Untitled
Abstract: No abstract text available
Text: Package outline FBGA144: plastic fine-pitch ball grid array package; 144 balls SOT1324-1 A B D ball A1 index area A A2 A1 E detail X e1 e C 1/2 e M L K J H G F E D C B A ball A1 index area C A B C Øv Øw b y y1 C e e2 1/2 e 1 2 3 4 5 6 7 8 9 10 11 12 X 5 mm
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FBGA144:
OT1324-1
sot1324-1
MO-205
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Untitled
Abstract: No abstract text available
Text: Package outline TFBGA100: plastic thin fine-pitch ball grid array package; 100 balls A B D SOT1329-1 ball A1 index area A E A2 A1 detail X e1 e C 1/2 e C A B C Øv Øw b y y1 C K J e H G F e2 E D 1/2 e C B A ball A1 index area 1 2 3 4 5 6 7 8 9 10 X 5 mm scale
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TFBGA100:
OT1329-1
sot1329-1
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hwson8 footprint
Abstract: No abstract text available
Text: Reflow soldering footprint Footprint information for reflow soldering of HWSON8 package SOT1327-1 Gx pa + oa 2.0 D P 0.025 0.025 Hy 0.825 0.7 By 0.35 Gy Ay 0.6 0.95 1.25 solder land solder paste deposit solder land plus solder paste occupied area DIMENSIONS in mm
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OT1327-1
sot1327-1
hwson8 footprint
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Untitled
Abstract: No abstract text available
Text: Package outline TFBGA80: plastic thin fine-pitch ball grid array package; 80 balls A B D SOT1328-1 ball A1 index area A E A2 A1 detail X e1 e C 1/2 e C A B C Øv Øw b y y1 C K J e H G F e2 E D 1/2 e C B A ball A1 index area 1 2 3 4 5 6 7 8 9 10 X 5 mm scale
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TFBGA80:
OT1328-1
sot1328-1
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Untitled
Abstract: No abstract text available
Text: PDF: 1999 Apr 16 Philips Semiconductors Package outline Plastic rectangular single-ended flat package; flange mounted; 2 mounting holes; 7 in-line leads SOT132B D A F U q q1 U2 U1 p E 1 2 3 4 5 6 7 L bp w M c e Q e1 e2 e3 e4 e5 e6 10 20 mm scale DIMENSIONS mm are the original dimensions
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OT132B
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Untitled
Abstract: No abstract text available
Text: Reflow soldering footprint Footprint information for reflow soldering of LFBGA223 package SOT1322-1 Hx P P Hy see detail X1 see detail X2 Generic footprint pattern Refer to the package outline drawing for actual layout solder land solder paste deposit solder land plus solder paste
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LFBGA223
OT1322-1
sot1322-1
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Untitled
Abstract: No abstract text available
Text: Package outline HWSON8: plastic thermal enhanced very very thin small outline package; no leads; 8 terminals; body 2 x 2 x 0.75 mm A B D SOT1327-1 X E terminal 1 index area A A1 c detail X e1 e terminal 1 index area 1/2 e C A B C v w b C y y1 C 1 4 L K Eh
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OT1327-1
MO-229
sot1327-1
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Untitled
Abstract: No abstract text available
Text: Package outline HVSON10: plastic thermal enhanced very thin small outline package; no leads; 10 terminals; body 10 x 10 x 0.85 mm X A B D SOT1325-1 E A A1 c terminal 1 index area detail X terminal 1 index area e1 e L C b 1 5 C A B C v w y1 C y Eh 10 6 Dh 5 mm
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HVSON10:
OT1325-1
MO-229
sot1325-1
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Untitled
Abstract: No abstract text available
Text: +: 62 1 BGU8052 Low noise high linearity amplifier Rev. 1 — 27 November 2013 Product data sheet 1. Product profile 1.1 General description The BGU8052 is a low noise high linearity amplifier for wireless infrastructure applications, equipped with fast shutdown to support TDD systems. The LNA has a high
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BGU8052
BGU8052
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bgy113f
Abstract: BGY113E SOT321 RF Power Modules BGY113G BGY204 BGY113B BGY133 SOT246 SOT342
Text: DISCRETE SEMICONDUCTORS DATA SHEET Selection guide RF Power Modules and Transistors for Mobile Phones 1996 Jun 19 File under Discrete Semiconductors, SC09 Philips Semiconductors RF Power Modules and Transistors for Mobile Phones Selection guide VHF CAR MOBILE
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OT132B
BGY143
BGY132
BGY133
BGY135
to174
bgy113f
BGY113E
SOT321
RF Power Modules
BGY113G
BGY204
BGY113B
BGY133
SOT246
SOT342
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Untitled
Abstract: No abstract text available
Text: Enabling the Mobile Experience High Performance RF for wireless infrastructure Unleash the performance of your RF and microwave designs www.nxp.com/unleash-rf Enabling the Mobile Experience The future is mobile. And mobility means the freedom to innovate, communicate, connect and win.
