pine alpha cleaning
Abstract: Pine Alpha AK225AES AK-225AES ST-100S
Text: HANDLING PRECAUTIONS • Soldering Conditions Please refer to each product to see if it’s compatible with lead-free soldering. Conventional Soldering Conditions SOLDERING IRON DIP SOLDERING REFLOW SOLDERING Iron Tip Temperature: 300°C Max. 30W Max. Soldering Time: 3 Seconds Max.
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AK-225AES
ST-100S
AK225AES
AAR121and
AAA121)
pine alpha cleaning
Pine Alpha
AK-225AES
ST-100S
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seam seal process
Abstract: No abstract text available
Text: Soldering Methodologies MEMSIC products are designed to withstand the temperature excursions experienced during hand soldering, reflow soldering, or wave soldering as the following procedures are followed. Manual Soldering. When soldering manually or repairing via soldering Iron or heat gun the time should be limited
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washing machine circuit diagram
Abstract: washing machine circuit circuit diagram of toshiba washing machine washing machine washing machine electric circuit WASHING machine controller rohm mcr mvr21 Ultrasonic washing washing machine control
Text: Soldering conditions Resistors Soldering conditions for Resistors Lead free paste Sn-3Ag-0.5Cu version CONTENTS Recommended conditions for reflow soldering 2/5 Recommended conditions for flow soldering 2/5 Recommended conditions for manual soldering 2/5
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"Solid State Relay"
Abstract: No abstract text available
Text: • Solid State Relay : Lead-free part soldering conditions DIP6pin SMD / DIP8pin(SMD) ● Soldering Method Reflow Soldering: Reflow soldering should follow the temperature profile shown below. Soldering should not exceed the curve of temperature profile and time.
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Untitled
Abstract: No abstract text available
Text: Soldering Profile à Soldering Typocal Performance Characteristics • Profile Reflow Soldering Pre-heating Soldering Cooling 230 5 250 200 150 100 60 sec. min 10 sec. max 60 sec. min Flow Soldering Pre-heating Soldering Cooling 230 5 250 200 150 100 60 sec. min
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phototriac
Abstract: No abstract text available
Text: • Phototriaccoupler : Lead-free part soldering conditions SOP4pin ● Soldering Method Reflow Soldering: Reflow soldering should follow the temperature profile shown below. Soldering should not exceed the curve of temperature profile and time. Please don't solder more than twice.
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SOP4
Abstract: No abstract text available
Text: • Photocoupler : Lead-free part soldering conditions DIP4pin SMD / DIP6pin(SMD) / DIP8pin(SMD) / DIP16pin(SMD) ● Soldering Method Reflow Soldering: Reflow soldering should follow the temperature profile shown below. Soldering should not exceed the curve of temperature profile and time.
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DIP16pin
SOP4
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M705-GRN360-K2V
Abstract: M705-GRN360-K2-V solder paste M705-GRN360-K2-V M705-GRN-360-K2-V M705-GRN360 1SS376 1SS355 1SS380 750H ST-100S
Text: Soldering conditions Surface mounted glass Diodes Condition of soldering for Surface mounted glass Diodes Lead free paste Sn-3Ag-0.5Cu version CONTENTS Recommended condition of reflow soldering 2/5 Recommended condition of flow soldering 2/5 Condition of hand soldering
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washing machine circuit diagram
Abstract: circuit diagram of toshiba washing machine washing machine electric circuit washing machine circuit washing machine toshiba 750H ESR10 MCR006 MCR01 MCR03
Text: Soldering conditions Resistors Soldering condition for Resistors Lead free paste Sn-3Ag-0.5Cu version CONTENTS Recommended condition of reflow soldering 2/4 Recommended condition of flow soldering 2/4 Recommended condition of hand soldering 2/4 Recommended condition of washing
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M705-GRN360-K2-V
Abstract: M705-GRN360-K2V M705-GRN360 TOSHIBA GLASS MOLD M705-GRN-360-K2-V solder paste M705-GRN360-K2-V 1SS376 M705-GRN360-K2 1SS355 1SS380
Text: Soldering conditions Surface mounted mold Diodes Condition of soldering for Surface mounted mold Diodes Lead free paste Sn-3Ag-0.5Cu version CONTENTS Recommended condition of reflow soldering 2/5 Recommended condition of flow soldering 2/5 Condition of hand soldering
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M705-GRN360-K2V
Abstract: M705-GRN360-K2-V solder paste M705-GRN360-K2-V M705-GRN-360-K2-V 1SS376 1SS355 UMD2 ROHM rohm surface mounted transistor series VMD2 M705 water level controller circuit diagram
Text: Soldering conditions Surface mounted glass Diodes Condition of soldering for Surface mounted glass Diodes Lead free paste Sn-3Ag-0.5Cu version CONTENTS Recommended condition of reflow soldering 2/5 Recommended condition of flow soldering 2/5 Condition of hand soldering
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Untitled
Abstract: No abstract text available
Text: 22355 Abracon CORX 2-29.qxd 3/6/00 6:56 AM Page 69 CRYSTALS AND OSCILLATORS RECOMMENDED SOLDER REFLOW TYPICAL SOLDERING CONDITIONS FOR CRYSTALS AND OSCILLATORS SOLDERING METHOD SOLDERING IRON SOLDERING DIP Pre-heat REFLOW Reflow SOLDERING CONDITIONS TEMPERATURE
