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    SOLDERING GUIDELINES PIN IN PASTE STANDOFF Search Results

    SOLDERING GUIDELINES PIN IN PASTE STANDOFF Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    CN-AC3MMDZBAU Amphenol Cables on Demand 3-Pin XLR Male Panel Mount Connector - Amphenol AC3MMDZB-AU - Solder Type (Black + Gold Contacts) Datasheet
    CN-DSUB50PIN0-000 Amphenol Cables on Demand Amphenol CN-DSUB50PIN0-000 D-Subminiature (DB50 Male D-Sub) Connector, 50-Position Pin Contacts, Solder-Cup Terminals Datasheet
    CN-DSUBHD62PN-000 Amphenol Cables on Demand Amphenol CN-DSUBHD62PN-000 High-Density D-Subminiature (HD62 Male D-Sub) Connector, 62-Position Pin Contacts, Solder-Cup Terminals Datasheet
    CN-DSUB15PIN0-000 Amphenol Cables on Demand Amphenol CN-DSUB15PIN0-000 D-Subminiature (DB15 Male D-Sub) Connector, 15-Position Pin Contacts, Solder-Cup Terminals Datasheet
    CN-DSUBHD15PN-000 Amphenol Cables on Demand Amphenol CN-DSUBHD15PN-000 High-Density D-Subminiature (HD15 Male D-Sub) Connector, 15-Position Pin Contacts, Solder-Cup Terminals Datasheet

    SOLDERING GUIDELINES PIN IN PASTE STANDOFF Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    SOD80 footprint

    Abstract: SOD87 footprint Soldering guidelines and SMD footprint design SMD footprint design SOD106 land pattern land pattern sot346 SOD110 footprint SOD87 footprint pcb MLC745 smd footprint
    Text: DISCRETE SEMICONDUCTORS DATA SHEET Chapter 4 Soldering guidelines and SMD footprint design Discrete Semiconductor Packages File under Discrete Semiconductors, SC18 July 1997 Philips Semiconductors Discrete Semiconductor Packages Soldering guidelines and SMD


    Original     		PDF MGK391 MSC422 OT457 SC-74) MSC423 SOD80 footprint SOD87 footprint Soldering guidelines and SMD footprint design SMD footprint design SOD106 land pattern land pattern sot346 SOD110 footprint SOD87 footprint pcb MLC745 smd footprint

    SOD87 footprint

    Abstract: Soldering guidelines and SMD footprint design sot3391h SOT-34 MSA460 MSA439 SOT343R footprint
    Text: SC18_1999_.book : SC18_CHAPTER_4_1999 1 Wed May 12 11:40:55 1999 CHAPTER 4 SOLDERING GUIDELINES AND SMD FOOTPRINT DESIGN page Introduction 4-2 Axial and radial leaded devices 4-2 Surface-mount devices 4-3 Recommended footprints 4 - 14 SC18_1999_.book : SC18_CHAPTER_4_1999


    Original     		PDF MSD060 OT428. MSC422 OT457 SC-74) MSC423 SOD87 footprint Soldering guidelines and SMD footprint design sot3391h SOT-34 MSA460 MSA439 SOT343R footprint

    CMA3000

    Abstract: CMA3000-D0X vti cma3000 J-STD-020D accelerometer SENSORS
    Text: CMA3000 Assembly Instructions CMA3000 Series 3-axis accelerometer CMA3000 Assembly Instructions TABLE OF CONTENTS 1 Objective . 3


    Original     		PDF CMA3000 CMA3000-D0X vti cma3000 J-STD-020D accelerometer SENSORS

    Soldering guidelines pin in paste

    Abstract: TA-893 connectors Shrouded Header, 8 Pin, 2mm fci minitek idc shrouded header pin in paste BUS-12-055 LR46923 right angle 14 pin pcb connector 2mm pitch
    Text: COMMUNICATIONS, DATA, CONSUMER DIVISION TM QUICKIE Cable-to-board Connectors for Pin-in-Paste Processes Quickie Cable-to-board Connectors for Pin-in-Paste Processes Description Quickie™ is FCI’s brand for cable-to-board connectors in 2.54mm pitch. The Quickie™ product range


    Original     		PDF 2002/95/IEC E66906 LR46923 BUS-12-055 TA-893 TA-894 TA-842 Soldering guidelines pin in paste TA-893 connectors Shrouded Header, 8 Pin, 2mm fci minitek idc shrouded header pin in paste BUS-12-055 LR46923 right angle 14 pin pcb connector 2mm pitch

