Please enter a valid full or partial manufacturer part number with a minimum of 3 letters or numbers

    SOT23-5 WAVE SOLDERING Search Results

    SOT23-5 WAVE SOLDERING Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    TBAW56 Toshiba Electronic Devices & Storage Corporation Switching Diode, 80 V, 0.215 A, SOT23 Visit Toshiba Electronic Devices & Storage Corporation
    TB67B001BFTG Toshiba Electronic Devices & Storage Corporation Brushless Motor Driver/3 Phases Driver/Vout(V)=25/Iout(A)=3/Square Wave Visit Toshiba Electronic Devices & Storage Corporation
    TC78B011FTG Toshiba Electronic Devices & Storage Corporation Brushless Motor Driver/3 Phases Driver/Vout(V)=30/Square, Sine Wave Visit Toshiba Electronic Devices & Storage Corporation
    TB67B001AFTG Toshiba Electronic Devices & Storage Corporation Brushless Motor Driver/3 Phases Driver/Vout(V)=25/Iout(A)=3/Square Wave Visit Toshiba Electronic Devices & Storage Corporation
    CN-AC3MMDZBAU Amphenol Cables on Demand 3-Pin XLR Male Panel Mount Connector - Amphenol AC3MMDZB-AU - Solder Type (Black + Gold Contacts) Datasheet

    SOT23-5 WAVE SOLDERING Datasheets Context Search

    Catalog Datasheet MFG & Type Document Tags PDF

    TVS15VESGP

    Abstract: No abstract text available
    Text: CHENMKO ENTERPRISE CO.,LTD TVS15VESGP STANDARD CAPACITANCE TVS VOLTAGE 15 V 200 WATTS PEAK PULSE POWER FEATURES *Undirectional * Low leakage current *Protects one power or I/O port * High temperature soldering guaranteed : 260oC/10 seconds at terminals *ESD per HBM : 10 KV


    Original     		TVS15VESGP 260C/10 OT-23 /-30KV 6100P TVS15VESGP PDF

    Zener S 118

    Abstract: MMBZ5243BPT MMBZ5222BPT ZENER DIODES SOT-23 182 MMBZ5241BPT MMBZ5246BPT zener diode 182 Zener Diode SOT-23 MMBZ5256BPT MMBZ5228BPT
    Text: MMBZ5221BPT CHENMKO ENTERPRISE CO.,LTD THRU SURFACE MOUNT ZENER SILICON PLANAR POWER ZENER DIODES VOLTAGE RANGE 2.4V TO 91V MMBZ5270BPT FEATURE Small surface mounting type. SOT-23 High temperature soldering type. ESD rating of class 3(>16 kV) per human body model.


    Original     		MMBZ5221BPT MMBZ5270BPT OT-23) OT-23 -55oC 150oC Zener S 118 MMBZ5243BPT MMBZ5222BPT ZENER DIODES SOT-23 182 MMBZ5241BPT MMBZ5246BPT zener diode 182 Zener Diode SOT-23 MMBZ5256BPT MMBZ5228BPT PDF

    MMBZ5243BPT

    Abstract: MMBZ5241BPT MMBZ5248BPT MMBZ5256BPT ZENER DIODES SOT-23 182 MMBZ5250BPT MMBZ5247BPT MMBZ5224BPT MMBZ5226BPT MMBZ5242BPT
    Text: MMBZ5221BPT CHENMKO ENTERPRISE CO.,LTD THRU SURFACE MOUNT ZENER SILICON PLANAR POWER ZENER DIODES VOLTAGE RANGE 2.4V TO 91V MMBZ5270BPT FEATURE Small surface mounting type. SOT-23 High temperature soldering type. ESD rating of class 3(>16 kV) per human body model.


    Original     		MMBZ5221BPT MMBZ5270BPT OT-23) OT-23 -55oC 150oC MMBZ5243BPT MMBZ5241BPT MMBZ5248BPT MMBZ5256BPT ZENER DIODES SOT-23 182 MMBZ5250BPT MMBZ5247BPT MMBZ5224BPT MMBZ5226BPT MMBZ5242BPT PDF

    MMBZ5221BGP

    Abstract: MMBZ5222BGP MMBZ5223BGP MMBZ5224BGP MMBZ5225BGP MMBZ5226BGP MMBZ5227BGP MMBZ5228BGP MMBZ5229BGP MMBZ5230BGP
    Text: MMBZ5221BGP CHENMKO ENTERPRISE CO.,LTD THRU SURFACE MOUNT ZENER SILICON PLANAR POWER ZENER DIODES VOLTAGE RANGE 2.4V TO 91V MMBZ5270BGP FEATURE Small surface mounting type. SOT-23 High temperature soldering type. ESD rating of class 3(>16 kV) per human body model.


