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    SOT-77 Search Results

    SOT-77 Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    7UL2T125FK Toshiba Electronic Devices & Storage Corporation One-Gate Logic(L-MOS), Buffer, SOT-765 (US8), -40 to 85 degC Visit Toshiba Electronic Devices & Storage Corporation
    TC75S102F Toshiba Electronic Devices & Storage Corporation Operational Amplifier, 1.5V to 5.5V, I/O Rail to Rail, IDD=0.27μA, SOT-25 Visit Toshiba Electronic Devices & Storage Corporation
    7UL2T126FK Toshiba Electronic Devices & Storage Corporation One-Gate Logic(L-MOS), Buffer, SOT-765 (US8), -40 to 85 degC Visit Toshiba Electronic Devices & Storage Corporation
    TCR2EF18 Toshiba Electronic Devices & Storage Corporation LDO Regulator, Fixed Output, 1.8 V, 200 mA, SOT-25 (SMV) Visit Toshiba Electronic Devices & Storage Corporation
    TCR2LF18 Toshiba Electronic Devices & Storage Corporation LDO Regulator, Fixed Output, 1.8 V, 200 mA, SOT-25 (SMV) Visit Toshiba Electronic Devices & Storage Corporation

    SOT-77 Datasheets (12)

    Part ECAD Model Manufacturer Description Curated Datasheet Type PDF
    SOT774-2 NXP Semiconductors Plastic low profile ball grid array package; 208 balls; body 17 x 17 x 1 mm Original PDF
    SOT775a NXP Semiconductors leadless surface mounted package; plastic cap; 16 terminations Original PDF
    SOT776-1 NXP Semiconductors Plastic thermal enhanced shrink small outline package; no leads; 14 terminals; body 12 x 12 x 2.1 mm Original PDF
    SOT777-1 NXP Semiconductors Plastic thin fine-pitch ball grid array package; 100 balls; body 6 x 6 x 0.8 mm Original PDF
    SOT777-1 NXP Semiconductors Footprint for reflow soldering SOT777-1 Original PDF
    SOT778-1 NXP Semiconductors Footprint for reflow soldering SOT778-1 Original PDF
    SOT778-1 NXP Semiconductors Plastic thermal enhanced very thin quad flat package; no leads; 48 terminals; body 6 x 6 x 0.85 mm Original PDF
    SOT778-2 NXP Semiconductors Plastic thermal enhanced very thin quad flat package; no leads; 48 terminals; body 6 x 6 x 0.85 mm Original PDF
    SOT778-3 NXP Semiconductors Plastic thermal enhanced very thin quad flat package; no leads; 48 terminals; body 6 x 6 x 0.85 mm Original PDF
    SOT778-4 NXP Semiconductors Plastic thermal enhanced very thin quad flat package; no leads; 48 terminals; body 6 x 6 x 0.85 mm Original PDF
    SOT778-5 NXP Semiconductors Plastic thermal enhanced very thin quad flat package; no leads; 48 terminals; body 6 x 6 x 0.85 mm Original PDF
    SOT779-1 NXP Semiconductors Plastic thermal enhanced very thin quad flat package; no leads; 48 terminals; body 6 x 6 x 0.85 mm Original PDF