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    SOT-57 Search Results

    SOT-57 Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    7UL2T125FK Toshiba Electronic Devices & Storage Corporation One-Gate Logic(L-MOS), Buffer, SOT-765 (US8), -40 to 85 degC Visit Toshiba Electronic Devices & Storage Corporation
    TC75S102F Toshiba Electronic Devices & Storage Corporation Operational Amplifier, 1.5V to 5.5V, I/O Rail to Rail, IDD=0.27μA, SOT-25 Visit Toshiba Electronic Devices & Storage Corporation
    7UL2T126FK Toshiba Electronic Devices & Storage Corporation One-Gate Logic(L-MOS), Buffer, SOT-765 (US8), -40 to 85 degC Visit Toshiba Electronic Devices & Storage Corporation
    TCR2EF18 Toshiba Electronic Devices & Storage Corporation LDO Regulator, Fixed Output, 1.8 V, 200 mA, SOT-25 (SMV) Visit Toshiba Electronic Devices & Storage Corporation
    TCR2LF18 Toshiba Electronic Devices & Storage Corporation LDO Regulator, Fixed Output, 1.8 V, 200 mA, SOT-25 (SMV) Visit Toshiba Electronic Devices & Storage Corporation

    SOT-57 Datasheets (14)

    Part ECAD Model Manufacturer Description Curated Type PDF
    SOT570-1 NXP Semiconductors Plastic thin fine-pitch ball grid array package; 180 balls Original PDF
    SOT570-1 NXP Semiconductors Footprint for reflow soldering SOT570-1 Original PDF
    SOT570-2 NXP Semiconductors Footprint for reflow soldering SOT570-2 Original PDF
    SOT570-2 NXP Semiconductors Plastic thin fine-pitch ball grid array package; 180 balls Original PDF
    SOT570-3 NXP Semiconductors thin fine-pitch ball grid array package; 180 balls Original PDF
    SOT570-3 NXP Semiconductors Footprint for reflow soldering SOT570-3 Original PDF
    SOT572-1 NXP Semiconductors Plastic low profile quad flat package; 100 leads; body 12 x 12 x 1.4 mm Original PDF
    SOT573-1 NXP Semiconductors Plastic quad flat package; 144 leads (lead length 1.6 mm); body 28 x 28 x 3.4 mm Original PDF
    SOT573-1 NXP Semiconductors Footprint for reflow soldering SOT573-1 Original PDF
    SOT574-1 NXP Semiconductors Plastic thin quad flat package; 128 leads; body 14 x 14 x 1 mm Original PDF
    SOT576-1 NXP Semiconductors Plastic thermal enhanced quad flat package;160 leads (lead length 1.6 mm); body 28 x 28 x 3.4 mm; high stand-off height; heatsink Original PDF
    SOT577-2 NXP Semiconductors Plastic rectangular-DIL-bent-SIL power package; 17 leads (row spacing 2.54 mm) Original PDF
    SOT578-1 NXP Semiconductors Plastic Triple-bent-SIL power package; 13 leads (lead length 7.7 mm) Original PDF
    SOT579-1 NXP Semiconductors Footprint for reflow soldering SOT579-1 Original PDF