    Original     		MMBZ5221BGP MMBZ5270BGP OT-23) OT-23 -55oC 150oC MMBZ5221BGP MMBZ5222BGP MMBZ5223BGP MMBZ5224BGP MMBZ5225BGP MMBZ5226BGP MMBZ5227BGP MMBZ5228BGP MMBZ5229BGP MMBZ5230BGP PDF

    MMBZ5221JGP

    Abstract: MMBZ5222JGP MMBZ5223JGP MMBZ5224JGP MMBZ5225JGP MMBZ5226JGP MMBZ5227JGP MMBZ5228JGP MMBZ5229JGP MMBZ5230JGP
    Text: MMBZ5221JGP CHENMKO ENTERPRISE CO.,LTD THRU SURFACE MOUNT ZENER SILICON PLANAR POWER ZENER DIODES VOLTAGE RANGE 2.4V TO 91V MMBZ5270JGP FEATURE Small surface mounting type. SOT-23 High temperature soldering type. ESD rating of class 3(>16 kV) per human body model.


    Original     		MMBZ5221JGP MMBZ5270JGP OT-23) OT-23 -55oC 150oC MMBZ5221JGP MMBZ5222JGP MMBZ5223JGP MMBZ5224JGP MMBZ5225JGP MMBZ5226JGP MMBZ5227JGP MMBZ5228JGP MMBZ5229JGP MMBZ5230JGP PDF

    CHPZ9V1GP

    Abstract: CHPZ10VGP CHPZ11VGP CHPZ12VGP CHPZ13VGP CHPZ14VGP CHPZ15VGP CHPZ16VGP CHPZ17VGP CHPZ18VGP
    Text: CHPZ3V6GP CHENMKO ENTERPRISE CO.,LTD THRU SURFACE MOUNT ZENER SILICON PLANAR POWER ZENER DIODES VOLTAGE RANGE 3.6V TO 33V CHPZ33VGP FEATURE High temperature soldering type. ESD rating of class 3 >16 kV per human body model. Silicon planar zener diodes. Silcon-oxide passivated junction.


    Original     		CHPZ33VGP OT-23 -55oC 150oC CHPZ9V1GP CHPZ10VGP CHPZ11VGP CHPZ12VGP CHPZ13VGP CHPZ14VGP CHPZ15VGP CHPZ16VGP CHPZ17VGP CHPZ18VGP PDF

    zener 12V 400 mW

    Abstract: CHPZ6V2 dual zener ZENER 15.2 Zener Diode SOT-23 1.2V zener diodes CHPZ14VPT dual zener common anode CHPZ19VPT
    Text: CHPZ3V6PT CHENMKO ENTERPRISE CO.,LTD THRU SURFACE MOUNT ZENER SILICON PLANAR POWER ZENER DIODES VOLTAGE RANGE 3.6V TO 33V CHPZ33VPT FEATURE High temperature soldering type. ESD rating of class 3 >16 kV per human body model. Silicon planar zener diodes. Silcon-oxide passivated junction.


    Original     		CHPZ33VPT OT-23 -55oC 150oC zener 12V 400 mW CHPZ6V2 dual zener ZENER 15.2 Zener Diode SOT-23 1.2V zener diodes CHPZ14VPT dual zener common anode CHPZ19VPT PDF

    CHBZ9V1BGP

    Abstract: CHBZ10BGP CHBZ11BGP CHBZ12BGP CHBZ13BGP CHBZ14BGP CHBZ15BGP CHBZ16BGP CHBZ17BGP CHBZ18BGP
    Text: CHBZ2V4BGP CHENMKO ENTERPRISE CO.,LTD THRU SURFACE MOUNT ZENER DUAL SILICON PLANAR POWER ZENER DIODES VOLTAGE RANGE 2.4V TO 51V CHBZ51BGP FEATURE High temperature soldering type. ESD rating of class 3 >16 kV per human body model. Silicon planar zener diodes.


    Original     		CHBZ51BGP OT-23 -55oC 150oC CHBZ9V1BGP CHBZ10BGP CHBZ11BGP CHBZ12BGP CHBZ13BGP CHBZ14BGP CHBZ15BGP CHBZ16BGP CHBZ17BGP CHBZ18BGP PDF

    SOD110 footprint

    Abstract: MSA430 SOD523 footprint MSA428 sot23 footprint SC-76 flux. PHILIPS AN-450 surface mounting methods
    Text: Philips Semiconductors Mounting and Soldering General MOUNTING AND SOLDERING Screen printing Mounting methods This is the best high-volume production method of solder paste application. An emulsion-coated, fine mesh screen with apertures etched in the emulsion to coincide with the


