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    SOT56 Price and Stock

    Bourns Inc CDSOT563-T05C

    TVS DIODE 5VWM 12VC SOT563
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    DigiKey CDSOT563-T05C Reel
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    Avnet Americas CDSOT563-T05C Reel 12,000
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    Avnet Abacus CDSOT563-T05C 143 Weeks 3,000
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    Bourns Inc CDSOT563-0502

    TVS DIODE 5VWM 9VC SOT563
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    DigiKey CDSOT563-0502 Reel
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    Newark CDSOT563-0502 Bulk 12,000
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    RS CDSOT563-0502 Bulk 28 Weeks 12,000
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    Avnet Abacus CDSOT563-0502 143 Weeks 3,000
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    Master Electronics CDSOT563-0502
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    PanJit Semiconductor PJX138K-R1-00001

    MOSFETs SOT563 N CHAN 50V
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    TTI PJX138K-R1-00001 Reel 60,000 4,000
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    PanJit Semiconductor PJX8603-R1-00001

    MOSFETs SOT563 DUAL CHAN 60V
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    TTI PJX8603-R1-00001 Reel 60,000 4,000
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    ROHM Semiconductor EM6K34T2CR

    MOSFETs 0.9V Drive Nch MOSFET
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    TTI EM6K34T2CR Reel 56,000 8,000
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    Find more SOT56 price and stock on Findchips.com

    SOT56 Datasheets (13)

    Part ECAD Model Manufacturer Description Curated Datasheet Type PDF
    SOT560-1 NXP Semiconductors Plastic thermal enhanced bottom chip carrier; 32 terminals; body 5 x 5 x 0.65 mm Original PDF
    SOT560-1 NXP Semiconductors Footprint for reflow soldering SOT560-1 Original PDF
    SOT-563 SYNC Power OUTLINE Original PDF
    SOT564-1 NXP Semiconductors Footprint for reflow soldering SOT564-1 Original PDF
    SOT564-1 NXP Semiconductors Plastic thermal enhanced bottom chip carrier; 24 terminals; body 4 x 4 x 0.65 mm Original PDF
    SOT566-1 NXP Semiconductors Plastic, heatsink small outline package; 24 leads Original PDF
    SOT566-2 NXP Semiconductors Plastic, heatsink small outline package; 24 leads; low stand-off height Original PDF
    SOT566-3 NXP Semiconductors Plastic, heatsink small outline package; 24 leads; low stand-off height Original PDF
    SOT567a NXP Semiconductors leadless surface mounted package; plastic cap; 8 terminations Original PDF
    SOT569-1 NXP Semiconductors Footprint for reflow soldering SOT569-1 Original PDF
    SOT569-1 NXP Semiconductors Plastic thin fine-pitch ball grid array package; 144 balls; body 12 x 12 x 0.8 mm Original PDF
    SOT569-2 NXP Semiconductors Footprint for reflow soldering SOT569-2 Original PDF
    SOT569-2 NXP Semiconductors Plastic thin fine-pitch ball grid array package; 144 balls Original PDF

    SOT56 Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    1E70

    Abstract: TMP102 TMP102AIDRLR TMP102AIDRLRG4 TMP275 TMP75 marking p7 sot563
    Text: TMP102 www.ti.com . SBOS397B – AUGUST 2007 – REVISED OCTOBER 2008 Low Power Digital Temperature Sensor With SMBus /Two-Wire Serial Interface in SOT563


    Original     		PDF TMP102 SBOS397B OT563 OT563 1E70 TMP102 TMP102AIDRLR TMP102AIDRLRG4 TMP275 TMP75 marking p7 sot563

    15KV

    Abstract: No abstract text available
    Text: LITE-ON SEMICONDUCTOR L02ESD5V0F6-5 STAND-OFF VOLTAGE - 5.0 Volts POWER DISSIPATION - 25 WATTS UNIDIRECTIONAL ESD PROTECTION DIODE GENERAL DESCRIPTION SOT563 The ESD5V0F6-5 is a low capacitance 5-fold ESD array in the ultra small SOT666 plastic package designed to protect up to


    Original     		PDF L02ESD5V0F6-5 OT563 OT666 100mV 15KV

    Untitled

    Abstract: No abstract text available
    Text: DIP Adapter EVM Simplifies prototyping SMT ICs Supports SOIC-8 U , TSSOP-8 (PW), MSOP-8 (DGK), SOT23-6 (DBV), SC70-6 (DCK) and SOT563-6 (DRL) packages Usage Instructions Solder IC(s) to adapter pcb. Parts may be hand soldered or attached with IR or hot air reflow


    Original     		PDF OT23-6 SC70-6 OT563-6 SLYU010

    Untitled

    Abstract: No abstract text available
    Text: LITE-ON SEMICONDUCTOR L02ESD5V0F6-5 STAND-OFF VOLTAGE - 5.0 Volts POWER DISSIPATION - 25 WATTS UNIDIRECTIONAL ESD PROTECTION DIODE GENERAL DESCRIPTION SOT563 The L02ESD5V0F6-5 is a low capacitance 5-fold ESD array in the ultra small SOT666 plastic package designed to protect up to


