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    SOT23-5 FOOTPRINT WAVE SOLDERING Search Results

    SOT23-5 FOOTPRINT WAVE SOLDERING Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    TBAW56 Toshiba Electronic Devices & Storage Corporation Switching Diode, 80 V, 0.215 A, SOT23 Visit Toshiba Electronic Devices & Storage Corporation
    TB67B001BFTG Toshiba Electronic Devices & Storage Corporation Brushless Motor Driver/3 Phases Driver/Vout(V)=25/Iout(A)=3/Square Wave Visit Toshiba Electronic Devices & Storage Corporation
    TC78B011FTG Toshiba Electronic Devices & Storage Corporation Brushless Motor Driver/3 Phases Driver/Vout(V)=30/Square, Sine Wave Visit Toshiba Electronic Devices & Storage Corporation
    TB67B001AFTG Toshiba Electronic Devices & Storage Corporation Brushless Motor Driver/3 Phases Driver/Vout(V)=25/Iout(A)=3/Square Wave Visit Toshiba Electronic Devices & Storage Corporation
    CN-AC3MMDZBAU Amphenol Cables on Demand 3-Pin XLR Male Panel Mount Connector - Amphenol AC3MMDZB-AU - Solder Type (Black + Gold Contacts) Datasheet

    SOT23-5 FOOTPRINT WAVE SOLDERING Datasheets Context Search

    Catalog Datasheet MFG & Type Document Tags PDF

    SOD110 footprint

    Abstract: MSA430 SOD523 footprint MSA428 sot23 footprint SC-76 flux. PHILIPS AN-450 surface mounting methods
    Text: Philips Semiconductors Mounting and Soldering General MOUNTING AND SOLDERING Screen printing Mounting methods This is the best high-volume production method of solder paste application. An emulsion-coated, fine mesh screen with apertures etched in the emulsion to coincide with the


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    MSA426 SOD110 footprint MSA430 SOD523 footprint MSA428 sot23 footprint SC-76 flux. PHILIPS AN-450 surface mounting methods PDF

    SOD80 footprint

    Abstract: SOD87 footprint Soldering guidelines and SMD footprint design SMD footprint design SOD106 land pattern land pattern sot346 SOD110 footprint SOD87 footprint pcb MLC745 smd footprint
    Text: DISCRETE SEMICONDUCTORS DATA SHEET Chapter 4 Soldering guidelines and SMD footprint design Discrete Semiconductor Packages File under Discrete Semiconductors, SC18 July 1997 Philips Semiconductors Discrete Semiconductor Packages Soldering guidelines and SMD


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    MGK391 MSC422 OT457 SC-74) MSC423 SOD80 footprint SOD87 footprint Soldering guidelines and SMD footprint design SMD footprint design SOD106 land pattern land pattern sot346 SOD110 footprint SOD87 footprint pcb MLC745 smd footprint PDF

    qfp 32 land pattern

    Abstract: SSOP16 SSOP24
    Text: Philips Semiconductors PowerMOS transistors Mounting and soldering MOUNTING AND SOLDERING Page INTRODUCTION LEADED DEVICES Handling Soldering GENERAL DATA AND INSTRUCTIONS FOR THE SOT186A; SOT263; TO 220AB General rules Mounting methods Heatsink requirements


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    OT186A; OT263; 220AB components24 MLC747 SSOP16 OT338-1) SSOP24 OT340-1) qfp 32 land pattern SSOP16 SSOP24 PDF

    SOD80 footprint

    Abstract: SOD87 footprint land pattern sot346 SOD110 footprint SOD106 land pattern sod110 land do-41 footprint MSA435 DO-35 land pattern how epoxy can contribute to meniscus
    Text: SECTION 17 MOUNTING AND SOLDERING contents page INTRODUCTION 17 - 2 AXIAL AND RADIAL LEADED DEVICES 17 - 2 Handling 17 - 2 Soldering 17 - 2 Mounting 17 - 3 SURFACE-MOUNT DEVICES 17 - 3 Reflow soldering process 17 - 3 Double-wave soldering process 17 - 7 Hand soldering of microminiature components