    Original     		MSA426 SOD110 footprint MSA430 SOD523 footprint MSA428 sot23 footprint SC-76 flux. PHILIPS AN-450 surface mounting methods PDF

    MMBZ5221SGP

    Abstract: MMBZ5222SGP MMBZ5223SGP MMBZ5224SGP MMBZ5225SGP MMBZ5226SGP MMBZ5227SGP MMBZ5228SGP MMBZ5229SGP MMBZ5230SGP
    Text: MMBZ5221SGP CHENMKO ENTERPRISE CO.,LTD THRU SURFACE MOUNT ZENER SILICON PLANAR POWER ZENER DIODES VOLTAGE RANGE 2.4V TO 91V MMBZ5270SGP FEATURE Small surface mounting type. SOT-23 High temperature soldering type. ESD rating of class 3(>16 kV) per human body model.


    Original     		MMBZ5221SGP MMBZ5270SGP OT-23) ST-23 -55oC 150oC MMBZ5221SGP MMBZ5222SGP MMBZ5223SGP MMBZ5224SGP MMBZ5225SGP MMBZ5226SGP MMBZ5227SGP MMBZ5228SGP MMBZ5229SGP MMBZ5230SGP PDF

    MMBZ5258SPT

    Abstract: MMBZ5250SPT MMBZ5252SPT MMBZ5227SPT MMBZ5245SPT MMBZ5244SPT MMBZ5222SPT MMBZ5243SPT MMBZ5266SPT MMBZ5263SPT
    Text: MMBZ5221SPT CHENMKO ENTERPRISE CO.,LTD THRU SURFACE MOUNT ZENER SILICON PLANAR POWER ZENER DIODES VOLTAGE RANGE 2.4V TO 91V MMBZ5270SPT FEATURE Small surface mounting type. SOT-23 High temperature soldering type. ESD rating of class 3(>16 kV) per human body model.


    Original     		MMBZ5221SPT MMBZ5270SPT OT-23) OT-23 ST-23 -55oC 150oC MMBZ5258SPT MMBZ5250SPT MMBZ5252SPT MMBZ5227SPT MMBZ5245SPT MMBZ5244SPT MMBZ5222SPT MMBZ5243SPT MMBZ5266SPT MMBZ5263SPT PDF

    qfp 32 land pattern

    Abstract: SSOP16 SSOP24
    Text: Philips Semiconductors PowerMOS transistors Mounting and soldering MOUNTING AND SOLDERING Page INTRODUCTION LEADED DEVICES Handling Soldering GENERAL DATA AND INSTRUCTIONS FOR THE SOT186A; SOT263; TO 220AB General rules Mounting methods Heatsink requirements


    Original     		OT186A; OT263; 220AB components24 MLC747 SSOP16 OT338-1) SSOP24 OT340-1) qfp 32 land pattern SSOP16 SSOP24 PDF

    ssop24 footprint

    Abstract: PowerMos transistors TO220 package SSOP16 SSOP24 SSOP24 300 1 footprint sot89 stencil
    Text: DISCRETE SEMICONDUCTORS Mounting and soldering PowerMOS transistors 1998 Dec 02 Philips Semiconductors PowerMOS transistors Mounting and soldering MOUNTING AND SOLDERING Page INTRODUCTION LEADED DEVICES Handling Soldering GENERAL DATA AND INSTRUCTIONS FOR THE


    Original     		OT186A; OT263; 220AB MLC747 SSOP16 OT338-1) SSOP24 OT340-1) OT338-1 ssop24 footprint PowerMos transistors TO220 package SSOP16 SSOP24 SSOP24 300 1 footprint sot89 stencil PDF

    SOD80 footprint

    Abstract: SOD87 footprint Soldering guidelines and SMD footprint design SMD footprint design SOD106 land pattern land pattern sot346 SOD110 footprint SOD87 footprint pcb MLC745 smd footprint
    Text: DISCRETE SEMICONDUCTORS DATA SHEET Chapter 4 Soldering guidelines and SMD footprint design Discrete Semiconductor Packages File under Discrete Semiconductors, SC18 July 1997 Philips Semiconductors Discrete Semiconductor Packages Soldering guidelines and SMD


    Original     		MGK391 MSC422 OT457 SC-74) MSC423 SOD80 footprint SOD87 footprint Soldering guidelines and SMD footprint design SMD footprint design SOD106 land pattern land pattern sot346 SOD110 footprint SOD87 footprint pcb MLC745 smd footprint PDF

    sod323 wave soldering

    Abstract: sod323 reflow reflow profile 00802 sot363 wave soldering HLG05516 HLG05517 HLG05520 HLG05521 HLG05818 HLG05820
    Text: Notes on Processing Component Placement HLG0 5414 The ability to place semiconductors depends very much on the type involved. Up to a pitch size of 1.27 mm, mechanical centering by tools of an automatic component placement machine suffices, e.g. jaws and centering units. Multiple-pin ICs have to be placed


