Untitled
Abstract: No abstract text available
Text: Package outline DFN1714-8: plastic, thermal enhanced extremely thin small outline package; no leads; 8 terminals; body 1.35 x 1.7 x 0.5 mm SOT972-2 X A B D A E A1 c terminal 1 index area detail X terminal 1 index area e e1 1 6 C C A B C v w b y1 C y L k Eh
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DFN1714-8:
OT972-2
sot972-2
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DIP8
Abstract: SOT97-1 MO-001 SC-504-8
Text: PDF: 2000 Jan 04 Philips Semiconductors Package outline DIP8: plastic dual in-line package; 8 leads 300 mil SOT97-1 ME seating plane D A2 A A1 L c Z w M b1 e (e 1) b MH b2 5 8 pin 1 index E 1 4 5 10 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions)
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PDF
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OT97-1
050G01
MO-001
SC-504-8
DIP8
SOT97-1
MO-001
SC-504-8
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Untitled
Abstract: No abstract text available
Text: Package outline HXSON8: plastic thermal enhanced extremely thin small outline package; no leads; 8 terminals; body 1.35 x 1.7 x 0.5 mm SOT972-1 X B D A E A A1 c terminal 1 index area detail X e1 1/2 e terminal 1 index area v w b e 1 4 M M C C A B C y y1 C
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OT972-1
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Untitled
Abstract: No abstract text available
Text: Package outline HXSON16: plastic thermal enhanced extremely thin small outline package; no leads; 16 terminals; body 1.35 x 3.3 x 0.5 mm SOT974-1 X B D A E A A1 c terminal 1 index area detail X e1 terminal 1 index area e v w b 1/2 e 1 8 M M C C A B C y y1 C
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HXSON16:
OT974-1
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Untitled
Abstract: No abstract text available
Text: Package outline DIP8: plastic dual in-line package; 8 leads 300 mil SOT97-1 ME seating plane D A2 A A1 L c Z w M b1 e (e 1) b 5 8 MH b2 pin 1 index E 1 4 5 10 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT A max. A1
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OT97-1
050G01
MO-001
SC-504-8
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SOT97-1
Abstract: SOT-97
Text: Philips Semiconductors Package outlines DIP8: plastic dual in-line package; 8 leads 300 mil 1995 Feb 04 5-4 SOT97-1
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OT97-1
SOT97-1
SOT-97
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pmfp
Abstract: SO8 package MS-012AA VSO40 SOT176-1 075E03 SOT144-1
Text: PACKAGE INFORMATION Page Index DIP PMFP SO VSO Soldering - Philips Semiconductors Package information Package outlines INDEX NAME DESCRIPTION VERSION DIP dual in-line package DIP8 plastic dual in-line package; 8 leads (300 mil) SOT97-1
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OT97-1
DIP16
OT38-1
OT144-1
OT96-1
OT96-2
OT158-2
pmfp
SO8 package
MS-012AA
VSO40
SOT176-1
075E03
SOT144-1
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Untitled
Abstract: No abstract text available
Text: Package outline DIP8: plastic dual in-line package; 8 leads 300 mil SOT97-2 ME seating plane D A2 A A1 L e Z c w b1 (e1) b MH b2 8 5 pin 1 index E 1 4 2.5 5 mm scale Dimensions (inch dimensions are derived from the original dimensions) Unit(1) mm max nom
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OT97-2
MO-001
sot097-2
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Untitled
Abstract: No abstract text available
Text: Reflow soldering footprint Footprint information for reflow soldering of HXSON16 package SOT974-2 Hx Gx D 0.05 P 0.05 Ay SPy By Gy SPy tot SLy nSPy Hy nSPx SPx SPx tot SLx Generic footprint pattern Refer to the package outline drawing for actual layout solder land
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HXSON16
OT974-2
sot974-2
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sot979
Abstract: No abstract text available
Text: Ceramic packages for RF Power Transistors SOT975B L x W x H (mm SOT538A (5.5 x 4.1 x 2.2 (mm) SOT1227A (7.1 x 6.9 x 3.3 (mm) SOT975C (7.1 x 6.9 x 3.3 (mm) (14.0 x 4.1 x 2.9 (mm) SOT1227B SOT467B (9.7 x 5.8 x 4.3 (mm) SOT467C (20.3 x 5.8 x 4.3 (mm)
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OT975B
OT538A
OT1227A
OT975C
OT1227B
OT467B
OT467C
OT1228A
OT1228B
OT608A
sot979
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Untitled
Abstract: No abstract text available
Text: Package outline HXSON12: plastic thermal enhanced extremely thin small outline package; no leads; 12 terminals; body 1.35 x 2.5 x 0.5 mm SOT973-1 X B D A E A A1 c terminal 1 index area detail X e1 e terminal 1 index area v w b 1/2 e 1 6 M M C C A B C y y1 C
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HXSON12:
OT973-1
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VDMOS
Abstract: BLF574 BLF647 BLF878 220v to 12v inverters circuit diagrams BLF278 NXP blf368 BLF861 blf246b sot121B package
Text: Broadcast and ISM product portfolio Product type Package UHF 470-860 MHz BLF878 SOT979A BLF878 SOT979A BLF871 SOT467C BLF871 SOT467C BLF861A SOT540A General purpose < 2 GHz BLF647 SOT540A BLF2045 SOT467C BLF1822-10 SOT467C BLF1043 SOT538A BLF871 SOT467C
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BLF878
OT979A
BLF871
OT467C
BLF861A
OT540A
VDMOS
BLF574
BLF647
BLF878
220v to 12v inverters circuit diagrams
BLF278 NXP
blf368
BLF861
blf246b
sot121B package
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SC-504-8
Abstract: MO-001 050G01 sc5048 SOT97-1
Text: PDF: 2003 Feb 18 Philips Semiconductors Package outline DIP8: plastic dual in-line package; 8 leads 300 mil SOT97-1 ME seating plane D A2 A A1 L c Z w M b1 e (e 1) b MH b2 5 8 pin 1 index E 1 4 5 10 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions)
