SOT800-1 |
|
NXP Semiconductors
|
Flanged ceramic package; 2 mounting holes; 4 leads |
|
Original |
PDF
|
SOT800-2 |
|
NXP Semiconductors
|
Flanged ceramic package; 2 mounting holes; 4 leads |
|
Original |
PDF
|
SOT800a |
|
NXP Semiconductors
|
Flanged double-ended ceramic package; 2 mounting holes; 4 leads |
|
Original |
PDF
|
SOT802-1 |
|
NXP Semiconductors
|
Plastic thin fine-pitch ball grid array package; 160 balls; body 9 x 13 x 0.8 mm |
|
Original |
PDF
|
SOT802-2 |
|
NXP Semiconductors
|
Plastic thin fine-pitch ball grid array package; 160 balls; body 9 x 13 x 0.7 mm |
|
Original |
PDF
|
SOT803-1 |
|
NXP Semiconductors
|
Footprint for reflow soldering SOT803-1 |
|
Original |
PDF
|
SOT803-1 |
|
NXP Semiconductors
|
Plastic quad flat package; 44 leads (lead length 1.6 mm); body 10 x 10 x 2 mm |
|
Original |
PDF
|
SOT804-1 |
|
NXP Semiconductors
|
Plastic thermal enhanced very thin quad flat package; no leads; 64 terminals; body 9 x 9 x 0.85 mm |
|
Original |
PDF
|
SOT804-1 |
|
NXP Semiconductors
|
Footprint for reflow soldering SOT804-1 |
|
Original |
PDF
|
SOT804-2 |
|
NXP Semiconductors
|
Plastic thermal enhanced very thin quad flat package; no leads; 64 terminals; body 9 x 9 x 0.85 mm |
|
Original |
PDF
|
SOT804-3 |
|
NXP Semiconductors
|
Plastic thermal enhanced very thin quad flat package; no leads; 64 terminals; body 9 x 9 x 0.85 mm |
|
Original |
PDF
|
SOT804-4 |
|
NXP Semiconductors
|
Plastic thermal enhanced very thin quad flat package; no leads; 64 terminals |
|
Original |
PDF
|
SOT804-5 |
|
NXP Semiconductors
|
Plastic thermal enhanced very thin quad flat package; no leads; 64 terminals |
|
Original |
PDF
|
SOT807-1 |
|
NXP Semiconductors
|
Plastic thermal enhanced ball grid array package; 156 balls; body 15 x 15 x 1.15 mm; heatsink |
|
Original |
PDF
|
|
SOT807-1 |
|
NXP Semiconductors
|
Footprint for reflow soldering SOT807-1 |
|
Original |
PDF
|
SOT809-1 |
|
NXP Semiconductors
|
Plastic low profile ball grid array package; 224 balls; body 17 x 17 x 1.05 mm |
|
Original |
PDF
|
SOT810-1 |
|
NXP Semiconductors
|
Plastic thermal enhanced shrink small outline package; no leads; 18 terminals; body 8 x 12 x 2.1 mm |
|
Original |
PDF
|
SOT810-1 |
|
NXP Semiconductors
|
Footprint for reflow soldering SOT810-1 |
|
Original |
PDF
|
SOT811-1 |
|
NXP Semiconductors
|
Plastic ball grid array package; 256 balls; body 17 x 17 x 1.2 mm |
|
Original |
PDF
|
SOT811-1 |
|
NXP Semiconductors
|
Footprint for reflow soldering SOT811-1 |
|
Original |
PDF
|