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    SOP14 PACKAGE Search Results

    SOP14 PACKAGE Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    TC74HC14AF Toshiba Electronic Devices & Storage Corporation CMOS Logic IC, Inverter, SOP14 Visit Toshiba Electronic Devices & Storage Corporation
    TPH9R00CQH Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 150 V, 64 A, 0.009 Ohm@10V, SOP Advance / SOP Advance(N) Visit Toshiba Electronic Devices & Storage Corporation
    TPH9R00CQ5 Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 150 V, 64 A, 0.009 Ω@10 V, High-speed diode, SOP Advance / SOP Advance(N) Visit Toshiba Electronic Devices & Storage Corporation
    TPH1R306PL Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 60 V, 100 A, 0.00134 Ω@10 V, SOP Advance / SOP Advance(N) Visit Toshiba Electronic Devices & Storage Corporation
    TPHR8504PL Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 40 V, 150 A, 0.00085 Ω@10 V, SOP Advance / SOP Advance(N) Visit Toshiba Electronic Devices & Storage Corporation

    SOP14 PACKAGE Datasheets (1)

    Part ECAD Model Manufacturer Description Curated Datasheet Type PDF
    SOP14 Package ROHM Lsi Assembly Original PDF

    SOP14 PACKAGE Datasheets Context Search

    Catalog Datasheet Type Document Tags PDF

    Untitled

    Abstract: No abstract text available
    Text: Reliability Tests Report Product Name: TC74VHC10F Package Name: SOP14 1. Thermal tests Test Item Heat resistance Reflow Heat resistance (Flow) Heat resistance (Iron) Temperature cycling Test Condition Peak : 260 deg.C(a moment) Reflow zone : 230 deg.C 30 to 50 s


    Original     		TC74VHC10F PDF

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    Abstract: No abstract text available
    Text: Reliability Tests Report Product Name: TC74HC03AF Package Name: SOP14 1. Thermal tests Test Item Heat resistance Reflow Heat resistance (Flow) Heat resistance (Iron) Temperature cycling Test Condition Peak : 260 deg.C(a moment) Reflow zone : 230 deg.C 30 to 50 s


    Original     		TC74HC03AF PDF

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    Abstract: No abstract text available
    Text: Reliability Tests Report Product Name: TC74HC393AF Package Name: SOP14 1. Thermal tests Test Item Heat resistance Reflow Heat resistance (Flow) Heat resistance (Iron) Temperature cycling Test Condition Peak : 260 deg.C(a moment) Reflow zone : 230 deg.C 30 to 50 s


    Original     		TC74HC393AF PDF

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    Abstract: No abstract text available
    Text: Reliability Tests Report Product Name: TC74HCT02AF Package Name: SOP14 1. Thermal tests Test Item Heat resistance Reflow Heat resistance (Flow) Heat resistance (Iron) Temperature cycling Test Condition Peak : 260 deg.C(a moment) Reflow zone : 230 deg.C 30 to 50 s


    Original     		TC74HCT02AF PDF

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    Abstract: No abstract text available
    Text: Reliability Tests Report Product Name: TC74VHC393F Package Name: SOP14 1. Thermal tests Test Item Heat resistance Reflow Heat resistance (Flow) Heat resistance (Iron) Temperature cycling Test Condition Peak : 260 deg.C(a moment) Reflow zone : 230 deg.C 30 to 50 s


    Original     		TC74VHC393F PDF

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    Abstract: No abstract text available
    Text: Reliability Tests Report Product Name: TC74LCX02F Package Name: SOP14 1. Thermal tests Test Item Heat resistance Reflow Heat resistance (Flow) Heat resistance (Iron) Temperature cycling Test Condition Peak : 260 deg.C(a moment) Reflow zone : 230 deg.C 30 to 50 s


    Original     		TC74LCX02F PDF

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    Abstract: No abstract text available
    Text: Reliability Tests Report Product Name: TC74HC4024AF Package Name: SOP14 1. Thermal tests Test Item Heat resistance Reflow Heat resistance (Flow) Heat resistance (Iron) Temperature cycling Test Condition Peak : 260 deg.C(a moment) Reflow zone : 230 deg.C 30 to 50 s


    Original     		TC74HC4024AF PDF

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    Abstract: No abstract text available
    Text: Reliability Tests Report Product Name: TC74VHC74F Package Name: SOP14 1. Thermal tests Test Item Heat resistance Reflow Heat resistance (Flow) Heat resistance (Iron) Temperature cycling Test Condition Peak : 260 deg.C(a moment) Reflow zone : 230 deg.C 30 to 50 s


    Original     		TC74VHC74F PDF

    MA1015

    Abstract: No abstract text available
    Text: BU4011B BU4011BF Quad 2-input NAND gate The BU4011B and BU4011BF consist of four NAND gates in a single structure. They are suitable for CMOS circuits. Features • available in DIP14 and SOP14 packages. • low power consumption • wide supply voltage range


    OCR Scan     		BU4011B BU4011BF BU4011BF DIP14 BU4011B DIP14) BU4011B, MA1015 PDF

    Untitled

    Abstract: No abstract text available
    Text: Reliability Tests Report Product Name: TC74LCX00F Package Name: SOP14 1. Thermal tests Test Item Heat resistance Reflow Heat resistance (Flow) Heat resistance (Iron) Temperature cycling Test Condition Peak : 260 deg.C(a moment) Reflow zone : 230 deg.C 30 to 50 s


    Original     		TC74LCX00F PDF

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    Abstract: No abstract text available
    Text: Reliability Tests Report Product Name: TC74HCU04AF Package Name: SOP14 1. Thermal tests Test Item Heat resistance Reflow Heat resistance (Flow) Heat resistance (Iron) Temperature cycling Test Condition Peak : 260 deg.C(a moment) Reflow zone : 230 deg.C 30 to 50 s


