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    SOP16 TRANS Search Results

    SOP16 TRANS Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    TTC5886A Toshiba Electronic Devices & Storage Corporation NPN Bipolar Transistor / hFE=400~1000 / VCE(sat)=0.22V / tf=120ns Visit Toshiba Electronic Devices & Storage Corporation
    TTA2097 Toshiba Electronic Devices & Storage Corporation PNP Bipolar Transistor / hFE=200~500 / VCE(sat)=-0.27V / tf=60ns Visit Toshiba Electronic Devices & Storage Corporation
    XPQR8308QB Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 80 V, 350 A, 0.00083 Ω@10V, L-TOGL Visit Toshiba Electronic Devices & Storage Corporation
    XPQ1R00AQB Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 100 V, 300 A, 0.00103 Ω@10V, L-TOGL Visit Toshiba Electronic Devices & Storage Corporation
    XPH13016MC Toshiba Electronic Devices & Storage Corporation P-ch MOSFET, -60 V, -60 A, 0.0099 Ω@-10V, SOP Advance(WF) Visit Toshiba Electronic Devices & Storage Corporation

    SOP16 TRANS Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    Untitled

    Abstract: No abstract text available
    Text: SOP16 LSI Assembly Units : mm • SOP16 16 9 1 8 4.4 6.2 10.0 H=1.71Max. The contents described herein are subject to change without notice. Appendix Notes No technical content pages of this document may be reproduced in any form or transmitted by any means without prior permission of ROHM CO.,LTD.


    Original     		PDF 71Max.

    SOP16

    Abstract: No abstract text available
    Text: SOP16 LSI Assembly Jisso Information • SOP16 16 9 1 8 0.3MIN 4.4 ±0.2 6.2 ±0.3 10 ±0.2 MAX 10.35 include BURR 0.11 1.5 ± 0.1 0.15 ±0.1 1.27 0.4 ±0.1 The contents described herein are subject to change without notice. 0.1 (Units : mm) Appendix Notes


    Original     		PDF

    Rohm

    Abstract: No abstract text available
    Text: SOP16 LSI Assembly • SOP16 16 9 1 8 0.3MIN 4.4 ±0.2 6.2 ±0.3 10 ±0.2 MAX 10.35 include BURR 0.11 1.5 ± 0.1 0.15 ±0.1 1.27 0.4 ±0.1 The contents described herein are subject to change without notice. 0.1 (Units : mm) Appendix Notes No technical content pages of this document may be reproduced in any form or transmitted by any


    Original     		PDF

    AQS221

    Abstract: AQS221N2S AQS221N2SX AQS221N2SZ
    Text: RF SOP 4 Form A CxR10 AQS221N2S Space-saving low C×R type with 4 channels in a SOP16-pin package 4.4 .173 2.1 .083 10.37 .408 mm inch RF SOP 4 Form A C×R10 (AQS221N2S) FEATURES TYPICAL APPLICATIONS 1. 4-channel (4 Form A) in a small SOP16-pin package


    Original     		PDF AQS221N2S) OP16-pin 083inch-- aqs221n2s: 140509D AQS221 AQS221N2S AQS221N2SX AQS221N2SZ

    Untitled

    Abstract: No abstract text available
    Text: Reliability Tests Report Product Name: TC74VHC4040F Package Name: SOP16 1. Thermal tests Test Item Heat resistance Reflow Heat resistance (Flow) Heat resistance (Iron) Temperature cycling Test Condition Peak : 260 deg.C(a moment) Reflow zone : 230 deg.C 30 to 50 s


    Original     		PDF TC74VHC4040F

    Untitled

    Abstract: No abstract text available
    Text: Reliability Tests Report Product Name: TC74HC4028AF Package Name: SOP16 1. Thermal tests Test Item Heat resistance Reflow Heat resistance (Flow) Heat resistance (Iron) Temperature cycling Test Condition Peak : 260 deg.C(a moment) Reflow zone : 230 deg.C 30 to 50 s


