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    SOT1181 Search Results

    SOT1181 Datasheets (2)

    Part ECAD Model Manufacturer Description Curated Type PDF
    SOT1181-1 NXP Semiconductors Plastic thermal enhanced thin quad flat package; 48 leads; exposed die pad Original PDF
    SOT1181-2 NXP Semiconductors Plastic thermal enhanced thin quad flat package; 48 leads; exposed die pad Original PDF

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    Untitled

    Abstract: No abstract text available
    Text: Package outline HTQFP48: plastic thermal enhanced thin quad flat package; 48 leads; body 10 x 10 x 1 mm; exposed die pad SOT1181-1 c y X exposed die pad A Dh 36 25 37 24 ZE e Eh HE E A A2 A3 A1 w θ bp pin 1 index 48 Lp 13 1 L detail X 12 v ZD w bp A e B D


    Original     		PDF HTQFP48: OT1181-1 MS-026 sot1181-1

    SOT1181-2

    Abstract: No abstract text available
    Text: Package outline HTQFP48: plastic thermal enhanced thin quad flat package; 48 leads; body 10 x 10 x 1 mm; exposed die pad SOT1181-2 c y X exposed die pad A Dh 36 25 37 24 ZE e Eh A HE E A2 A3 A1 w θ bp pin 1 index 48 Lp 13 1 12 e v ZD w bp A B D HD v B 5 max


    Original     		PDF HTQFP48: OT1181-2 MS-026 sot1181-2