    Original     		TC74HCU04AF PDF

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    Abstract: No abstract text available
    Text: Reliability Tests Report Product Name: TC74HC125AF Package Name: SOP14 1. Thermal tests Test Item Heat resistance Reflow Heat resistance (Flow) Heat resistance (Iron) Temperature cycling Test Condition Peak : 260 deg.C(a moment) Reflow zone : 230 deg.C 30 to 50 s


    Original     		TC74HC125AF PDF

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    Abstract: No abstract text available
    Text: Reliability Tests Report Product Name: TC74VHCU04F Package Name: SOP14 1. Thermal tests Test Item Heat resistance Reflow Heat resistance (Flow) Heat resistance (Iron) Temperature cycling Test Condition Peak : 260 deg.C(a moment) Reflow zone : 230 deg.C 30 to 50 s


    Original     		TC74VHCU04F PDF

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    Abstract: No abstract text available
    Text: Reliability Tests Report Product Name: TC74HC107AF Package Name: SOP14 1. Thermal tests Test Item Heat resistance Reflow Heat resistance (Flow) Heat resistance (Iron) Temperature cycling Test Condition Peak : 260 deg.C(a moment) Reflow zone : 230 deg.C 30 to 50 s


    Original     		TC74HC107AF PDF

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    Abstract: No abstract text available
    Text: Reliability Tests Report Product Name: TC74HCT7007AF Package Name: SOP14 1. Thermal tests Test Item Heat resistance Reflow Heat resistance (Flow) Heat resistance (Iron) Temperature cycling Test Condition Peak : 260 deg.C(a moment) Reflow zone : 230 deg.C 30 to 50 s


    Original     		TC74HCT7007AF PDF

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    Abstract: No abstract text available
    Text: Reliability Tests Report Product Name: TC74LCX125F Package Name: SOP14 1. Thermal tests Test Item Heat resistance Reflow Heat resistance (Flow) Heat resistance (Iron) Temperature cycling Test Condition Peak : 260 deg.C(a moment) Reflow zone : 230 deg.C 30 to 50 s


    Original     		TC74LCX125F PDF

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    Abstract: No abstract text available
    Text: Reliability Tests Report Product Name: TC74VHCT74AF Package Name: SOP14 1. Thermal tests Test Item Heat resistance Reflow Heat resistance (Flow) Heat resistance (Iron) Temperature cycling Test Condition Peak : 260 deg.C(a moment) Reflow zone : 230 deg.C 30 to 50 s


    Original     		TC74VHCT74AF PDF

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    Abstract: No abstract text available
    Text: Reliability Tests Report Product Name: TC74HCT08AF Package Name: SOP14 1. Thermal tests Test Item Heat resistance Reflow Heat resistance (Flow) Heat resistance (Iron) Temperature cycling Test Condition Peak : 260 deg.C(a moment) Reflow zone : 230 deg.C 30 to 50 s


    Original     		TC74HCT08AF PDF

    ba10339fv

    Abstract: BA10339 BA10339F
    Text: BA10339 BA10339F BA10339FV Quad comparators The BA10339, BA10339F, and BA10339FV each consist of four comparators in a single package. The open-collector output allows a wired OR connection. Dimensions Units : mm BA10339 (DIP14) o Features available in DIP14, SOP14, and


    OCR Scan     		BA10339 BA10339F BA10339FV BA10339, BA10339F, BA10339FV DIP14, SSOP-B14 BA10339 DIP14) PDF

    4069UBF

    Abstract: 4069U 4069UB BU4069UB
    Text: BU4069UB BU4069UBF Hex inverter The BU4069UB and 4069UBF consist of 6 inverters in a single package. Dimensions Units : mm BU4069B (DIP14) They are suitable for use in CMOS circuits. 19.4± 0.3 Features • available in DIP14 and SOP14 packages • low power consumption


    OCR Scan     		BU4069UB BU4069UBF 4069UBF DIP14 BU4069B DIP14) BU4069BF BU4000B BU4069UB, 4069U 4069UB PDF

    Untitled

    Abstract: No abstract text available
    Text: Reliability Tests Report Product Name: TC74LVX125F Package Name: SOP14 1. Thermal tests Test Item Heat resistance Reflow Heat resistance (Flow) Heat resistance (Iron) Temperature cycling Test Condition Peak : 260 deg.C(a moment) Reflow zone : 230 deg.C 30 to 50 s


    Original     		TC74LVX125F PDF

    Untitled

    Abstract: No abstract text available
    Text: Reliability Tests Report Product Name: TC74HC86AF Package Name: SOP14 1. Thermal tests Test Item Heat resistance Reflow Heat resistance (Flow) Heat resistance (Iron) Temperature cycling Test Condition Peak : 260 deg.C(a moment) Reflow zone : 230 deg.C 30 to 50 s


    Original     		TC74HC86AF PDF

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    Abstract: No abstract text available
    Text: Reliability Tests Report Product Name: TC74VHC11F Package Name: SOP14 1. Thermal tests Test Item Heat resistance Reflow Heat resistance (Flow) Heat resistance (Iron) Temperature cycling Test Condition Peak : 260 deg.C(a moment) Reflow zone : 230 deg.C 30 to 50 s


    Original     		TC74VHC11F PDF

    Untitled

    Abstract: No abstract text available
    Text: Reliability Tests Report Product Name: TC74VHC20F Package Name: SOP14 1. Thermal tests Test Item Heat resistance Reflow Heat resistance (Flow) Heat resistance (Iron) Temperature cycling Test Condition Peak : 260 deg.C(a moment) Reflow zone : 230 deg.C 30 to 50 s


    Original     		TC74VHC20F PDF