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    SOLDERING GUIDELINES PIN IN PASTE Search Results

    SOLDERING GUIDELINES PIN IN PASTE Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    CN-AC3MMDZBAU Amphenol Cables on Demand 3-Pin XLR Male Panel Mount Connector - Amphenol AC3MMDZB-AU - Solder Type (Black + Gold Contacts) Datasheet
    CN-DSUB50PIN0-000 Amphenol Cables on Demand Amphenol CN-DSUB50PIN0-000 D-Subminiature (DB50 Male D-Sub) Connector, 50-Position Pin Contacts, Solder-Cup Terminals Datasheet
    CN-DSUBHD62PN-000 Amphenol Cables on Demand Amphenol CN-DSUBHD62PN-000 High-Density D-Subminiature (HD62 Male D-Sub) Connector, 62-Position Pin Contacts, Solder-Cup Terminals Datasheet
    CN-DSUB15PIN0-000 Amphenol Cables on Demand Amphenol CN-DSUB15PIN0-000 D-Subminiature (DB15 Male D-Sub) Connector, 15-Position Pin Contacts, Solder-Cup Terminals Datasheet
    CN-DSUBHD15PN-000 Amphenol Cables on Demand Amphenol CN-DSUBHD15PN-000 High-Density D-Subminiature (HD15 Male D-Sub) Connector, 15-Position Pin Contacts, Solder-Cup Terminals Datasheet

    SOLDERING GUIDELINES PIN IN PASTE Datasheets Context Search

    Catalog Datasheet MFG & Type Document Tags PDF

    Soldering guidelines pin in paste

    Abstract: TA-893 connectors Shrouded Header, 8 Pin, 2mm fci minitek idc shrouded header pin in paste BUS-12-055 LR46923 right angle 14 pin pcb connector 2mm pitch
    Text: COMMUNICATIONS, DATA, CONSUMER DIVISION TM QUICKIE Cable-to-board Connectors for Pin-in-Paste Processes Quickie Cable-to-board Connectors for Pin-in-Paste Processes Description Quickie™ is FCI’s brand for cable-to-board connectors in 2.54mm pitch. The Quickie™ product range


    Original     		2002/95/IEC E66906 LR46923 BUS-12-055 TA-893 TA-894 TA-842 Soldering guidelines pin in paste TA-893 connectors Shrouded Header, 8 Pin, 2mm fci minitek idc shrouded header pin in paste BUS-12-055 LR46923 right angle 14 pin pcb connector 2mm pitch PDF

    Soldering guidelines pin in paste

    Abstract: TA-895 idc shrouded header minitek pin in paste LR46923 right angle 5 pin pcb connector
    Text: Products for solder-to-board applications MINITEK Headers for Pin-in-Paste Processes MINITEK™ Pin-in-Paste DESCRIPTION Minitek is FCI’s brand for board-to-board and wire/cable-to-board connectors in 2.00 mm pitch. The Minitek product range includes PCB Card Connectors,


    Original     		CDC-MINIPIP-02/07-E Soldering guidelines pin in paste TA-895 idc shrouded header minitek pin in paste LR46923 right angle 5 pin pcb connector PDF

    Soldering guidelines pin in paste

    Abstract: bergstik LR46923 connectors basics of electrical connector pin in paste FCI Bergcon reflow FCI BERG TA-894
    Text: ELECTRONICS BERGSTIK Unshrouded Headers for Pin-in-Paste Processes BERGSTIKTM UNSHROUDED HEADERS FOR PIN-IN-PASTE PROCESSES DESCRIPTION BergStik™ is FCI’s brand for pin headers in 2.54 mm 0.100” pitch. The BergStik product range includes straight, right angle,


    Original     		E66906 LR46923 BUS-12-019 Soldering guidelines pin in paste bergstik LR46923 connectors basics of electrical connector pin in paste FCI Bergcon reflow FCI BERG TA-894 PDF

    sofix connector

    Abstract: FCI Connector Soldering guidelines pin in paste connectors GS-14-920 pin in paste Sofix HM1K51DFP000H6PLF packaging specification GS-12-307
    Text: ELECTRONICS METRAL Board connectors for Pin-in-Paste processes www.fci.com/metral 1 FCI: SETTING THE STANDARD FOR CONNECTORS With operations in 30 countries,FCI is a leading manufacturer of connectors. Our 13,500 employees are commited to providing customers with high-quality,


    Original     		72860-103LF 72850-101LF GS-12-307 GS-14-920 ELXMETRAPIP1207EA4 sofix connector FCI Connector Soldering guidelines pin in paste connectors GS-14-920 pin in paste Sofix HM1K51DFP000H6PLF packaging specification GS-12-307 PDF

