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    SOT132 Search Results

    SOT132 Datasheets (7)

    Part ECAD Model Manufacturer Description Curated Datasheet Type PDF
    SOT1322-1 NXP Semiconductors Footprint for reflow soldering SOT1322-1 Original PDF
    SOT1324-1 NXP Semiconductors Plastic fine-pitch ball grid array package; 144 balls Original PDF
    SOT1325-1 NXP Semiconductors Plastic thermal enhanced very thin small outline package; no leads; 10 terminals Original PDF
    SOT1327-1 NXP Semiconductors HWSON8: plastic thermal enhanced very very thin small outline package; no leads; 8 terminals Original PDF
    SOT1327-1 NXP Semiconductors Footprint for reflow soldering SOT1327-1 Original PDF
    SOT1328-1 NXP Semiconductors Plastic thin fine-pitch ball grid array package; 80 balls Original PDF
    SOT1329-1 NXP Semiconductors Plastic thin fine-pitch ball grid array package; 100 balls Original PDF

    SOT132 Datasheets Context Search

    Catalog Datasheet MFG & Type Document Tags PDF

    Untitled

    Abstract: No abstract text available
    Text: Package outline FBGA144: plastic fine-pitch ball grid array package; 144 balls SOT1324-1 A B D ball A1 index area A A2 A1 E detail X e1 e C 1/2 e M L K J H G F E D C B A ball A1 index area C A B C Øv Øw b y y1 C e e2 1/2 e 1 2 3 4 5 6 7 8 9 10 11 12 X 5 mm


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    FBGA144: OT1324-1 sot1324-1 MO-205 PDF

    Untitled

    Abstract: No abstract text available
    Text: Package outline TFBGA100: plastic thin fine-pitch ball grid array package; 100 balls A B D SOT1329-1 ball A1 index area A E A2 A1 detail X e1 e C 1/2 e C A B C Øv Øw b y y1 C K J e H G F e2 E D 1/2 e C B A ball A1 index area 1 2 3 4 5 6 7 8 9 10 X 5 mm scale


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    TFBGA100: OT1329-1 sot1329-1 PDF

    hwson8 footprint

    Abstract: No abstract text available
    Text: Reflow soldering footprint Footprint information for reflow soldering of HWSON8 package SOT1327-1 Gx pa + oa 2.0 D P 0.025 0.025 Hy 0.825 0.7 By 0.35 Gy Ay 0.6 0.95 1.25 solder land solder paste deposit solder land plus solder paste occupied area DIMENSIONS in mm


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    OT1327-1 sot1327-1 hwson8 footprint PDF

    Untitled

    Abstract: No abstract text available
    Text: Package outline TFBGA80: plastic thin fine-pitch ball grid array package; 80 balls A B D SOT1328-1 ball A1 index area A E A2 A1 detail X e1 e C 1/2 e C A B C Øv Øw b y y1 C K J e H G F e2 E D 1/2 e C B A ball A1 index area 1 2 3 4 5 6 7 8 9 10 X 5 mm scale


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    TFBGA80: OT1328-1 sot1328-1 PDF

    Untitled

    Abstract: No abstract text available
    Text: PDF: 1999 Apr 16 Philips Semiconductors Package outline Plastic rectangular single-ended flat package; flange mounted; 2 mounting holes; 7 in-line leads SOT132B D A F U q q1 U2 U1 p E 1 2 3 4 5 6 7 L bp w M c e Q e1 e2 e3 e4 e5 e6 10 20 mm scale DIMENSIONS mm are the original dimensions


    Original
    OT132B PDF

    Untitled

    Abstract: No abstract text available
    Text: Reflow soldering footprint Footprint information for reflow soldering of LFBGA223 package SOT1322-1 Hx P P Hy see detail X1 see detail X2 Generic footprint pattern Refer to the package outline drawing for actual layout solder land solder paste deposit solder land plus solder paste


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    LFBGA223 OT1322-1 sot1322-1 PDF

    Untitled

    Abstract: No abstract text available
    Text: Package outline HWSON8: plastic thermal enhanced very very thin small outline package; no leads; 8 terminals; body 2 x 2 x 0.75 mm A B D SOT1327-1 X E terminal 1 index area A A1 c detail X e1 e terminal 1 index area 1/2 e C A B C v w b C y y1 C 1 4 L K Eh


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    OT1327-1 MO-229 sot1327-1 PDF

    Untitled

    Abstract: No abstract text available
    Text: Package outline HVSON10: plastic thermal enhanced very thin small outline package; no leads; 10 terminals; body 10 x 10 x 0.85 mm X A B D SOT1325-1 E A A1 c terminal 1 index area detail X terminal 1 index area e1 e L C b 1 5 C A B C v w y1 C y Eh 10 6 Dh 5 mm