    CMA3000

    Abstract: CMA3000-D0X rev 0.4 pin in paste CMA3000-D0X J-STD-020D vti cma3000 asic chips
    Text: CMA3000 Assembly Instructions CMA3000 Series 3-axis accelerometer CMA3000 Assembly Instructions TABLE OF CONTENTS 1 Objective . 3


    Original     		PDF CMA3000 CMA3000-D0X rev 0.4 pin in paste CMA3000-D0X J-STD-020D vti cma3000 asic chips

    Soldering guidelines and SMD footprint design

    Abstract: SOD87 footprint SMD footprint design Soldering guidelines SOD106 land pattern sod110 land sot89 stencil SC59 SOD110 footprint "msb900"
    Text: CHAPTER 4 SOLDERING GUIDELINES AND SMD FOOTPRINT DESIGN page Introduction 4-2 Axial and radial leaded devices 4-2 Surface-mount devices 4-3 Recommended footprints 4 - 14 Philips Semiconductors Discrete Semiconductor Packages Soldering guidelines and SMD footprint design


    Original     		PDF OD106, OT223. MSB958 Soldering guidelines and SMD footprint design SOD87 footprint SMD footprint design Soldering guidelines SOD106 land pattern sod110 land sot89 stencil SC59 SOD110 footprint "msb900"

    Soldering guidelines pin in paste

    Abstract: TA-895 idc shrouded header minitek pin in paste LR46923 right angle 5 pin pcb connector
    Text: Products for solder-to-board applications MINITEK Headers for Pin-in-Paste Processes MINITEK™ Pin-in-Paste DESCRIPTION Minitek is FCI’s brand for board-to-board and wire/cable-to-board connectors in 2.00 mm pitch. The Minitek product range includes PCB Card Connectors,


    Original     		PDF CDC-MINIPIP-02/07-E Soldering guidelines pin in paste TA-895 idc shrouded header minitek pin in paste LR46923 right angle 5 pin pcb connector

    Soldering guidelines pin in paste

    Abstract: bergstik LR46923 connectors basics of electrical connector pin in paste FCI Bergcon reflow FCI BERG TA-894
    Text: ELECTRONICS BERGSTIK Unshrouded Headers for Pin-in-Paste Processes BERGSTIKTM UNSHROUDED HEADERS FOR PIN-IN-PASTE PROCESSES DESCRIPTION BergStik™ is FCI’s brand for pin headers in 2.54 mm 0.100” pitch. The BergStik product range includes straight, right angle,


    Original     		PDF E66906 LR46923 BUS-12-019 Soldering guidelines pin in paste bergstik LR46923 connectors basics of electrical connector pin in paste FCI Bergcon reflow FCI BERG TA-894

    sofix connector

    Abstract: FCI Connector Soldering guidelines pin in paste connectors GS-14-920 pin in paste Sofix HM1K51DFP000H6PLF packaging specification GS-12-307
    Text: ELECTRONICS METRAL Board connectors for Pin-in-Paste processes www.fci.com/metral 1 FCI: SETTING THE STANDARD FOR CONNECTORS With operations in 30 countries,FCI is a leading manufacturer of connectors. Our 13,500 employees are commited to providing customers with high-quality,


    Original     		PDF 72860-103LF 72850-101LF GS-12-307 GS-14-920 ELXMETRAPIP1207EA4 sofix connector FCI Connector Soldering guidelines pin in paste connectors GS-14-920 pin in paste Sofix HM1K51DFP000H6PLF packaging specification GS-12-307

    QFN-48 LAND PATTERN

    Abstract: QFN PACKAGE thermal resistance QFN-48 footprint qfn 48 7x7 footprint ipc-SM-782 thermal analysis on pcb SMD transistor Mo FOOTPRINT PCB qfn 48 7x7 stencil AN5060
    Text: Optimum PCB and Stencil Layout for WirelessUSB QFN Package Introduction When designing a system board using the WirelessUSB™ LS/LR QFN chip for wireless product applications, there are several important factors to consider. It is advised to pay critical attention to PCB design and assembly aspects when


    Original     		PDF

    slua271a

    Abstract: SON PCB Attachment IPC-7525 qfn Substrate design guidelines ipc 7525 DUAL ROW QFN leadframe Service Manual smd rework station IPC7525 IPC7711 JESD51-7
    Text: Application Report SLUA271A – June 2002 – Revised September 2007 QFN/SON PCB Attachment Steve Kummerl, Bernhard Lange, Dominic Nguyen . ABSTRACT Quad flatpack no leads QFNs and small-outline no leads (SONs) are leadless