    Original     		HLG05510 OT-23 HLG05511 HLG05522 OT-89 HLG05523 HLG05514 OT-143 sod323 wave soldering sod323 reflow reflow profile 00802 sot363 wave soldering HLG05516 HLG05517 HLG05520 HLG05521 HLG05818 HLG05820 PDF

    Untitled

    Abstract: No abstract text available
    Text: Recommended Soldering Profiles Wave Soldering 1. 2. For Through Hole Packages, only the leads of the device are immersed in the wave solder. For specified Surface Mount Packages, the entire device is immersed in the wave solder. See Table 1. Wave Solder Ramp Up ˚C/sec


    Original     		PDF

    Sony Semiconductor Replacement Handbook 1991

    Abstract: 2sc5088 horizontal transistors tcxo philips 4322 20000w audio amplifier circuit diagram replacement for 2sc5088 horizontal transistors motorola power fet rf databook 2SK170BL Funkamateur transistor 1060 schematic diagram tv sony
    Text: Philips RF Manual product & design manual for RF small signal discretes 3 edition July 2003 rd / discretes/documentation/rf_manual Document number: 4322 252 06384 Date of release: July 2003 3rd edition


    Original     		PDF

    Untitled

    Abstract: No abstract text available
    Text: Recommended Soldering Profiles Wave Soldering 1. 2. For Through Hole Packages, only the leads of the device are immersed in the wave solder. For specified Surface Mount Packages, the entire device is immersed in the wave solder. See Table 1. Wave Solder Ramp Up ˚C/sec


    Original     		PDF

    Untitled

    Abstract: No abstract text available
    Text: Recommended Soldering Profiles Wave Soldering 1. For Through Hole Packages, only the leads of the device are immersed in the wave solder. 2. For specified Surface Mount Packages, the entire device is immersed in the wave solder. See Table 1. Wave Solder Ramp Up ˚C/sec


    Original     		CSP-9-111C2) CSP-9-111S2) CSP-9-111S2. PDF

    SOD87 footprint

    Abstract: Soldering guidelines and SMD footprint design sot3391h SOT-34 MSA460 MSA439 SOT343R footprint
    Text: SC18_1999_.book : SC18_CHAPTER_4_1999 1 Wed May 12 11:40:55 1999 CHAPTER 4 SOLDERING GUIDELINES AND SMD FOOTPRINT DESIGN page Introduction 4-2 Axial and radial leaded devices 4-2 Surface-mount devices 4-3 Recommended footprints 4 - 14 SC18_1999_.book : SC18_CHAPTER_4_1999


    Original     		MSD060 OT428. MSC422 OT457 SC-74) MSC423 SOD87 footprint Soldering guidelines and SMD footprint design sot3391h SOT-34 MSA460 MSA439 SOT343R footprint PDF

    reflow profile 00802

    Abstract: sod323 reflow sod323 wave soldering
    Text: SIEM EN S Notes on Processing Table 1 Solderability Test to Siemens Standard Test criterion Solder bath temperature °C Dwell time in bath s Components for wave and reflow soldering Wetting 215 ± 3 3 ±0.3 Dewetting and leaching 260 ± 5 30 ±1 Components for reflow soldering only


    OCR Scan     		OT-89 OT-143 HLG05515 OT-223 reflow profile 00802 sod323 reflow sod323 wave soldering PDF

    sot59

    Abstract: No abstract text available
    Text: Philips Sem iconductors Small-signal Transistors General M O U NTIN G AND SOLDERING Screen printing M ounting m ethods This is the best high-volum e production m ethod of solder paste application. An em ulsion-coated, fine mesh screen with apertures etched in the emulsion to coincide with the


    OCR Scan     		OT323. OT223. sot59 PDF

    bc 339

    Abstract: No abstract text available
    Text: Philips Semiconductors RF Wideband Transistors General section MOUNTING AND SOLDERING Screen printing Mounting methods This Is the best high-voiume production method of solder paste application. An emulsion-coated, fine mesh screen with apertures etched in the emulsion to coincide with the


    OCR Scan     		PDF

    Untitled

    Abstract: No abstract text available
    Text: Philips Semiconductors General Small-signal Field-effect Transistors MOUNTING AND SOLDERING Screen printing Mounting methods This is the best high-volume production method of solder paste application. An emulsion-coated, fine mesh screen with apertures etched in the emulsion to coincide with the


    OCR Scan     		PDF