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    MSB461 OT163-1) MLC745 SOD80 footprint SOD87 footprint land pattern sot346 SOD110 footprint SOD106 land pattern sod110 land do-41 footprint MSA435 DO-35 land pattern how epoxy can contribute to meniscus PDF

    ssop24 footprint

    Abstract: PowerMos transistors TO220 package SSOP16 SSOP24 SSOP24 300 1 footprint sot89 stencil
    Text: DISCRETE SEMICONDUCTORS Mounting and soldering PowerMOS transistors 1998 Dec 02 Philips Semiconductors PowerMOS transistors Mounting and soldering MOUNTING AND SOLDERING Page INTRODUCTION LEADED DEVICES Handling Soldering GENERAL DATA AND INSTRUCTIONS FOR THE


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    OT186A; OT263; 220AB MLC747 SSOP16 OT338-1) SSOP24 OT340-1) OT338-1 ssop24 footprint PowerMos transistors TO220 package SSOP16 SSOP24 SSOP24 300 1 footprint sot89 stencil PDF

    SOD87 footprint

    Abstract: Soldering guidelines and SMD footprint design sot3391h SOT-34 MSA460 MSA439 SOT343R footprint
    Text: SC18_1999_.book : SC18_CHAPTER_4_1999 1 Wed May 12 11:40:55 1999 CHAPTER 4 SOLDERING GUIDELINES AND SMD FOOTPRINT DESIGN page Introduction 4-2 Axial and radial leaded devices 4-2 Surface-mount devices 4-3 Recommended footprints 4 - 14 SC18_1999_.book : SC18_CHAPTER_4_1999


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    MSD060 OT428. MSC422 OT457 SC-74) MSC423 SOD87 footprint Soldering guidelines and SMD footprint design sot3391h SOT-34 MSA460 MSA439 SOT343R footprint PDF

    smd schottky diode s6

    Abstract: smd schottky diode marking s4 smd schottky diode marking s6 smd schottky diode s4 nxp Tape and Reel Information 1PS75SB45 mg* sot23-4 1PS70SB40 1PS70SB44 1PS79SB40
    Text: BAS40 series; 1PSxxSB4x series General-purpose Schottky diodes Rev. 08 — 13 January 2010 Product data sheet 1. Product profile 1.1 General description General-purpose Schottky diodes in small Surface-Mounted Device SMD plastic packages. Table 1. Product overview


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    BAS40 1PS70SB40 OT323 SC-70 1PS76SB40 OD323 SC-76 1PS79SB40 OD523 SC-79 smd schottky diode s6 smd schottky diode marking s4 smd schottky diode marking s6 smd schottky diode s4 nxp Tape and Reel Information 1PS75SB45 mg* sot23-4 1PS70SB40 1PS70SB44 1PS79SB40 PDF

    nxp Tape and Reel Information

    Abstract: No abstract text available
    Text: BAS40 series; 1PSxxSB4x series General-purpose Schottky diodes Rev. 08 — 13 January 2010 Product data sheet 1. Product profile 1.1 General description General-purpose Schottky diodes in small Surface-Mounted Device SMD plastic packages. Table 1. Product overview


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    BAS40 1PS70SB40 OT323 SC-70 1PS76SB40 OD323 SC-76 1PS79SB40 OD523 SC-79 nxp Tape and Reel Information PDF

    marking 122 PHILIPS SOD323 SC-76

    Abstract: BAS70XY 1PS76SB70 1PS79SB70 BAS70 BAS70-04 BAS70-04W BAS70-05 BAS70-05W BAS70H
    Text: BAS70 series; 1PS7xSB70 series General-purpose Schottky diodes Rev. 08 — 4 May 2006 Product data sheet 1. Product profile 1.1 General description General-purpose Schottky diodes in small Surface-Mounted Device SMD plastic packages. Table 1. Product overview


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    BAS70 1PS7xSB70 1PS76SB70 OD323 SC-76 1PS79SB70 OD523 SC-79 BAS70 BAS70H marking 122 PHILIPS SOD323 SC-76 BAS70XY 1PS76SB70 1PS79SB70 BAS70-04 BAS70-04W BAS70-05 BAS70-05W BAS70H PDF

    smd schottky diode s6

    Abstract: BAS40XY BAS40-4 smd schottky diode s4 1PS75SB45 SOD523 footprint 1PS70SB40 1PS70SB44 1PS76SB40 BAS40
    Text: BAS40 series; 1PSxxSB4x series General-purpose Schottky diodes Rev. 07 — 12 May 2006 Product data sheet 1. Product profile 1.1 General description General-purpose Schottky diodes in small Surface-Mounted Device SMD plastic packages. Table 1. Product overview