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    HVSON10: OT1325-1 MO-229 sot1325-1 PDF

    Untitled

    Abstract: No abstract text available
    Text: +: 62 1 BGU8052 Low noise high linearity amplifier Rev. 1 — 27 November 2013 Product data sheet 1. Product profile 1.1 General description The BGU8052 is a low noise high linearity amplifier for wireless infrastructure applications, equipped with fast shutdown to support TDD systems. The LNA has a high


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    BGU8052 BGU8052 PDF

    bgy113f

    Abstract: BGY113E SOT321 RF Power Modules BGY113G BGY204 BGY113B BGY133 SOT246 SOT342
    Text: DISCRETE SEMICONDUCTORS DATA SHEET Selection guide RF Power Modules and Transistors for Mobile Phones 1996 Jun 19 File under Discrete Semiconductors, SC09 Philips Semiconductors RF Power Modules and Transistors for Mobile Phones Selection guide VHF CAR MOBILE


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    OT132B BGY143 BGY132 BGY133 BGY135 to174 bgy113f BGY113E SOT321 RF Power Modules BGY113G BGY204 BGY113B BGY133 SOT246 SOT342 PDF

    Untitled

    Abstract: No abstract text available
    Text: Enabling the Mobile Experience High Performance RF for wireless infrastructure Unleash the performance of your RF and microwave designs www.nxp.com/unleash-rf Enabling the Mobile Experience The future is mobile. And mobility means the freedom to innovate, communicate, connect and win.


    Original
    PDF

    Untitled

    Abstract: No abstract text available
    Text: +: 62 1 BGU8053 Low noise high linearity amplifier Rev. 2 — 30 December 2013 Product data sheet 1. Product profile 1.1 General description The BGU8053 is a low noise high linearity amplifier for wireless infrastructure applications, equipped with fast shutdown to support TDD systems. The LNA has a high


    Original
    BGU8053 BGU8053 PDF

    Untitled

    Abstract: No abstract text available
    Text: AN11416 1900 MHz low noise, high linearity amplifier using BGU8052 Rev. 1 — 2 December 2013 Application note Document information Info Content Keywords BGU8052, 1900 MHz, LNA, BTS Abstract This document provides circuit schematic, layout, BOM and typical EVB


    Original
    AN11416 BGU8052 BGU8052, OM7956, BGU8052 PDF

    MRC265

    Abstract: MRC264 Amplifier Modules BGY135 BGY136 VHF Power Amplifier
    Text: Philips Semiconductors Product specification VHF power amplifier modules DESCRIPTION BGY135; BGY136 PINNING -SOT132B Broadband amplifier modules, designed for mobile communications equipments operating directly from 1 2 V vehicle electrical systems. The modules consist of a two stage


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    BGY135; BGY136 -SOT132B BGY135 BGY136 7110fl2fci 0D74272 711002h MRC265 MRC264 Amplifier Modules VHF Power Amplifier PDF

    BGY36

    Abstract: BGY32 BGY33 BGY35 an power amplifier 108 mhz
    Text: Philips Semiconductors Product specification BGY32; BGY33; BGY35; BGY36 VHF power amplifier modules PINNING - SOT132B FEATURESS • Broadband VHF amplifiers DESCRIPTION PIN • 18 W output power 1 RF input • Direct operation from 12 V vehicle electrical systems.


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    BGY32; BGY33; BGY35; BGY36 BGY32, BGY35 BGY36 OT132B PINNING-SOT132B BGY32 BGY33 an power amplifier 108 mhz PDF

    BGY43

    Abstract: vHF amplifier module 245 VHF AMplifier 1047B u1047 PINNING-SOT132B
    Text: Product specification Philips Semiconductors VH F power amplifier module BGY43 PINNING-SOT132B FEATURES • Broadband VHF amplifier • 13 W output power • Direct operation from 12 V vehicle electrical systems PIN 1 RF input 2 ground 3 4 APPLICATIONS 5 • Mobile communication equipment


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    BGY43 BGY43 OT132B PINNING-SOT132B MBE663 7110fl2b 01G4771 OT132B. 010H77E vHF amplifier module 245 VHF AMplifier 1047B u1047 PINNING-SOT132B PDF

    245 VHF AMplifier

    Abstract: BGY43 vhf power module philips vhf amplifier module
    Text: Product specification Philips Semiconductors VH F power amplifier module BGY43 PINNING-SOT132B FEATURES • Broadband VHF amplifier PIN • 13 W output power • Direct operation from 12 V vehicle electrical systems 1 RF input 2 ground 3 4 APPLICATIONS 5 • Mobile communication equipment