    Original     		PDF TC74HC4028AF

    Untitled

    Abstract: No abstract text available
    Text: Reliability Tests Report Product Name: TC74HC238AF Package Name: SOP16 1. Thermal tests Test Item Heat resistance Reflow Heat resistance (Flow) Heat resistance (Iron) Temperature cycling Test Condition Peak : 260 deg.C(a moment) Reflow zone : 230 deg.C 30 to 50 s


    Original     		PDF TC74HC238AF

    Untitled

    Abstract: No abstract text available
    Text: Reliability Tests Report Product Name: TC74HC166AF Package Name: SOP16 1. Thermal tests Test Item Heat resistance Reflow Heat resistance (Flow) Heat resistance (Iron) Temperature cycling Test Condition Peak : 260 deg.C(a moment) Reflow zone : 230 deg.C 30 to 50 s


    Original     		PDF TC74HC166AF

    Untitled

    Abstract: No abstract text available
    Text: Reliability Tests Report Product Name: TC74VHC257F Package Name: SOP16 1. Thermal tests Test Item Heat resistance Reflow Heat resistance (Flow) Heat resistance (Iron) Temperature cycling Test Condition Peak : 260 deg.C(a moment) Reflow zone : 230 deg.C 30 to 50 s


    Original     		PDF TC74VHC257F

    Untitled

    Abstract: No abstract text available
    Text: Reliability Tests Report Product Name: TC74HC175AF Package Name: SOP16 1. Thermal tests Test Item Heat resistance Reflow Heat resistance (Flow) Heat resistance (Iron) Temperature cycling Test Condition Peak : 260 deg.C(a moment) Reflow zone : 230 deg.C 30 to 50 s


    Original     		PDF TC74HC175AF

    Untitled

    Abstract: No abstract text available
    Text: Reliability Tests Report Product Name: TC74HCT138AF Package Name: SOP16 1. Thermal tests Test Item Heat resistance Reflow Heat resistance (Flow) Heat resistance (Iron) Temperature cycling Test Condition Peak : 260 deg.C(a moment) Reflow zone : 230 deg.C 30 to 50 s


    Original     		PDF TC74HCT138AF

    Untitled

    Abstract: No abstract text available
    Text: Reliability Tests Report Product Name: TC74HC148AF Package Name: SOP16 1. Thermal tests Test Item Heat resistance Reflow Heat resistance (Flow) Heat resistance (Iron) Temperature cycling Test Condition Peak : 260 deg.C(a moment) Reflow zone : 230 deg.C 30 to 50 s


    Original     		PDF TC74HC148AF

    Untitled

    Abstract: No abstract text available
    Text: Reliability Tests Report Product Name: TC74HCT139AF Package Name: SOP16 1. Thermal tests Test Item Heat resistance Reflow Heat resistance (Flow) Heat resistance (Iron) Temperature cycling Test Condition Peak : 260 deg.C(a moment) Reflow zone : 230 deg.C 30 to 50 s


    Original     		PDF TC74HCT139AF

    Untitled

    Abstract: No abstract text available
    Text: Reliability Tests Report Product Name: TC74HCT157AF Package Name: SOP16 1. Thermal tests Test Item Heat resistance Reflow Heat resistance (Flow) Heat resistance (Iron) Temperature cycling Test Condition Peak : 260 deg.C(a moment) Reflow zone : 230 deg.C 30 to 50 s


    Original     		PDF TC74HCT157AF

    Untitled

    Abstract: No abstract text available
    Text: Reliability Tests Report Product Name: TC74HC7292AF Package Name: SOP16 1. Thermal tests Test Item Heat resistance Reflow Heat resistance (Flow) Heat resistance (Iron) Temperature cycling Test Condition Peak : 260 deg.C(a moment) Reflow zone : 230 deg.C 30 to 50 s


    Original     		PDF TC74HC7292AF

    Untitled

    Abstract: No abstract text available
    Text: Reliability Tests Report Product Name: TC74HC138AF Package Name: SOP16 1. Thermal tests Test Item Heat resistance Reflow Heat resistance (Flow) Heat resistance (Iron) Temperature cycling Test Condition Peak : 260 deg.C(a moment) Reflow zone : 230 deg.C 30 to 50 s