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    BAS40 1PS70SB40 OT323 SC-70 1PS76SB40 OD323 SC-76 1PS79SB40 OD523 SC-79 smd schottky diode s6 BAS40XY BAS40-4 smd schottky diode s4 1PS75SB45 SOD523 footprint 1PS70SB40 1PS70SB44 1PS76SB40 PDF

    sod323 reflow

    Abstract: SOD523 footprint SOT323 reflow 1PS76SB70 1PS79SB70 BAS70 BAS70-04 BAS70-04W BAS70-05 BAS70-05W
    Text: BAS70 series; 1PS7xSB70 series General-purpose Schottky diodes Rev. 07 — 18 July 2005 Product data sheet 1. Product profile 1.1 General description General-purpose Schottky diodes in small Surface Mounted Device SMD plastic packages. Table 1: Product overview


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    BAS70 1PS7xSB70 1PS76SB70 OD323 SC-76 1PS79SB70 OD523 SC-79 BAS70 BAS70H sod323 reflow SOD523 footprint SOT323 reflow 1PS76SB70 1PS79SB70 BAS70-04 BAS70-04W BAS70-05 BAS70-05W PDF

    BAS40 SC-70

    Abstract: smd schottky diode s6 sod323 reflow 1PS75SB45 SOt323 marking code 6X smd schottky diode marking s4 smd schottky diode s4 SOD523 footprint 1PS70SB40 1PS70SB44
    Text: BAS40 series; 1PSxxSB4x series General-purpose Schottky diodes Rev. 06 — 9 August 2005 Product data sheet 1. Product profile 1.1 General description General-purpose Schottky diodes in small Surface Mounted Device SMD plastic packages. Table 1: Product overview


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    BAS40 1PS70SB40 OT323 SC-70 1PS76SB40 OD323 SC-76 1PS79SB40 OD523 SC-79 BAS40 SC-70 smd schottky diode s6 sod323 reflow 1PS75SB45 SOt323 marking code 6X smd schottky diode marking s4 smd schottky diode s4 SOD523 footprint 1PS70SB40 1PS70SB44 PDF

    BAS70

    Abstract: sot363 wave soldering
    Text: BAS70 series; 1PS7xSB70 series General-purpose Schottky diodes Rev. 09 — 13 January 2010 Product data sheet 1. Product profile 1.1 General description General-purpose Schottky diodes in small Surface-Mounted Device SMD plastic packages. Table 1. Product overview


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    BAS70 1PS7xSB70 1PS76SB70 OD323 SC-76 1PS79SB70 OD523 SC-79 BAS70 BAS70H sot363 wave soldering PDF

    Soldering guidelines and SMD footprint design

    Abstract: SOD87 footprint SMD footprint design Soldering guidelines SOD106 land pattern sod110 land sot89 stencil SC59 SOD110 footprint "msb900"
    Text: CHAPTER 4 SOLDERING GUIDELINES AND SMD FOOTPRINT DESIGN page Introduction 4-2 Axial and radial leaded devices 4-2 Surface-mount devices 4-3 Recommended footprints 4 - 14 Philips Semiconductors Discrete Semiconductor Packages Soldering guidelines and SMD footprint design


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    OD106, OT223. MSB958 Soldering guidelines and SMD footprint design SOD87 footprint SMD footprint design Soldering guidelines SOD106 land pattern sod110 land sot89 stencil SC59 SOD110 footprint "msb900" PDF

    bc848s

    Abstract: No abstract text available
    Text: BC848 series 30 V, 100 mA NPN general-purpose transistors Rev. 07 — 17 November 2009 Product data sheet 1. Product profile 1.1 General description NPN general-purpose transistors in Surface Mounted Device SMD plastic packages. Table 1. Product overview


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    BC848 BC848B O-236AB BC858B BC848W OT323 SC-70 BC858W bc848s PDF