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    BGY43 OT132B PINNING-SOT132B 7110fl2b 01G4771 OT132B. 010H77E 245 VHF AMplifier vhf power module philips vhf amplifier module PDF

    d1047

    Abstract: BGY33 d1047* Transistor BGY36 88-108 rf amplifier vHF amplifier module capacitor polyester philips BGY32 BGY35 68-88MHz
    Text: Philips Semiconductors Product specification BGY32; BGY33; BGY35; BGY36 VHF power amplifier modules PINNING - SOT132B FEATURESS • Broadband VHF amplifiers PIN • 18 W output power • Direct operation from 1 2 V vehicle electrical systems. APPLICATIONS


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    BGY32; BGY33; BGY35; BGY36 OT132B BGY32, BGY35 BGY36 OT132B d1047 BGY33 d1047* Transistor 88-108 rf amplifier vHF amplifier module capacitor polyester philips BGY32 68-88MHz PDF

    Untitled

    Abstract: No abstract text available
    Text: N A PIER PHILIPS/DISCRETE b^E » • b b S B ' m D030E11 4b7 « A P X J V BGY32 BGY35 BGY33 BGY36 VHF POWER AMPLIFIER MODULES A range o f broadband amplifier modules designed fo r mobile communications equipments, operating directly from 12 V vehicle electrical systems. The devices w ill produce 18 W output into a 50 S2 load.


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    D030E11 BGY32 BGY35 BGY33 BGY36 BGY32 BGY35 PDF

    BGY33

    Abstract: "Amplifier Modules" Philips bgy32 Philips BGY36 VHF Power amplifier Module philips rf power amplifier module BGY32 BGY35 88-108 rf amplifier an power 88-108 mhz BGY36
    Text: N AMER PHILIPS/DISCRETE • bRE » BGY32 BGY33 BGY35 BGY36 bb53T31 003Q211 4b7 H A P X VHF POWER AMPLIFIER MODULES A range o f broadband amplifier modules designed fo r mobile communications equipments, operating directly from 12 V vehicle electrical systems. The devices w ill produce 18 W output into a 50 £2 load.


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    QQ3DE11 BGY32 BGY33 BGY35 BGY36 BGY33 "Amplifier Modules" Philips bgy32 Philips BGY36 VHF Power amplifier Module philips rf power amplifier module 88-108 rf amplifier an power 88-108 mhz BGY36 PDF

    Untitled

    Abstract: No abstract text available
    Text: RF Power Modules INDEX SELECTION GUIDE GENERAL CONTENTS Page 5 8 12 DEFINITIONS Data Sheet Status Objective specification This data sheet contains target or goal specifications for product development. Preliminary specification This data sheet contains preliminary data; supplementary data may be published later.


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    C4382. PDF

    BPW22A

    Abstract: cm .02m z5u 1kv pin configuration of BFW10 la4347 B2X84 TDA3653 equivalent TRIAC TAG 9322 HEF40106BP equivalent fx4054 core dsq8
    Text: Contents Page Page New product index Combined index and status codes viii x Mullard approved components BS9000, CECC, and D3007 lists CV list Integrated circuits Section index xliii 1 5 Standard functions LOGIC FAMILIES CMOS HE4000B family specifications CMOS HE4000B family survey


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    BS9000, D3007 HE4000B 80RIBUTION BS9000 BPW22A cm .02m z5u 1kv pin configuration of BFW10 la4347 B2X84 TDA3653 equivalent TRIAC TAG 9322 HEF40106BP equivalent fx4054 core dsq8 PDF

    Untitled

    Abstract: No abstract text available
    Text: N AMER P H I L I P S / D I S C R E T E ^ 53=131 0030221 30 b BGY43 b 'l E D J APX L VHF POWER AMPLIFIER MODULE A broadband VHF amplifier module primarily designed for mobile communications equipment, operating directly from 12 V electrical systems. The module will produce a minimum output of 13 W


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    BGY43 mGY43 0D3D22b bbS3T31 bb53T31 OT-132B. PDF

    Amplifier Modules

    Abstract: 22 swg copper wire copper wire s.w.g 22 swg copper wire
    Text: NOV 2 g Philips Com ponents BGY49A/BGY49B Data sheet status Product specification date of issue O ctober 1990 UHF amplifier modules DESCRIPTION The BGY49A and BGY49B are UHF amplifier modules, primarily designed for mobile communications equipment operating from 12.5 V


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    BGY49A/BGY49B BGY49A BGY49B BGY49A) BGY49B) Amplifier Modules 22 swg copper wire copper wire s.w.g 22 swg copper wire PDF