    Original     		PDF SLUA271A slua271a SON PCB Attachment IPC-7525 qfn Substrate design guidelines ipc 7525 DUAL ROW QFN leadframe Service Manual smd rework station IPC7525 IPC7711 JESD51-7

    qfn 32 land pattern

    Abstract: hermetic packages PCB land IPC 1725 SOD-323 land pattern SOIC 8 pcb pattern land pattern for SSOP land pattern for TSSOP 24 pin 16 soic pcb footprint QFN-20 reflow IPC-SM-782
    Text: APPLICATION NOTE Suggested PCB Land Pattern Designs for Leaded and Leadless Packages and Detailed Surface Mount Guidelines for Leadless Packages Below are sample printed circuit board land pattern dimensions. These are based on the IPC Institute for Interconnecting and


    Original     		PDF IPC-SM-782. OD-323 qfn 32 land pattern hermetic packages PCB land IPC 1725 SOD-323 land pattern SOIC 8 pcb pattern land pattern for SSOP land pattern for TSSOP 24 pin 16 soic pcb footprint QFN-20 reflow IPC-SM-782

    qfp 32 land pattern

    Abstract: SSOP16 SSOP24
    Text: Philips Semiconductors PowerMOS transistors Mounting and soldering MOUNTING AND SOLDERING Page INTRODUCTION LEADED DEVICES Handling Soldering GENERAL DATA AND INSTRUCTIONS FOR THE SOT186A; SOT263; TO 220AB General rules Mounting methods Heatsink requirements


    Original     		PDF OT186A; OT263; 220AB components24 MLC747 SSOP16 OT338-1) SSOP24 OT340-1) qfp 32 land pattern SSOP16 SSOP24

    ssop24 footprint

    Abstract: PowerMos transistors TO220 package SSOP16 SSOP24 SSOP24 300 1 footprint sot89 stencil
    Text: DISCRETE SEMICONDUCTORS Mounting and soldering PowerMOS transistors 1998 Dec 02 Philips Semiconductors PowerMOS transistors Mounting and soldering MOUNTING AND SOLDERING Page INTRODUCTION LEADED DEVICES Handling Soldering GENERAL DATA AND INSTRUCTIONS FOR THE


    Original     		PDF OT186A; OT263; 220AB MLC747 SSOP16 OT338-1) SSOP24 OT340-1) OT338-1 ssop24 footprint PowerMos transistors TO220 package SSOP16 SSOP24 SSOP24 300 1 footprint sot89 stencil

    FOOTPRINT MO-229 2X3 SOLDERING

    Abstract: Theta-JC QFP die down QFN 56 7x7 footprint EIA-783 EIA and EIAJ standards 783 QFN 76 9x9 footprint AN1902 QFN 56 7x7 0.5 JESD51-7 MO-220
    Text: Freescale Semiconductor Application Note AN1902 Rev. 4.0, 9/2008 Quad Flat Pack No-Lead QFN Micro Dual Flat Pack No-Lead (uDFN) 1.0 Purpose This document provides guidelines for Printed Circuit Board (PCB) design and assembly. Package performance such as: MSL rating, board level


    Original     		PDF AN1902 FOOTPRINT MO-229 2X3 SOLDERING Theta-JC QFP die down QFN 56 7x7 footprint EIA-783 EIA and EIAJ standards 783 QFN 76 9x9 footprint AN1902 QFN 56 7x7 0.5 JESD51-7 MO-220

    SOD80 footprint

    Abstract: SOD87 footprint land pattern sot346 SOD110 footprint SOD106 land pattern sod110 land do-41 footprint MSA435 DO-35 land pattern how epoxy can contribute to meniscus
    Text: SECTION 17 MOUNTING AND SOLDERING contents page INTRODUCTION 17 - 2 AXIAL AND RADIAL LEADED DEVICES 17 - 2 Handling 17 - 2 Soldering 17 - 2 Mounting 17 - 3 SURFACE-MOUNT DEVICES 17 - 3 Reflow soldering process 17 - 3 Double-wave soldering process 17 - 7 Hand soldering of microminiature components


    Original     		PDF MSB461 OT163-1) MLC745 SOD80 footprint SOD87 footprint land pattern sot346 SOD110 footprint SOD106 land pattern sod110 land do-41 footprint MSA435 DO-35 land pattern how epoxy can contribute to meniscus

    J-STD-005

    Abstract: IPC-SM-782 MO-220
    Text: August 2001 Application Note 7525 PCB Land Pattern Design and Surface Mount Guidelines for MicroFET Packages Scott Pearson Fairchild Semiconductor , Jim Benson (Intersil Corporation) Introduction Fairchild’s MicroFET™ package is a relatively new packaging concept that is currently experiencing rapid acceptance. It offers a variety of benefits including reduced lead inductance, a small sized "near chip scale" footprint,


