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    SOT-86 Search Results

    SOT-86 Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    7UL2T125FK Toshiba Electronic Devices & Storage Corporation One-Gate Logic(L-MOS), Buffer, SOT-765 (US8), -40 to 85 degC Visit Toshiba Electronic Devices & Storage Corporation
    TC75S102F Toshiba Electronic Devices & Storage Corporation Operational Amplifier, 1.5V to 5.5V, I/O Rail to Rail, IDD=0.27μA, SOT-25 Visit Toshiba Electronic Devices & Storage Corporation
    7UL2T126FK Toshiba Electronic Devices & Storage Corporation One-Gate Logic(L-MOS), Buffer, SOT-765 (US8), -40 to 85 degC Visit Toshiba Electronic Devices & Storage Corporation
    TCR2EF18 Toshiba Electronic Devices & Storage Corporation LDO Regulator, Fixed Output, 1.8 V, 200 mA, SOT-25 (SMV) Visit Toshiba Electronic Devices & Storage Corporation
    TCR2LF18 Toshiba Electronic Devices & Storage Corporation LDO Regulator, Fixed Output, 1.8 V, 200 mA, SOT-25 (SMV) Visit Toshiba Electronic Devices & Storage Corporation

    SOT-86 Datasheets (14)

    Part ECAD Model Manufacturer Description Curated Datasheet Type PDF
    SOT860-1 NXP Semiconductors Plastic thermal enhanced ball grid array package; 624 balls; body 40 x 40 x 1.75 mm; heatsink Original PDF
    SOT861-1 NXP Semiconductors Plastic thin fine-pitch ball grid array package; 280 balls; body 14 x 14 x 0.7 mm Original PDF
    SOT862-1 NXP Semiconductors Plastic low profile fine-pitch ball grid array package; 336 balls; body 12 x 12 x 1.05 mm Original PDF
    SOT862-2 NXP Semiconductors Plastic low profile fine-pitch ball grid array package; 336 balls; body 12 x 12 x 1 mm Original PDF
    SOT863-1 NXP Semiconductors Plastic thermal enhanced low profile land grid array package; 48 lands; resin based; body 8 x 7 x 1.4 mm Original PDF
    SOT864-1 NXP Semiconductors Plastic thermal enhanced thin shrink small outline package; 24 leads; body width 4.4 mm; lead pitch 0.65 mm; exposed die pad Original PDF
    SOT865-1 NXP Semiconductors Plastic thermal enhanced very thin quad flat package; no leads; 32 terminals; body 7 x 7 x 0.85 mm Original PDF
    SOT865-2 NXP Semiconductors Plastic thermal enhanced very thin quad flat package; no leads; 32 terminals; body 7 x 7 x 0.85 mm Original PDF
    SOT865-2 NXP Semiconductors Footprint information for reflow soldering of HVQFN32 package Original PDF
    SOT865-3 NXP Semiconductors Plastic thermal enhanced very thin quad flat package; no leads; 32 terminals; body 7 x 7 x 0.85 mm Original PDF
    SOT865-3 NXP Semiconductors Footprint for reflow soldering SOT865-3 Original PDF
    SOT866-1 NXP Semiconductors Plastic thermal enhanced very thin quad flat package; no leads; 32 terminals; body 6 x 6 x 0.85 mm Original PDF
    SOT868-1 NXP Semiconductors Plastic thin fine-pitch ball grid array package; 240 balls; body 12 x 12 x 0.7 mm Original PDF
    SOT869-1 NXP Semiconductors Plastic ball grid array package; 288 balls; body 27 x 27 x 1.55 mm Original PDF