Untitled
Abstract: No abstract text available
Text: SOLDERING INSTRUCTIONS FOR THROUGH HOLE LEDs DIP AND WAVE SOLDERING Temperature Maximum of the Soldering Soldering Bath Time IRON SOLDERING with 1.5mm IRON TIP Distance from Solder Joint to Case Temperature of the Soldering Iron Maximum Soldering Time Distance From
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260oC
880nm
940nm
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pine alpha cleaning
Abstract: Pine Alpha AK225AES AK-225AES ST-100S
Text: HANDLING PRECAUTIONS • Soldering Conditions Please refer to each product to see if it’s compatible with lead-free soldering. Conventional Soldering Conditions SOLDERING IRON DIP SOLDERING REFLOW SOLDERING Iron Tip Temperature: 300°C Max. 30W Max. Soldering Time: 3 Seconds Max.
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AK-225AES
ST-100S
AK225AES
AAR121and
AAA121)
pine alpha cleaning
Pine Alpha
AK-225AES
ST-100S
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seam seal process
Abstract: No abstract text available
Text: Soldering Methodologies MEMSIC products are designed to withstand the temperature excursions experienced during hand soldering, reflow soldering, or wave soldering as the following procedures are followed. Manual Soldering. When soldering manually or repairing via soldering Iron or heat gun the time should be limited
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AT350
Abstract: No abstract text available
Text: See page 89. -95- http://www.dailywell.com -96- http://www.dailywell.com SOLDERING PROCESSES MANUAL SOLDERING Use soldering iron of 30 watts, controlled at 350 approximately 5 seconds while applying solder. WAVE SOLDERING Recommended Soldering Temperature:260 5
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T200
Abstract: T230 dip electrolytic capacitor
Text: SOLDERING CONDITIONS ALUMINUM ELECTROLYTIC CAPACITORS • Recommended soldering conditions ● Chip type aluminum electrolytic capacitors Lead free (1) Methods See the following Methods Advisability Reflow soldering Soldering iron ○ Flow soldering
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2006/2007E
2010/2011E
T200
T230
dip electrolytic capacitor
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SOLDERing
Abstract: No abstract text available
Text: See Page 115. See Page 115. -129- http://www.dailywell.com -131- http://www.dailywell.com SOLDERING PROCESSES MANUAL SOLDERING Use soldering iron of 30 watts, controlled at 350 approximately 5 seconds while applying solder. WAVE SOLDERING Recommended Soldering Temperature:260 5
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Untitled
Abstract: No abstract text available
Text: 22355 Abracon CORX 2-29.qxd 3/6/00 6:56 AM Page 69 CRYSTALS AND OSCILLATORS RECOMMENDED SOLDER REFLOW TYPICAL SOLDERING CONDITIONS FOR CRYSTALS AND OSCILLATORS SOLDERING METHOD SOLDERING IRON SOLDERING DIP Pre-heat REFLOW Reflow SOLDERING CONDITIONS TEMPERATURE
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Aluminum Electrolytic Capacitors
Abstract: No abstract text available
Text: Soldering of aluminum electrolytic capacitors Hand soldering soldering iron 1. When soldering aluminum electrolytic capacitors with a soldering iron the exposure should be limited to 260°C for 10 seconds or 350°C for 3 seconds. 2. At no time should the soldering iron come in contact with the capacitor body. Contact with the body can cause
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Weller EC1302A
Abstract: weller ec1503a EC1002 WTL1000 EC1201A WES50 EC1503A W-S-6536 Mil-S-45743 EC1302A
Text: Weller Cooper Tools Weller Soldering Stations, Irons and Tips ¨ WES50 Electronically Controlled Soldering Station WTL1000 Soldering Stations Weller has developed an innovative and economical soldering station that is truly powerful. It is ideal for continuous
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WES50
WTL1000
WES50.
with984-0303
EC1201A
EC1302B
EPH101
EC1503A
Weller EC1302A
weller ec1503a
EC1002
W-S-6536
Mil-S-45743
EC1302A
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Untitled
Abstract: No abstract text available
Text: SMD TYPE LED Suntan SMT Reflow Soldering Instructions 1. Reflow soldering should not be done more than two times. 2. When soldering, do not put stress on the LEDs during heating. Soldering iron 1. When hand soldering, the temperature of the iron must less than 300℃ for 3 seconds
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Untitled
Abstract: No abstract text available
Text: Quartz Crystal Units n Precautions for Use [Manual Soldering Heat Resistance] 3. Reflow Soldering The figure below shows the standards for reflow soldering Use condition: Apply 400 °C soldering iron to product terminal temperature profiles of surface-mount type crystal units.