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Untitled
Abstract: No abstract text available
Text: +: 62 1 BGU8053 Low noise high linearity amplifier Rev. 2 — 30 December 2013 Product data sheet 1. Product profile 1.1 General description The BGU8053 is a low noise high linearity amplifier for wireless infrastructure applications, equipped with fast shutdown to support TDD systems. The LNA has a high
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BGU8053
BGU8053
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Untitled
Abstract: No abstract text available
Text: AN11416 1900 MHz low noise, high linearity amplifier using BGU8052 Rev. 1 — 2 December 2013 Application note Document information Info Content Keywords BGU8052, 1900 MHz, LNA, BTS Abstract This document provides circuit schematic, layout, BOM and typical EVB
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AN11416
BGU8052
BGU8052,
OM7956,
BGU8052
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MRC265
Abstract: MRC264 Amplifier Modules BGY135 BGY136 VHF Power Amplifier
Text: Philips Semiconductors Product specification VHF power amplifier modules DESCRIPTION BGY135; BGY136 PINNING -SOT132B Broadband amplifier modules, designed for mobile communications equipments operating directly from 1 2 V vehicle electrical systems. The modules consist of a two stage
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BGY135;
BGY136
-SOT132B
BGY135
BGY136
7110fl2fci
0D74272
711002h
MRC265
MRC264
Amplifier Modules
VHF Power Amplifier
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BGY36
Abstract: BGY32 BGY33 BGY35 an power amplifier 108 mhz
Text: Philips Semiconductors Product specification BGY32; BGY33; BGY35; BGY36 VHF power amplifier modules PINNING - SOT132B FEATURESS • Broadband VHF amplifiers DESCRIPTION PIN • 18 W output power 1 RF input • Direct operation from 12 V vehicle electrical systems.
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BGY32;
BGY33;
BGY35;
BGY36
BGY32,
BGY35
BGY36
OT132B
PINNING-SOT132B
BGY32
BGY33
an power amplifier 108 mhz
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BGY43
Abstract: vHF amplifier module 245 VHF AMplifier 1047B u1047 PINNING-SOT132B
Text: Product specification Philips Semiconductors VH F power amplifier module BGY43 PINNING-SOT132B FEATURES • Broadband VHF amplifier • 13 W output power • Direct operation from 12 V vehicle electrical systems PIN 1 RF input 2 ground 3 4 APPLICATIONS 5 • Mobile communication equipment
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BGY43
BGY43
OT132B
PINNING-SOT132B
MBE663
7110fl2b
01G4771
OT132B.
010H77E
vHF amplifier module
245 VHF AMplifier
1047B
u1047
PINNING-SOT132B
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245 VHF AMplifier
Abstract: BGY43 vhf power module philips vhf amplifier module
Text: Product specification Philips Semiconductors VH F power amplifier module BGY43 PINNING-SOT132B FEATURES • Broadband VHF amplifier PIN • 13 W output power • Direct operation from 12 V vehicle electrical systems 1 RF input 2 ground 3 4 APPLICATIONS 5 • Mobile communication equipment
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BGY43
OT132B
PINNING-SOT132B
7110fl2b
01G4771
OT132B.