    BC848B

    Abstract: BC848 NXP Marking Code SMD transistors BC846 BC848 BC848W BC858B BC858W MARKING CODE SMD IC BC848BSOT-23
    Text: BC848 series 30 V, 100 mA NPN general-purpose transistors Rev. 07 — 17 November 2009 Product data sheet 1. Product profile 1.1 General description NPN general-purpose transistors in Surface Mounted Device SMD plastic packages. Table 1. Product overview


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    BC848 BC848B O-236AB BC858B BC848W OT323 SC-70 BC858W BC848B BC848 NXP Marking Code SMD transistors BC846 BC848W BC858B BC858W MARKING CODE SMD IC BC848BSOT-23 PDF

    BAV23

    Abstract: BAV23S smd marking Yd BAV23 diode
    Text: BAV23 series Dual high-voltage switching diodes Rev. 06 — 3 March 2008 Product data sheet 1. Product profile 1.1 General description Dual high-voltage switching diodes, encapsulated in small Surface-Mounted Device SMD plastic packages. Table 1. Product overview


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    BAV23 BAV23A/DG O-236AB BAV23C/DG BAV23S OT143B BAV23S/DG BAV23 BAV23S smd marking Yd BAV23 diode PDF

    BAT721,215

    Abstract: No abstract text available
    Text: 1PS76SB21; BAT721 series Schottky barrier diodes in small packages Rev. 05 — 5 December 2006 Product data sheet 1. Product profile 1.1 General description Planar Schottky barrier diodes with an integrated guard ring for stress protection. Encapsulated in small Surface-Mounted Device SMD plastic packages.


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    1PS76SB21; BAT721 1PS76SB21 OD323 SC-76 BAT721 BAT721A BAT721C BAT721S 1PS76SB21 BAT721,215 PDF

    demultiplexer latch "intervening bit"

    Abstract: BAS101 BAS101S
    Text: BAS101; BAS101S High-voltage switching diodes Rev. 01 — 8 September 2006 Product data sheet 1. Product profile 1.1 General description High-voltage switching diodes, encapsulated in a SOT23 small Surface-Mounted Device SMD plastic package. Table 1. Product overview


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    BAS101; BAS101S BAS101 BAS101 BAS101S demultiplexer latch "intervening bit" PDF

    sot59

    Abstract: No abstract text available
    Text: Philips Sem iconductors Small-signal Transistors General M O U NTIN G AND SOLDERING Screen printing M ounting m ethods This is the best high-volum e production m ethod of solder paste application. An em ulsion-coated, fine mesh screen with apertures etched in the emulsion to coincide with the


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    OT323. OT223. sot59 PDF

    bc 339

    Abstract: No abstract text available
    Text: Philips Semiconductors RF Wideband Transistors General section MOUNTING AND SOLDERING Screen printing Mounting methods This Is the best high-voiume production method of solder paste application. An emulsion-coated, fine mesh screen with apertures etched in the emulsion to coincide with the


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    PDF

    Untitled

    Abstract: No abstract text available
    Text: Philips Semiconductors General Small-signal Field-effect Transistors MOUNTING AND SOLDERING Screen printing Mounting methods This is the best high-volume production method of solder paste application. An emulsion-coated, fine mesh screen with apertures etched in the emulsion to coincide with the


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    PDF

    sot89 stencil

    Abstract: No abstract text available
    Text: Philips Semiconductors PowerMOS transistors Mounting and soldering MOUNTING AND SOLDERING Page INTRODUCTION 1898 LEADED DEVICES Handling Soldering 1898 GENERAL DATA AND INSTRUCTIONS FOR THE SOT186A; SOT263; TO 220AB General rules Mounting methods Heatsink requirements


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    OT186A; OT263; 220AB T0220 SSOP16 SSOP24 OT338-1 OT34Q-1 sot89 stencil PDF

    74ls04 power dissipation

    Abstract: No abstract text available
    Text: MOTOROLA Order this document by MDC3105LT1/D SEMICONDUCTOR TECHNICAL DATA MDC3105LT1 Advance Information Motorola Preferred Device Integrated Relay/Solenoid Driver • Optimized to Switch 3 V to 5 V Relays from a 5 V Rail • Compatible with “TX” and "TQ” Series Telecom Relays Rated up to


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    MDC3105LT1/D MDC3105LT1 D1Q7S22 74ls04 power dissipation PDF