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Soldering Conditions
Abstract: soldering
Text: Recommended soldering conditions of EOREX Pb-Free products 1 Surface Mount Type SMD IR reflow with a peak temperature of 260°C Wave soldering with molten solder in a 260°C soldering bath Partial lead heating via a 350°C solder iron tip 2 Through Hole Type (THD) Wave soldering with molten solder in a 260°C soldering bath
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Untitled
Abstract: No abstract text available
Text: General Information For Infrared Series SOLDERING 1. Soldering Bath _5 260 + 2. Soldering Iron _5 Under 30W within 3 seconds. Tip temperature: 300 + within 5 seconds.(Dip depth should under 1/16 inch below seating plane ) 3. The neutrality flux be used before soldering
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10min
10cycles
MIL-STD-202
MIL-STD-750
MIL-STD-883
IR-01
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furnace
Abstract: 80126
Text: VISHAY Vishay Semiconductors SMD Assembly Instructions Assembly Instructions Manual Soldering • Use the 6/4 solder or the solder containing silver. • Use a soldering iron of 25 W or smaller. Adjust the temperature of the soldering iron below 300 °C. • Finish soldering within three seconds.
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furnace
80126
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Untitled
Abstract: No abstract text available
Text: Soldering Profile à Soldering Typocal Performance Characteristics • Profile Reflow Soldering Pre-heating Soldering Cooling 230 5 250 200 150 100 60 sec. min 10 sec. max 60 sec. min Flow Soldering Pre-heating Soldering Cooling 230 5 250 200 150 100 60 sec. min
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JIS C7021
Abstract: JIS-C-7021 JIS C7021 B-10 JIS C 7021B-10 C7021A
Text: • Soldering Instructions Iron soldering with 1.5mm iron tip Dip and flow soldering Types Temperature of the soldering bath Maximum soldering time Distance from solder joint to case Temperature of soldering iron Maximum soldering time Distance from solder joint
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10OOhrs
1000hrs
p7021
C7021
C--25
30min-
30min
C7021
JIS C7021
JIS-C-7021
JIS C7021 B-10
JIS C 7021B-10
C7021A
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CE071
Abstract: No abstract text available
Text: MICROWAVE ISOLATOR-SURFACE MOUNT CE071/CE07A Series SOLDERING 1. Reflow Soldering 2. Soldering with soldering iron Soldering must be carried out without exceeding the approved soldering tem perature and time shown within the shaded area in Fig. 1. When soldering is repeated, the
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CE071/CE07A
CE071
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CE07A
Abstract: No abstract text available
Text: CUSTOM PRODUCTS ib i MICROWAVE ISOLATOR & CIRCULATOR-SURFACE MOUNT CE07A/CE071/CE072 Series SOLDERING 1. Reflow Soldering 2. Soldering with soldering iron Soldering must be carried out w ithout exceeding the approved soldering tem perature and time shown within the
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CE07A/CE071/CE072
CE071/CE07A
CE07A
CE07A
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Untitled
Abstract: No abstract text available
Text: Kingbright APPLICATION NOTES Soldering 6. Lamp Wave Soldering Profile. Wave Soldering Pay Attention 1. We recommend manual solder operations only for repair. If a soldering iron is used, the maximum power consumption should be limited to 30W and soldering temperature
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Untitled
Abstract: No abstract text available
Text: Fujrrsu Recommended Soldering Process Recommended Soldering Process: Soldering by hand: 350+/-10 degrees at the tip of the soldering iron for 3 seconds. Soldering dip: 260+/-5 degrees for 10+/-1 seconds. SMT mounting: Many mays can be used for SMT reflow. The most common is Vapor phase or infrared
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500grams.
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Untitled
Abstract: No abstract text available
Text: Philips Components Soldering SOLDERING PLASTIC MINI PACKS By hand-held soldering iron or pulse-heated solder tool Fix the component by first soldering two, diagonally opposite, end leads. Apply the heating tool to the flat part of the lead only. Contact time must
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Untitled
Abstract: No abstract text available
Text: •HANDLING PRECAUTIONS Types Lamps/flat packages Soldering iron Temperature at tip of iron: 300 C max. 300 W max. Soldering time: 3 sec. max. Location: At least 3 mm away from resin body Dip soldering Reflow soldering Pre-heating: 100 C max. (Resin surface
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Untitled
Abstract: No abstract text available
Text: RECOMMENDED PATTERN Pattern Dimensions Unit: mm LL1005-FH and PTL1005-F Series • LL1608-FH/FS and PTL1608-F Series LL2012-FH and PTL2012-F Series R o w Soldering R eflow Soldering R o w Soldering R eflow Soldering Flow Soldering R eflow Soldering & 0 .3 - 0.5
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LL1005-FH
PTL1005-F
LL1608-FH/FS
PTL1608-F
LL2012-FH
PTL2012-F
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Untitled
Abstract: No abstract text available
Text: SURFACE MOUNT INDUCTORS SOLDERING SOLDERING METHOD 2. Soldering Conditions Chip coils can be flow or reflow soldered. LQS33N and LQP21A/31A should be reflow soldered only. Please contact Murata Electronics regarding other soldering methods. RECOMMENDED SOLDERING CONDITIONS
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LQS33N
LQP21A/31A
LQS33
LQP11A
LQP21A
LQP31A
LQN21A
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