") to you solely for use in the development of designs to operate with Xilinx hardware devices. You may not reproduce, distribute, republish, download, display, post, or transmit the


    Original     		PDF UG112 UG072, UG075, XAPP427, XILINX/part marking Hot SMT, FPGA FINE PITCH BGA 456 BALL PC84/PCG84 XCDAISY TT 2076 XC2VP7 reflow profile SPARTAN-II xc2s50 pq208 sn63pb37 solder SPHERES qfn 3x3 tray dimension HQG160

    ASX 12 D Germanium Transistor

    Abstract: 1394 audio subunit domino logic,dynamic logic ibm 6X86MX IBM-6x86MX Japan dvd cjc Transistor Data Book nand flash HET PR333 PR300 APPLE LM INVERTER
    Text: v ol 4 3 ume A publication of IBM Microelectronics IBM’s Blue Logic Strategy In This Issue Third Quarter 1998, Vol. 4, No.3 1 IBM’s Blue Logic Strategy 4 High-Speed Design Styles Leverage IBM Technology Prowess 8 Low-Power Methodology and Design Techniques


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    induction cooker fault finding diagrams

    Abstract: induction cooker schematic diagram EDS SHIELD DOMESTIC GAS DETECTOR schematic diagram induction cooker 3 gun sound generator UM 3562 NEC plasma tv schematic diagram ultrasonic flaw detector LS 2027 Final Audio LS 2027 audio Ultrasonic humidifier circuit
    Text: To our customers, Old Company Name in Catalogs and Other Documents On April 1st, 2010, NEC Electronics Corporation merged with Renesas Technology Corporation, and Renesas Electronics Corporation took over all the business of both companies. Therefore, although the old company name remains in this document, it is a valid


    Original     		PDF C12769EJ2V0IF induction cooker fault finding diagrams induction cooker schematic diagram EDS SHIELD DOMESTIC GAS DETECTOR schematic diagram induction cooker 3 gun sound generator UM 3562 NEC plasma tv schematic diagram ultrasonic flaw detector LS 2027 Final Audio LS 2027 audio Ultrasonic humidifier circuit

    relay 12 volts ras 1210

    Abstract: GE-MOV 275L40B MOV GE V150 LA10 275l40b Disc ceramic capacitor GE 130L20 hahn transformer VDE 0551 ge 130l10 c106d spice HARRIS V481DB40 G1 capacitor 275L20
    Text: $5.00 Technical Assistance Transient Voltage Suppression Technical Assistance Electronic Technical Support Ask our experienced staff of engineers for assistance with: Electronic services from Littelfuse offer you the most current information possible. • Device Selection


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    IPC-T-50

    Abstract: electrode oven calibration certificate formats JEDEC JESD22-B116 free laser guided door opener project report MIL-STD-883H Ultrasonic humidifier transducer NCSL Z540.3 Ultrasonic Atomizing Transducer laser diode spectra physics DIODE IN 4002 424
    Text: The documentation and process conversion measures necessary to comply with this revision shall be completed by 30 September 2010. INCH - POUND MIL-STD-883H 26 February 2010 SUPERSEDING MIL-STD-883G 28 February 2006 DEPARTMENT OF DEFENSE TEST METHOD STANDARD


    Original     		PDF MIL-STD-883H MIL-STD-883G STD883 IPC-T-50 electrode oven calibration certificate formats JEDEC JESD22-B116 free laser guided door opener project report MIL-STD-883H Ultrasonic humidifier transducer NCSL Z540.3 Ultrasonic Atomizing Transducer laser diode spectra physics DIODE IN 4002 424

    TMPRFE2G5

    Abstract: MARS2G5 bey34 DIODE BA40 LVTTL25
    Text: Hardware Design Guide September 8, 2004 MARS2G5 P-VC-XTRM TMPRFE2G5 Datamapper 2488/622/155 Mbits/s SONET/SDH x 10/100/1000 Mbits/s Ethernet 1 Introduction The documentation package for the Datamapper device consists of the following documents, available on a password protected website:


    Original     		PDF DS04-011MPIC TMPRFE2G5 MARS2G5 bey34 DIODE BA40 LVTTL25

    ORCA ORT42G5

    Abstract: No abstract text available
    Text: ORCA ORT42G5 and ORT82G5 3.7 Gbits/s XAUI and 4.25 Gbits/s FC FPSCs November 2003 Data Sheet Introduction Lattice Semiconductor has developed a family of next generation FPSCs intended for high-speed serial backplane data transmission. Built on the Series 4 reconfigurable embedded System-on-a-Chip SoC architecture, the


    Original     		PDF ORT42G5 ORT82G5 ORT82G5 ORT42G5-2BM484ES ORT42G5-1BM484ES ORT82G5-2BM680I ORT82G5-1BM680I ORCA ORT42G5