Untitled
Abstract: No abstract text available
Text: PC board footprint Philips Semiconductors Footprint information for reflow soldering of QFP64 package SOT393-1 Hx Gx P2 Hy 0.125 P1 Gy By Ay C D2 (8x) D1 Bx Ax Generic footprint pattern Refer to the package outline drawing for actual layout solder land
|
Original
|
PDF
|
QFP64
OT393-1
OT393-1
|
Untitled
Abstract: No abstract text available
Text: Package outline Flanged ceramic package; 2 mounting holes; 2 leads SOT391A D A F 3 D1 U1 B q c C 1 H p U2 A 2 E1 E w1 M A M B M w2 M C M b 5 Q 10 mm scale DIMENSIONS millimetre dimensions are derived from the original inch dimensions UNIT A b c mm 5.21 4.45
|
Original
|
PDF
|
OT391A
|
HSOP20
Abstract: No abstract text available
Text: PDF: 2003 Jul 23 Philips Semiconductors Package outline HSOP20: plastic, heatsink small outline package; 20 leads SOT397-1 E D A E2 X HE v M A c y D1 D2 11 20 Q A2 E1 A A3 A1 A4 pin 1 index θ Lp detail X 1 10 Z w M bp e 5 10 mm scale DIMENSIONS (mm are the original dimensions)
|
Original
|
PDF
|
HSOP20:
OT397-1
HSOP20
|
MO-108
Abstract: QFP64
Text: PDF: 2003 Mar 24 Philips Semiconductors Package outline QFP64: plastic quad flat package; 64 leads lead length 1.6 mm ; body 14 x 14 x 2.7 mm; high stand-off height SOT393-2 c y X A 48 33 49 32 ZE e A A2 E HE A1 (A 3) θ wM pin 1 index Lp bp L 17 64 detail X
|
Original
|
PDF
|
QFP64:
OT393-2
MO-108
MO-108
QFP64
|
Untitled
Abstract: No abstract text available
Text: PDF: 1999 Apr 16 Philips Semiconductors Package outline QFP64: plastic quad flat package; 64 leads lead length 1.6 mm ; body 14 x 14 x 2.7 mm SOT393-1 c y X A 48 33 49 32 ZE e E HE A A2 (A 3) A1 θ wM Lp bp pin 1 index L 17 64 detail X 16 1 w M bp e v M A
|
Original
|
PDF
|
QFP64:
OT393-1
OT393-1
MS-022
|
sot393
Abstract: No abstract text available
Text: PDF: 1999 Apr 16 Philips Semiconductors Package outline QFP64: plastic quad flat package; 64 leads lead length 1.6 mm ; body 14 x 14 x 2.7 mm; high stand-off height SOT393-2 c y X A 48 33 49 32 ZE e A A2 E HE A1 (A 3) θ wM Lp bp L pin 1 index 17 64 detail X
|
Original
|
PDF
|
QFP64:
OT393-2
OT393-2
MO-108BD-1
sot393
|
DIP64 package
Abstract: DIP64 sot395 DIP-64
Text: PDF: 1999 Apr 16 Philips Semiconductors Package outline seating plane DIP64: plastic dual in-line package; 64 leads 900 mil SOT395-1 ME D A2 A L A1 c e Z b1 w M (e 1) MH b 64 33 pin 1 index E 1 32 5 10 mm scale DIMENSIONS (millimetre dimensions are derived from the original inch dimensions)
|
Original
|
PDF
|
DIP64:
OT395-1
OT395-1
DIP64 package
DIP64
sot395
DIP-64
|
equivalent transistor an 243
Abstract: SOT390A
Text: PDF: 1999 Apr 16 Philips Semiconductors Package outline Flanged ceramic package; 2 mounting holes; 2 leads SOT390A D A F 3 D1 U1 B q C c 1 L U2 E E1 A L w1 M A M B M p 2 w2 M C M b 5 Q 10 mm scale DIMENSIONS millimetre dimensions are derived from the original inch dimensions
|
Original
|
PDF
|
OT390A
equivalent transistor an 243
SOT390A
|