010H77E
245 VHF AMplifier
vhf power module
philips vhf amplifier module
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d1047
Abstract: BGY33 d1047* Transistor BGY36 88-108 rf amplifier vHF amplifier module capacitor polyester philips BGY32 BGY35 68-88MHz
Text: Philips Semiconductors Product specification BGY32; BGY33; BGY35; BGY36 VHF power amplifier modules PINNING - SOT132B FEATURESS • Broadband VHF amplifiers PIN • 18 W output power • Direct operation from 1 2 V vehicle electrical systems. APPLICATIONS
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BGY32;
BGY33;
BGY35;
BGY36
OT132B
BGY32,
BGY35
BGY36
OT132B
d1047
BGY33
d1047* Transistor
88-108 rf amplifier
vHF amplifier module
capacitor polyester philips
BGY32
68-88MHz
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Untitled
Abstract: No abstract text available
Text: N A PIER PHILIPS/DISCRETE b^E » • b b S B ' m D030E11 4b7 « A P X J V BGY32 BGY35 BGY33 BGY36 VHF POWER AMPLIFIER MODULES A range o f broadband amplifier modules designed fo r mobile communications equipments, operating directly from 12 V vehicle electrical systems. The devices w ill produce 18 W output into a 50 S2 load.
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D030E11
BGY32
BGY35
BGY33
BGY36
BGY32
BGY35
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BGY33
Abstract: "Amplifier Modules" Philips bgy32 Philips BGY36 VHF Power amplifier Module philips rf power amplifier module BGY32 BGY35 88-108 rf amplifier an power 88-108 mhz BGY36
Text: N AMER PHILIPS/DISCRETE • bRE » BGY32 BGY33 BGY35 BGY36 bb53T31 003Q211 4b7 H A P X VHF POWER AMPLIFIER MODULES A range o f broadband amplifier modules designed fo r mobile communications equipments, operating directly from 12 V vehicle electrical systems. The devices w ill produce 18 W output into a 50 £2 load.
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QQ3DE11
BGY32
BGY33
BGY35
BGY36
BGY33
"Amplifier Modules"
Philips bgy32
Philips BGY36 VHF Power amplifier Module
philips rf power amplifier module
88-108 rf amplifier
an power 88-108 mhz
BGY36
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Untitled
Abstract: No abstract text available
Text: RF Power Modules INDEX SELECTION GUIDE GENERAL CONTENTS Page 5 8 12 DEFINITIONS Data Sheet Status Objective specification This data sheet contains target or goal specifications for product development. Preliminary specification This data sheet contains preliminary data; supplementary data may be published later.
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C4382.
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BPW22A
Abstract: cm .02m z5u 1kv pin configuration of BFW10 la4347 B2X84 TDA3653 equivalent TRIAC TAG 9322 HEF40106BP equivalent fx4054 core dsq8
Text: Contents Page Page New product index Combined index and status codes viii x Mullard approved components BS9000, CECC, and D3007 lists CV list Integrated circuits Section index xliii 1 5 Standard functions LOGIC FAMILIES CMOS HE4000B family specifications CMOS HE4000B family survey
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BS9000,
D3007
HE4000B
80RIBUTION
BS9000
BPW22A
cm .02m z5u 1kv
pin configuration of BFW10
la4347
B2X84
TDA3653 equivalent
TRIAC TAG 9322
HEF40106BP equivalent
fx4054 core
dsq8
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Untitled
Abstract: No abstract text available
Text: N AMER P H I L I P S / D I S C R E T E ^ 53=131 0030221 30 b BGY43 b 'l E D J APX L VHF POWER AMPLIFIER MODULE A broadband VHF amplifier module primarily designed for mobile communications equipment, operating directly from 12 V electrical systems. The module will produce a minimum output of 13 W
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BGY43
mGY43
0D3D22b
bbS3T31
bb53T31
OT-132B.
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Amplifier Modules
Abstract: 22 swg copper wire copper wire s.w.g 22 swg copper wire
Text: NOV 2 g Philips Com ponents BGY49A/BGY49B Data sheet status Product specification date of issue O ctober 1990 UHF amplifier modules DESCRIPTION The BGY49A and BGY49B are UHF amplifier modules, primarily designed for mobile communications equipment operating from 12.5 V
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BGY49A/BGY49B
BGY49A
BGY49B
BGY49A)
BGY49B)
Amplifier Modules
22 swg copper wire
copper wire s.w.g 22
swg copper wire
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