    Original     		PDF L02ESD5V0F6-5 L02ESD5V0F6-5 OT666 OT563 OT563 100mV

    Untitled

    Abstract: No abstract text available
    Text: PDF: 2003 Jun 19 Philips Semiconductors PC board footprint HBCC24; SOT564-1 FOOTPRINT REFLOW SOLDERING handbook, full pagewidth PA = OA = 4.40 (2x) 2.05 (2×) 1.275 (2×) solder lands solder resist 0.075 0.50 (16×) clearance 0.150 0.40 (9×) solder paste


    Original     		PDF HBCC24; OT564-1 MGX376

    Untitled

    Abstract: No abstract text available
    Text: PC board footprint Philips Semiconductors Footprint information for reflow soldering of TFBGA144 package SOT569-1 Hx P P Hy see detail X Generic footprint pattern Refer to the package outline drawing for actual layout solder land solder paste deposit solder land plus solder paste


    Original     		PDF TFBGA144 OT569-1 OT569-1

    Untitled

    Abstract: No abstract text available
    Text: NST30010MXV6T1G, NSVT30010MXV6T1G Dual Matched General Purpose Transistor PNP Matched Pair http://onsemi.com These transistors are housed in an ultra−small SOT563 package ideally suited for portable products. They are assembled to create a pair of devices highly matched in all parameters, eliminating the need


    Original     		PDF NST30010MXV6T1G, NSVT30010MXV6T1G OT563 NST30010MXV6/D

    Untitled

    Abstract: No abstract text available
    Text: TMP102 www.ti.com . SBOS397B – AUGUST 2007 – REVISED OCTOBER 2008 Low Power Digital Temperature Sensor With SMBus /Two-Wire Serial Interface in SOT563


    Original     		PDF TMP102 SBOS397B OT563 OT563

    zener 563

    Abstract: diode zener d1 marking C73 zener diode mv 5 900 mhz schottky diode CPD92 marking code c73 sot 563 package CPD92-CMPD6263 CEN1073
    Text: Central CEN1073 TM Semiconductor Corp. SURFACE MOUNT DUAL ZENER + SILICON SCHOTTKY DIODE COMBINATION DESCRIPTION: The CENTRAL SEMICONDUCTOR CEN1073 is a “Basic Building Block” device consisting of two Zener Diodes and one Schottky Diode in a SOT563 surface mount package, designed for


    Original     		PDF CEN1073 CEN1073 OT563 CPZ18-CMPZ5232B) CPD92-CMPD6263) OT-563 20-February zener 563 diode zener d1 marking C73 zener diode mv 5 900 mhz schottky diode CPD92 marking code c73 sot 563 package CPD92-CMPD6263

    SOT566-3

    Abstract: HSOP24 sot566
    Text: PDF: 2002 Jan 30 Philips Semiconductors Package outline HSOP24: plastic, heatsink small outline package; 24 leads; low stand-off height SOT566-3 E D A x X c E2 y HE v M A D1 D2 12 1 pin 1 index Q A A2 E1 A3 A4 θ Lp detail X 24 13 Z w M bp e 5 10 mm scale


    Original     		PDF HSOP24: OT566-3 SOT566-3 HSOP24 sot566

    Untitled

    Abstract: No abstract text available
    Text: UM5304EEXF Quad Channel Low Capacitance ESD Protection Array UM5304EEAF UM5304EEBF UM5304EECF SC70-6/SC88/SOT363 SC89-6/SOT563/SOT666 TSOP-6/SOT23-6 General Description UM5304EEXF are surge rated diode arrays designed to protect high speed data interfaces. This series has been


    Original     		PDF UM5304EEXF UM5304EEAF UM5304EEBF UM5304EECF SC70-6/SC88/SOT363 SC89-6/SOT563/SOT666 TSOP-6/SOT23-6 UM5304EEXF

    Untitled

    Abstract: No abstract text available
    Text: TMP102 www.ti.com SBOS397C – AUGUST 2007 – REVISED OCTOBER 2012 Low Power Digital Temperature Sensor With SMBus /Two-Wire Serial Interface in SOT563 Check for Samples: TMP102 FEATURES DESCRIPTION • • • The TMP102 is a two-wire, serial output temperature


    Original     		PDF TMP102 SBOS397C OT563 TMP102 OT563

    Untitled

    Abstract: No abstract text available
    Text: TMP302A, TMP302B TMP302C, TMP302D SOT563 www.ti.com. SBOS488A – JUNE 2009 – REVISED SEPTEMBER 2009 Easy-to-Use, Low-Power, Low-Supply


    Original     		PDF OT563 TMP302A, TMP302B TMP302C, TMP302D SBOS488A TMP302A TMP302C

    Untitled

    Abstract: No abstract text available
    Text: TMP302A, TMP302B TMP302C, TMP302D SOT563 www.ti.com. SBOS488A – JUNE 2009 – REVISED SEPTEMBER 2009 Easy-to-Use, Low-Power, Low-Supply