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Original
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PDF
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OT97-1
050G01
MO-001
SC-504-8
SC-504-8
MO-001
050G01
sc5048
SOT97-1
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Untitled
Abstract: No abstract text available
Text: Philips Semiconductors Package outlines DIP8: plastic dual in-line package; 8 leads 300 mil 1995 Feb 04 3080 SOT97-1
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OT97-1
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Untitled
Abstract: No abstract text available
Text: Reflow soldering footprint Footprint information for reflow soldering of HXSON12 package SOT973-2 Hx Gx D 0.05 P 0.05 Ay Gy SPy By SPy tot SLy nSPy Hy nSPx SPx SPx tot SLx Generic footprint pattern Refer to the package outline drawing for actual layout solder land
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HXSON12
OT973-2
sot973-2
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Untitled
Abstract: No abstract text available
Text: HX SO N1 2 SOT973-2 HXSON12U; Reel pack; SMD, 7" Q1/T1 Standard product orientation Orderable part number ending ,115 or X Ordering code 12NC ending 115 Rev. 1 — 23 April 2013 Packing information 1. Packing method Printed plano box Barcode label Reel Tape
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OT973-2
HXSON12U;
001aak603
OT973-2
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Untitled
Abstract: No abstract text available
Text: SOT972-2 Standard product orientation 12NC ending 115 Rev. 01 — 28 July 2011 Packing information 1. Packing method Fig. 1 Package version 12NC ending Reel dimensions d x w mm SPQ/PQ (pcs) Reels per box Outer box dimensions l x w x h (mm) SOT972-2 115 180 x 8
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OT972-2
OT972-2
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SOT97-1
Abstract: No abstract text available
Text: Philips Semiconductors Package outlines DIP8: plastic dual in-line package; 8 leads 300 mil 1995 Feb 04 SOT97-1 1
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OT97-1
SOT97-1
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P8563
Abstract: NXP 8563T 8563t PCF8563T PCF8563P 8563S
Text: PCF8563 Real-time clock/calendar Rev. 10 — 3 April 2012 Product data sheet 1. General description The PCF8563 is a CMOS1 Real-Time Clock RTC and calendar optimized for low power consumption. A programmable clock output, interrupt output, and voltage-low detector are
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PCF8563
PCF8563
P8563
NXP 8563T
8563t
PCF8563T
PCF8563P
8563S
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P82B715 equivalent
Abstract: No abstract text available
Text: P82B715 I2C-bus extender Rev. 08 — 9 November 2009 Product data sheet 1. General description The P82B715 is a bipolar IC intended for application in I2C-bus and derivative bus systems. While retaining all the operating modes and features of the I2C-bus it permits
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P82B715
P82B715
771-P82B715TD-T
P82B715TD-T
P82B715 equivalent
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Philips 9708
Abstract: sot248 philips HE 4071 BP T313-2 T-238
Text: Philips Semiconductors Package outlines OIP8: plastic dual in-line package; 8 leads 300 mil 1 1 • » 5 ■ I SOT97-1 10 mm ■ ■ I ■ » scale DIM ENSIONS (inch dim ensions are derived from the original mm dim ensions) UNIT A max. Ai min. A2 max. b
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PDF
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OT97-1
050G01
MO-001
OT355-1
MO-153AD
Philips 9708
sot248
philips HE 4071 BP
T313-2
T-238
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PHILIPS OQ 0501
Abstract: philips OQ 051 oq 0066 oq 0051 PHILIPS 036 M/HD 780 footprint jedec MS-026 TQFP mo-001 packages philips
Text: Philips Semiconductors Package information Package outlines INDEX DESCRIPTION NAME VERSION PAGE DIP dual in-line package plastic dual in-line package; 8 leads (300 mil) plastic dual in-line package; 14 leads (300 mil) SOT97-1 1327 SOT27-1 1328 DIP16 plastic dual in-line package; 16 leads (300 mil); long body
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PDF
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DIP14
DIP16
DIP18
DIP20
DIP24
DIP28
DIP40
LQFP32
PHILIPS OQ 0501
philips OQ 051
oq 0066
oq 0051
PHILIPS 036
M/HD 780
footprint jedec MS-026 TQFP
mo-001 packages philips
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sot267
Abstract: No abstract text available
Text: Philips Semiconductors Package information Package outlines INDEX VERSION DESCRIPTION NAME PAGE DIP dual in-line package DIP8 plastic dual in-line package; 8 leads (300 mil) SOT97-1 ; SOT97 593 DIP16 plastic dual in-line package; 16 leads (300 mil); long body
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OCR Scan
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PDF
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DIP16
DIP20
DIP24
DIP28
DIP40
OT97-1
OT38-1
OT146-1
OT101-1;
OT101B
sot267
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A 3120 optocoupler
Abstract: 3120 8 pin optocoupler OPTOCOUPLER dc t4183e CNS35 sot97f
Text: b fe > 5 3 ,ì 3 i DEVELOPMENT DATA Q o a a a ? 1! t • CNS35 This data sheet contain» advance Inform ation and specifications ara subject »o change w ith o u t notice. N AMER PHILIPS/DISCRETE SSE D DUAL OPTOCOUPLER The CNS35 is a DUALoptocouplerin a SOT97F dual-in-line D1L 8 pin plastic envelope. Itconsistsof
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CNS35
OT97F
CNS35
T-41-83
7Z22784
A 3120 optocoupler
3120 8 pin optocoupler
OPTOCOUPLER dc
t4183e
sot97f
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