date sheet of B.A
Abstract: No abstract text available
Text: PDF: 1999 Apr 16 Philips Semiconductors Package outline Flangeless ceramic package; 2 leads SOT391B D A c 1 L 5 10 mm scale E L 2 b OUTLINE VERSION SOT391B UNIT A b c mm 4.09 3.02 5.85 5.58 0.16 0.10 D E 11.54 10.93 10.51 9.90 L Q 2.79 2.29 1.02 0.76 Q REFERENCES
|
Original
|
PDF
|
OT391B
date sheet of B.A
|
Untitled
Abstract: No abstract text available
Text: Package outline Flangeless ceramic package; 2 leads SOT391B D A c 1 L 5 10 mm scale E L 2 b OUTLINE VERSION SOT391B www.nxp.com UNIT A b c mm 4.09 3.02 5.85 5.58 0.16 0.10 D E 11.54 10.93 10.51 9.90 L Q 2.79 2.29 1.02 0.76 Q REFERENCES IEC DIMENSIONS millimetre dimensions are derived
|
Original
|
PDF
|
OT391B
|
Untitled
Abstract: No abstract text available
Text: Package outline HDIP18: plastic heat-dissipating dual in-line package; 18 leads SOT398-1 D seating plane ME A2 A A1 L e Z b 10 18 c w M b1 e 1 b2 MH pin 1 index E 9 1 5 10 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions)
|
Original
|
PDF
|
HDIP18:
OT398-1
|
MS-022
Abstract: QFP64
Text: PDF: 2003 Mar 24 Philips Semiconductors Package outline QFP64: plastic quad flat package; 64 leads lead length 1.6 mm ; body 14 x 14 x 2.7 mm SOT393-1 c y X A 48 33 49 32 ZE e E HE A A2 (A 3) A1 θ wM pin 1 index Lp bp L 17 64 detail X 16 1 w M bp e v M A
|
Original
|
PDF
|
QFP64:
OT393-1
134E07
MS-022
MS-022
QFP64
|
philips 3563
Abstract: sot394
Text: PDF: 1999 Apr 16 Philips Semiconductors Package outline seating plane DIP28: plastic dual in-line package; 28 leads 300 mil SOT394-1 ME D A2 L A A1 e Z b1 c w M (e 1) MH b 28 15 pin 1 index E 14 1 5 10 mm scale DIMENSIONS (millimetre dimensions are derived from the original inch dimensions)
|
Original
|
PDF
|
DIP28:
OT394-1
OT394-1
philips 3563
sot394
|
QFP64 package
Abstract: MS-022 QFP64
Text: PDF: 2000 Jan 20 Philips Semiconductors Package outline QFP64: plastic quad flat package; 64 leads lead length 1.6 mm ; body 14 x 14 x 2.7 mm SOT393-1 c y X A 48 33 49 32 ZE e E HE A A2 (A 3) A1 θ wM Lp bp pin 1 index L 17 64 detail X 16 1 w M bp e v M A
|
Original
|
PDF
|
QFP64:
OT393-1
134E07
MS-022
QFP64 package
MS-022
QFP64
|
|
|
BLV2045N
Abstract: BP317
Text: DISCRETE SEMICONDUCTORS DATA SHEET BLV2045N UHF power transistor Objective specification File under Discrete Semiconductors, SC08b 1997 Oct 23 Philips Semiconductors Objective specification UHF power transistor BLV2045N FEATURES PINNING - SOT390A • Emitter ballasting resistors for optimum temperature
|
Original
|
PDF
|
BLV2045N
SC08b
OT390A
SCA55
127067/00/01/pp8
BLV2045N
BP317
|
BU508DX
Abstract: curve tracer BU508AD
Text: Philips Semiconductors Product specification Silicon Diffused Power Transistor BU508DX GENERAL DESCRIPTION High voltage, high-speed switching npn transistors in a fully isolated SOT399 envelope with integrated efficiency diode, primarily for use in horizontal deflection circuits of colour television receivers.