    Original     		PDF TC74HC138AF

    Untitled

    Abstract: No abstract text available
    Text: Reliability Tests Report Product Name: TC74LVX4052F Package Name: SOP16 1. Thermal tests Test Item Heat resistance Reflow Heat resistance (Flow) Heat resistance (Iron) Temperature cycling Test Condition Peak : 260 deg.C(a moment) Reflow zone : 230 deg.C 30 to 50 s


    Original     		PDF TC74LVX4052F

    Untitled

    Abstract: No abstract text available
    Text: Reliability Tests Report Product Name: TC74HC109AF Package Name: SOP16 1. Thermal tests Test Item Heat resistance Reflow Heat resistance (Flow) Heat resistance (Iron) Temperature cycling Test Condition Peak : 260 deg.C(a moment) Reflow zone : 230 deg.C 30 to 50 s


    Original     		PDF TC74HC109AF

    Untitled

    Abstract: No abstract text available
    Text: Reliability Tests Report Product Name: TC74HC40102AF Package Name: SOP16 1. Thermal tests Test Item Heat resistance Reflow Heat resistance (Flow) Heat resistance (Iron) Temperature cycling Test Condition Peak : 260 deg.C(a moment) Reflow zone : 230 deg.C 30 to 50 s


    Original     		PDF TC74HC40102AF

    Untitled

    Abstract: No abstract text available
    Text: Reliability Tests Report Product Name: TC74HC237AF Package Name: SOP16 1. Thermal tests Test Item Heat resistance Reflow Heat resistance (Flow) Heat resistance (Iron) Temperature cycling Test Condition Peak : 260 deg.C(a moment) Reflow zone : 230 deg.C 30 to 50 s


    Original     		PDF TC74HC237AF

    ba13002f

    Abstract: 2U diode
    Text: BA13002F Driver, 6-channel, high current The BA13002F is a high current transistor array consisting of six Darlingtonconfigured transistor circuits. Dimensions Units : mm BA13002F (SOP16) The necessary surge-absorbing diodes and base current-control resistors are


    OCR Scan     		PDF BA13002F BA13002F 2U diode

    E67349

    Abstract: TLP270D
    Text: TOSHIBA TENTATIVE TLP270D TOSHIBA PHOTOCOUPLER MOBILE /NOTE PCs GaAs IRED & PHOTO-MOS FET/PHOTO-TRANSISTOR TLP270D PDAs MULTIMEDIA TVs MODEMS TLP270D has many multi-functions in DAA circuits for modems, which is a fully integrated design photocoupler in a 14pin SOP16 .


    OCR Scan     		PDF TLP270D TLP270D 14pin E67349

    E67349

    Abstract: TLP270D TRANSISTOR electronic bridge rectifier diode toshiba
    Text: TOSHIBA TENTATIVE TLP270D TOSHIBA PHOTOCOUPLER MOBILE/NOTE PCs GaAs IRED & PHOTO-MOS FET/PHOTO-TRANSISTOR TLP270D PDAs MULTIMEDIA TVs MODEMS TLP270D has many multi-functions in DAA circuits for modems, which is a fully integrated design photocoupler in a 14pin SOP16 .


    OCR Scan     		PDF TLP270D TLP270D 14pin 25hen E67349 TRANSISTOR electronic bridge rectifier diode toshiba

    Untitled

    Abstract: No abstract text available
    Text: T O SH IB A TENTATIVE TLP270D TOSHIBA PHOTOCOUPLER M OBILE/NOTE PCs GaAs IRED & PHOTO-MOS FET/PHOTO-TRANSISTOR TLP270D PDAs MULTIMEDIA TVs MODEMS TLP270D has many multi-functions in DAA circuits for modems, which is a fully integrated design photocoupler in a 14pin SOP16


    OCR Scan     		PDF TLP270D TLP270D 14pin