    Original     		PDF TMP302A, TMP302B TMP302C, TMP302D OT563 SBOS488A TMP302A TMP302B TMP302C

    Untitled

    Abstract: No abstract text available
    Text: TMP20 www.ti.com SBOS466 – DECEMBER 2009 ±2.5°C Low-Power, Analog Out TEMPERATURE SENSOR Check for Samples: TMP20 FEATURES DESCRIPTION • • • • • The TMP20 is a CMOS, precision analog output temperature sensor available in the tiny SOT563 package. The TMP20 operates from –55°C to +130°C


    Original     		PDF TMP20 SBOS466 TMP20 OT563 77mV/Â

    TMP75

    Abstract: 1E70 TMP102 TMP275
    Text: TMP102 www.ti.com . SBOS397B – AUGUST 2007 – REVISED OCTOBER 2008 Low Power Digital Temperature Sensor With SMBus /Two-Wire Serial Interface in SOT563


    Original     		PDF TMP102 SBOS397B OT563 OT563 TMP75 1E70 TMP102 TMP275

    Untitled

    Abstract: No abstract text available
    Text: DISCRETE SEMICONDUCTORS BGS67A 65 MHz, 25.5 dB gain reverse amplifier Preliminary specification 2001 Oct 16 Philips Semiconductors Preliminary specification 65 MHz, 25.5 dB gain reverse amplifier BGS67A CONNECTIONS SOT567A FEATURES • Extremely low noise


    Original     		PDF BGS67A OT567A BGS67A SCA73

    HSOP24

    Abstract: sot566
    Text: PDF: 2000 Mar 24 Philips Semiconductors Package outline HSOP24: plastic, heatsink small outline package; 24 leads SOT566-1 A E D x X c E2 y HE v M A D1 D2 1 12 pin 1 index Q A2 A E1 A3 A1 θ Lp detail X 24 13 Z w M bp e 5 10 mm scale DIMENSIONS (mm are the original dimensions)


    Original     		PDF HSOP24: OT566-1 HSOP24 sot566

    Untitled

    Abstract: No abstract text available
    Text: TMP102 BurrĆBrown Products from Texas Instruments SBOS397A – AUGUST 2007 – REVISED NOVEMBER 2007 Low Power Digital Temperature Sensor With SMBus /Two-Wire Serial Interface in SOT563 FEATURES 1 • TINY SOT563 PACKAGE • ACCURACY: 0.5°C –25°C to +85°C


    Original     		PDF TMP102 SBOS397A OT563 TMP102 OT563

    SBOS397A

    Abstract: No abstract text available
    Text: TMP102 BurrĆBrown Products from Texas Instruments SBOS397A – AUGUST 2007 – REVISED NOVEMBER 2007 Low Power Digital Temperature Sensor With SMBus /Two-Wire Serial Interface in SOT563 FEATURES 1 • TINY SOT563 PACKAGE • ACCURACY: 0.5°C –25°C to +85°C


    Original     		PDF TMP102 SBOS397A OT563 TMP102 OT563 SBOS397A

    TMP303ADRLR

    Abstract: No abstract text available
    Text: TMP303A TMP303B SOT563 www.ti.com SBOS486B – JULY 2009 – REVISED JANUARY 2011 Easy-to-Use, Low-Power, 1°C, Low-Supply TEMPERATURE RANGE MONITOR in MicroPackage Check for Samples: TMP303A, TMP303B FEATURES DESCRIPTION • • • The TMP303A and TMP303B are temperature range


    Original     		PDF OT563 TMP303A TMP303B SBOS486B TMP303A, OT563 TMP303B OT563) TMP303ADRLR

    Untitled

    Abstract: No abstract text available
    Text: SBR130SV NEW PRODUCT 1.0A SBR SUPER BARRIER RECTIFIER Features Mechanical Data • Low Leakage Current   Excellent High Temperature Stability   Patented Super Barrier Rectifier Technology Case: SOT563 Case Material: Molded Plastic, “Green” Molding Compound.


    Original     		PDF SBR130SV OT563 J-STD-020 MIL-STD-202, SBR1U30SV DS35407

    Untitled

    Abstract: No abstract text available
    Text: SBR1U30SV 1.0A SBR SUPER BARRIER RECTIFIER Features Mechanical Data • Low Leakage Current   Excellent High Temperature Stability   Patented Super Barrier Rectifier Technology Case: SOT563 Case Material: Molded Plastic, “Green” Molding Compound.


    Original     		PDF SBR1U30SV OT563 J-STD-020 MIL-STD-202, DS35028

    Untitled

    Abstract: No abstract text available
    Text: TMP102 www.ti.com . SBOS397B – AUGUST 2007 – REVISED OCTOBER 2008 Low Power Digital Temperature Sensor With SMBus /Two-Wire Serial Interface in SOT563


    Original     		PDF TMP102 SBOS397B OT563 OT563