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pine alpha st-100s arakawa chemical
Abstract: 2SB1051K tssop8 package 750H ST-100S
Text: Soldering conditions Surface mount type Transistors Condition of soldering for Surface mount type Transistors Lead free paste Sn-3Ag-0.5Cu version CONTENTS Recommended condition of reflow soldering 2/4 Recommended condition of flow soldering 2/4 Condition of hand soldering
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M705-GRN360
Abstract: M705-GRN360-K2V M705-GRN360-K2-V water level control circuit diagram water level controller circuit diagram solder paste M705-GRN360-K2-V 1SS376 M705 M705 solder paste C 245 B
Text: Soldering conditions Surface mounted glass Diodes Condition of soldering for Surface mounted glass Diodes Lead free paste Sn-3Ag-0.5Cu version CONTENTS Recommended condition of reflow soldering 2/5 Recommended condition of flow soldering 2/5 Condition of hand soldering
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M705-GRN360-K2V
Abstract: M705-GRN360-K2-V M705-GRN-360-K2-V 1SS376 M705-GRN360 1SS355 UMD2 ROHM 1SS355 1SS380 750H ST-100S
Text: Soldering conditions Surface mounted mold Diodes Condition of soldering for Surface mounted mold Diodes Lead free paste Sn-3Ag-0.5Cu version CONTENTS Recommended condition of reflow soldering 2/5 Recommended condition of flow soldering 2/5 Condition of hand soldering
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Untitled
Abstract: No abstract text available
Text: Surface Mount Resistors Recommended Soldering Conditions • Recommended Soldering Conditions Recommendations and precautions are described below. ● Rectagular Type ● Recommended soldering conditions for reflow • Reflow soldering shall be performed a maximum of
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Untitled
Abstract: No abstract text available
Text: RECOMMENDED SOLDERING METHODS <§ 1. SOLDERING METHOD There are two methods for SMD, flow soldering dipping into the solder bath and reflow soldering. RECOMMENDED SOLDERING METHODS Package -> SC K-Pack T-Pack X X Methods i Flow Soldering Reflow Soldering
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CE071
Abstract: No abstract text available
Text: MICROWAVE ISOLATOR-SURFACE MOUNT CE071/CE07A Series SOLDERING 1. Reflow Soldering 2. Soldering with soldering iron Soldering must be carried out without exceeding the approved soldering tem perature and time shown within the shaded area in Fig. 1. When soldering is repeated, the
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CE071/CE07A
CE071
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CE07A
Abstract: No abstract text available
Text: CUSTOM PRODUCTS ib i MICROWAVE ISOLATOR & CIRCULATOR-SURFACE MOUNT CE07A/CE071/CE072 Series SOLDERING 1. Reflow Soldering 2. Soldering with soldering iron Soldering must be carried out w ithout exceeding the approved soldering tem perature and time shown within the
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CE07A/CE071/CE072
CE071/CE07A
CE07A
CE07A
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Untitled
Abstract: No abstract text available
Text: SURFACE MOUNT INDUCTORS SOLDERING SOLDERING METHOD 2. Soldering Conditions Chip coils can be flow or reflow soldered. LQS33N and LQP21A/31A should be reflow soldered only. Please contact Murata Electronics regarding other soldering methods. RECOMMENDED SOLDERING CONDITIONS
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LQS33N
LQP21A/31A
LQS33
LQP11A
LQP21A
LQP31A
LQN21A
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profile wave soldering
Abstract: No abstract text available
Text: yA V - y A TANTALUM CAPACITORS Soldering Methods SOLDERING METHODS Solid tantalum chip capacitors can be attached by wave soldering or reflow soldering methods. The reflow soldering method however has become more popular since this process has been developed specifically for SMT components. Hand soldering is not
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Untitled
Abstract: No abstract text available
Text: CERAMIC MICROWAVE FILTERS SOLDERING & PACKAGING REFLOW SOLDERING CONDITIONS Note: The maximum tem perature and time of soldering is shown in Figure 1. The soldering condition should be within the indicated line area. In case the soldering is repeated, the
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57P002BLLA
178mm
330mm
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Untitled
Abstract: No abstract text available
Text: Soldering Conditions Recommended Pattern Pattern Dimensions Unit: mm LL2012-F Series a b c Flow Soldering 1.0-1.4 0.8 - 1.2 0.8 ~ 1.0 Reflow Soldering 1.0- 1.2 0 .6 - 1.0 0.8 - 1.2 LL1608-F/FH Series Flow Soldering 0.8 - 1.0 0.8 - 1.0 0.6 - 0.8 Reflow Soldering
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LL2012-F
LL1608-F/FH
LL1005-FH
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DFC21R57P002HHA
Abstract: No abstract text available
Text: CERAMIC MICROWAVE FILTERS SOLDERING & PACKAGING tn u ffn tn /kA cm tcr in Gec&m/& REFLOW SOLDERING CONDITIONS The maximum temperature and time of soldering is shown in Figure 1. The soldering condition should be within the indicated line area. In case the soldering is repeated, the
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DFC21R57P002HHA
TA2210
TypeTA2110
178mm
TA2210:
330mm
CG01-H
DFC21R57P002HHA
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