Please enter a valid full or partial manufacturer part number with a minimum of 3 letters or numbers

    SOT1331-1 Search Results

    SOT1331-1 Datasheets (1)

    Part ECAD Model Manufacturer Description Curated Type PDF
    SOT1331-1 NXP Semiconductors Plastic thermal enhanced thin shrink small outline package; 38 leads; body with 4.4 mm; lead pitch 0.5 mm; exposed die pad Original PDF