    Original     		PDF

    QFN 76 9x9 footprint

    Abstract: QFN 64 8x8 footprint QFN PACKAGE thermal resistance JEDEC JESD51-8 BGA 4914 smd qfn 32 land pattern QFN 64 9x9 footprint QFN 9X9 AN1902 MO-220
    Text: Freescale Semiconductor Application Note AN1902 Rev. 3.0, 12/2005 Quad Flat Pack No-Lead QFN 1.0 Purpose This document provides guidelines for Printed Circuit Board (PCB) design and assembly. Package performance such as: MSL rating, board level reliability, electrical parasitic and thermal resistance


    Original     		PDF AN1902 QFN 76 9x9 footprint QFN 64 8x8 footprint QFN PACKAGE thermal resistance JEDEC JESD51-8 BGA 4914 smd qfn 32 land pattern QFN 64 9x9 footprint QFN 9X9 AN1902 MO-220

    tssop 16 exposed pad stencil

    Abstract: C1316C SOIC 8 pcb pattern qfn 88 stencil SOIC 16 narrow body exposed pad pcb pattern 1316C land pattern for TSsOP 16 land pattern for TSSOP 24 pin jedec package MO-220 QFN-32 SOIC 8 narrow body pcb pattern
    Text: APPLICATION NOTE Suggested PCB Land Pattern Designs for Leaded and Leadless Packages and Detailed Surface Mount Guidelines for Leadless Packages Below are sample printed circuit board land pattern dimensions. These are based on the IPC Institute for Interconnecting and


    Original     		PDF IPC-SM-782. OD-323 tssop 16 exposed pad stencil C1316C SOIC 8 pcb pattern qfn 88 stencil SOIC 16 narrow body exposed pad pcb pattern 1316C land pattern for TSsOP 16 land pattern for TSSOP 24 pin jedec package MO-220 QFN-32 SOIC 8 narrow body pcb pattern

    GR-1217-CORE

    Abstract: Y627ZD GR1217-CORE FR-2063 IPC-D-300 C17200 03EDJ8 Kit-20176
    Text: 15. Surface Mount Socketing System SurfMate Design Guide & Applications Manual For Maxi, Mini, Micro Family DC-DC Converters and Configurable Power Supplies SurfMate is a surface-mount connector system for use with pin-compatible Maxi, Mini, Micro Family converters


    Original     		PDF Kit-20178 Kit-20179 Kit-20176 Kit-20177 Bag-20188 Bag-20189 Bag-20186 Bag-20187 GR-1217-CORE Y627ZD GR1217-CORE FR-2063 IPC-D-300 C17200 03EDJ8 Kit-20176

    Untitled

    Abstract: No abstract text available
    Text: 15. Surface Mount Socketing System SurfMate Design Guide & Applications Manual For Maxi, Mini, Micro Family DC-DC Converters and Configurable Power Supplies SurfMate is a surface-mount connector system for use with pin-compatible Maxi, Mini, Micro Family converters


    Original     		PDF Kit-20178 Kit-20179 Kit-20176 Kit-20177 Bag-20188 Bag-20189 Bag-20186 Bag-20187

    JEDEC J-STD-033b.1

    Abstract: TB487 INTERSIL TRACEABILITY LOT PART MARKING
    Text: Technical Brief 487 Author: Lynn Wiese Surface Mount Assembly Guidelines for Optical Co-Package Sensor and LED Introduction Optical co-packages are developed for light sensor and proximity applications; they have an LED as well as a silicon chip in each device. The co-package mechanical structure is


    Original     		PDF TB487 JEDEC J-STD-033b.1 INTERSIL TRACEABILITY LOT PART MARKING

    Untitled

    Abstract: No abstract text available
    Text: 17. Surface Mount Socketing System SurfMate Design Guide & Applications Manual For Maxi, Mini, Micro Family DC-DC Converters and Configurable Power Supplies SurfMate is a surface-mount connector system for use with pin-compatible Maxi, Mini, Micro Family converters


    Original     		PDF Kit-20178 Kit-20179 Kit-20176 Kit-20177 Bag-20188 Bag-20189 Bag-20186 Bag-20187

    sot89 stencil

    Abstract: No abstract text available
    Text: Philips Semiconductors PowerMOS transistors Mounting and soldering MOUNTING AND SOLDERING Page INTRODUCTION 1898 LEADED DEVICES Handling Soldering 1898 GENERAL DATA AND INSTRUCTIONS FOR THE SOT186A; SOT263; TO 220AB General rules Mounting methods Heatsink requirements


    OCR Scan     		PDF OT186A; OT263; 220AB T0220 SSOP16 SSOP24 OT338-1 OT34Q-1 sot89 stencil