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    SOT-115 Search Results

    SOT-115 Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    7UL2T125FK Toshiba Electronic Devices & Storage Corporation One-Gate Logic(L-MOS), Buffer, SOT-765 (US8), -40 to 85 degC Visit Toshiba Electronic Devices & Storage Corporation
    TC75S102F Toshiba Electronic Devices & Storage Corporation Operational Amplifier, 1.5V to 5.5V, I/O Rail to Rail, IDD=0.27μA, SOT-25 Visit Toshiba Electronic Devices & Storage Corporation
    7UL2T126FK Toshiba Electronic Devices & Storage Corporation One-Gate Logic(L-MOS), Buffer, SOT-765 (US8), -40 to 85 degC Visit Toshiba Electronic Devices & Storage Corporation
    TCR2EF18 Toshiba Electronic Devices & Storage Corporation LDO Regulator, Fixed Output, 1.8 V, 200 mA, SOT-25 (SMV) Visit Toshiba Electronic Devices & Storage Corporation
    TCR2LF18 Toshiba Electronic Devices & Storage Corporation LDO Regulator, Fixed Output, 1.8 V, 200 mA, SOT-25 (SMV) Visit Toshiba Electronic Devices & Storage Corporation

    SOT-115 Datasheets (31)

    Part ECAD Model Manufacturer Description Curated Datasheet Type PDF
    SOT115 NXP Semiconductors SOT115 Mounting Original PDF
    SOT1150-1 NXP Semiconductors SOT1150-1_po Original PDF
    SOT1151-1 NXP Semiconductors Plastic thermal enhanced ball grid array package; 640 balls; heatsink Original PDF
    SOT1152-1 NXP Semiconductors Plastic thermal enhanced very thin quad flat package; no leads; 32 terminals; resin based Original PDF
    SOT1153-1 NXP Semiconductors Plastic ball grid array package; 456 balls Original PDF
    SOT1154-1 NXP Semiconductors Plastic dual bent surface mounted SIL power package; 27 leads Original PDF
    SOT1155-1 NXP Semiconductors Plastic thin fine-pitch ball grid array package; 48 balls Original PDF
    SOT1155-1_118 NXP Semiconductors TFBGA48; Reel pack; SMD, 13"Q1/T1 Standard product orientationOrderable part number ending ,118 or JOrdering code (12NC) ending 118 Original PDF
    SOT1155-2 NXP Semiconductors Plastic thin fine-pitch ball grid array package; 48 balls Original PDF
    SOT1156-1 NXP Semiconductors Plastic, thermal enhanced extremely thin small outline package; no leads; 12 terminals Original PDF
    SOT1156-1 NXP Semiconductors Footprint for reflow soldering SOT1156-1 Original PDF
    SOT1157-1 NXP Semiconductors Plastic thermal enhanced extremely thin small outline package; no leads; 8 terminals Original PDF
    SOT1157-1 NXP Semiconductors Footprint for reflow soldering SOT1157-1 Original PDF
    SOT1158-1 NXP Semiconductors Plastic thermal enhanced extremely thin small outline package; no leads; 12 terminals Original PDF
    SOT1158-1 NXP Semiconductors Footprint for reflow soldering SOT1158-1 Original PDF
    SOT1159-1 NXP Semiconductors Footprint for reflow soldering SOT1159-1 Original PDF
    SOT1159-1 NXP Semiconductors Plastic thermal enhanced extremely thin small outline package; no leads; 16 terminals Original PDF
    SOT115AA NXP Semiconductors Plastic thermal enhanced extremely thin small outline package; no leads; 16 terminals Original PDF
    SOT115AD NXP Semiconductors Plastic thermal enhanced extremely thin small outline package; no leads; 16 terminals Original PDF
    SOT115AE NXP Semiconductors Plastic thermal enhanced extremely thin small outline package; no leads; 16 terminals Original PDF