|
Original
|
PDF
|
BU508DX
OT399
OT399
BU508DX
curve tracer
BU508AD
|
Untitled
Abstract: No abstract text available
Text: DISCRETE SEMICONDUCTORS DATA SHEET M3D171 BLV2045N UHF power transistor Preliminary specification 1999 Apr 23 Philips Semiconductors Preliminary specification UHF power transistor BLV2045N PINNING - SOT390A FEATURES • Emitter ballasting resistors for optimum temperature
|
Original
|
PDF
|
M3D171
BLV2045N
OT390A
BLV2045N
SCA63
budgetnum/printrun/ed/pp10
|
NFM61RH20T332
Abstract: No abstract text available
Text: DISCRETE SEMICONDUCTORS DATA SHEET BLV2045N UHF power transistor Preliminary specification 1998 Oct 01 Philips Semiconductors Preliminary specification UHF power transistor BLV2045N PINNING - SOT390A FEATURES • Emitter ballasting resistors for optimum temperature
|
Original
|
PDF
|
BLV2045N
OT390A
BLV2045N
SCA60
budgetnum/printrun/ed/pp10
NFM61RH20T332
|
SOT399
Abstract: B2L1
Text: PDF: 1999 Apr 16 Philips Semiconductors Package outline Plastic single-ended through-hole package; mountable to heatsink; 1 mounting hole; 3 in-line leads E m SOT399 A A1 P q D2 α D D1 q1 L1 k Q b1 b2 L 1 2 3 b e w M c e 5 10 mm scale DIMENSIONS mm are the original dimensions
|
Original
|
PDF
|
OT399
SOT399
B2L1
|
BLV2045
Abstract: No abstract text available
Text: DISCRETE SEMICONDUCTORS DATA SHEET BLV2045 UHF power transistor Product specification Supersedes data of 1996 Feb 09 1996 Nov 13 Philips Semiconductors Product specification UHF power transistor BLV2045 FEATURES PINNING - SOT390A • Emitter ballasting resistors for optimum temperature
|
Original
|
PDF
|
BLV2045
OT390A
the31
SCA52
127061/1200/02/pp16
BLV2045
|
741 LEM
Abstract: AM/amplifier LEM 741
Text: DISCRETE SEMICONDUCTORS S^EET BLV2045N UHF power transistor P relim inary specification Philips Semiconductors 1999 A p r 23 PHILIPS Philips Semiconductors Preliminary specification UHF power transistor BLV2045N FEATURES PINNING - SOT39QA • Em itter ballasting resistors fo r optim um tem perature
|
OCR Scan
|
PDF
|
BLV2045N
BLV2045N
OT39QA
SCA63
741 LEM
AM/amplifier LEM 741
|
LM 886 IC chip
Abstract: TEKELEC te 358
Text: DISCRETE SEMICONDUCTORS BLV2045N UHF power transistor P relim inary specification Philips Sem iconductors 1998 O ct 01 PHILIPS Philips Semiconductors Preliminary specification UHF power transistor BLV2045N FEATURES PINNING - SOT39QA • Em itter ballasting resistors fo r optim um te m perature
|
OCR Scan
|
PDF
|
BLV2045N
BLV2045N
OT39QA
LM 886 IC chip
TEKELEC te 358
|
NFM61 SP
Abstract: tekelec TA 355 TEKELEC te 358
Text: DISCRETE SEMICONDUCTORS S^EET BLV2045N UHF power transistor P relim inary specification Philips Semiconductors 1998 Nov 19 PHILIPS Philips Semiconductors Preliminary specification UHF power transistor BLV2045N FEATURES PINNING - SOT39QA • Em itter ballasting resistors fo r optim um tem perature
|
OCR Scan
|
PDF
|
BLV2045N
BLV2045N
OT39QA
SCA60
/printrun/ed/pp10
NFM61 SP
tekelec TA 355
TEKELEC te 358
|
Power Bipolar Transistors
Abstract: No abstract text available
Text: PACKAGE OUTLINES Page SOT78 T0-220AB SOT82 SOT186(10-220) S O U 86A (Isolated TO-220AB) SOT199 SOT399 (TOP3D) 754 755 756 757 758 759 SOT429 (TO-247) SOT43Q (TOP3L) 760 761 Philips Semiconductors Power Bipolar Transistors Package outlines Plastic single-ended package; heatsink mounted; 1 mounting hole; 3-lead TO-22QAB
|
OCR Scan
|
PDF
|
T0-220AB)
OT186
O-220AB)
OT199
OT399
OT429
O-247)
OT43Q
O-22QAB
O-247
Power Bipolar Transistors
|