    IPC-SM-780

    Abstract: No abstract text available
    Text: Reflow Soldering Guidelines January 1998, ver. 2 Introduction for Surface-Mount Devices Application Note 81 Altera’s surface-mount products include quad flat pack QFP , ceramic and plastic J-lead chip carriers (JLCC and PLCC, respectively), ball-grid


    Original     		ANSI/IPC-SM-786) IPC-TM-650) JESD22-A112) IPC-SM-780 PDF

    screen emulsion

    Abstract: P8002355 P8002392 63Sn37Pb
    Text: Application Note Soldering Guidelines for Module PCB Mounting Rev 14 OBJECTIVE The objective of this application note is to provide ANADIGICS’ customers general guidelines for PCB second level interconnect design when assembling with ANADIGICS’ module products.


    Original     		PDF

    IPC-SM-786A

    Abstract: BGA and QFP Altera Package mounting profile JESD22-A113 J-STD-020A GUIDELINES FOR HANDLING MOISTURE SENSITIVE DEVICE IPC-SM-780 altera board
    Text: Reflow Soldering Guidelines January 1999, ver. 3 Introduction for Surface-Mount Devices Application Note 81 Altera’s surface-mount products include quad flat pack QFP , ceramic and plastic J-lead chip carriers (JLCC and PLCC, respectively), ball-grid


    Original     		PDF

    Cymbet EnerChip User Guide

    Abstract: Application Notes application-notes
    Text: Cymbet EnerChip Smart Solid State Batteries Product Overview and User Guide AN-72-1026 Version 9.0 AN-72-1026 v9.0 Copyright 2008-2012 Cymbet Corporation. All rights reserved. Cymbet Corporation 18326 Joplin St. NW Elk River, MN 55330 Phone 763-633-1780


    Original     		AN-72-1026 AN-72-1026 EVAL-05 Cymbet EnerChip User Guide Application Notes application-notes PDF

    IPC-7711

    Abstract: JEDEC J-STD-033b IPC 7721 J-STD-033b.1 JEDEC J-STD-033b.1 paste profile IPC7711 IPC-7721 thermal pcb guidelines to48c
    Text: Application Note Soldering Guidelines for Module PCB Mounting Rev 15 OBJECTIVE The objective of this application note is to provide ANADIGICS’ customers’ general guidelines for PCB second level interconnect design when assembling with ANADIGICS’ module products.


    Original     		PDF

    BGA and QFP Altera Package mounting profile

    Abstract: BGA PROFILING JEP113-B infrared heating gun guidelines JEP113 Reliability Data Plastic Packages QFP J-STD-020A J-STD-033 GUIDELINES FOR HANDLING MOISTURE SENSITIVE DEVICE
    Text: Reflow Soldering Guidelines for Surface-Mount Devices June 2002, ver. 4 Application Note 81 7 Introduction Altera’s surface-mount packages include quad flat pack QFP , plastic J-lead chip carriers (PLCC), and ball-grid array (BGA), including FineLine


    Original     		PDF

    MMA7660

    Abstract: SURFACE MOUNT CAPACITORS footprint land pattern AN3839 MMA7660FC accelerometer sensor land pattern for DFN
    Text: Freescale Semiconductor Application Note AN3839 Rev 2, 9/2009 MMA7660FC Board Mounting Guidelines by: Laura Salhuana ACRONYMS PCB: Printed Circuit Board DFN: Dual Flat No-Lead Cl: Chlorine Br: Bromine RoHS: Restrictions on Hazardous Substances Sn: tin Pb: lead


    Original     		AN3839 MMA7660FC MMA7660 SURFACE MOUNT CAPACITORS footprint land pattern AN3839 accelerometer sensor land pattern for DFN PDF

    SOD80 footprint

    Abstract: SOD87 footprint Soldering guidelines and SMD footprint design SMD footprint design SOD106 land pattern land pattern sot346 SOD110 footprint SOD87 footprint pcb MLC745 smd footprint
    Text: DISCRETE SEMICONDUCTORS DATA SHEET Chapter 4 Soldering guidelines and SMD footprint design Discrete Semiconductor Packages File under Discrete Semiconductors, SC18 July 1997 Philips Semiconductors Discrete Semiconductor Packages Soldering guidelines and SMD


    Original     		MGK391 MSC422 OT457 SC-74) MSC423 SOD80 footprint SOD87 footprint Soldering guidelines and SMD footprint design SMD footprint design SOD106 land pattern land pattern sot346 SOD110 footprint SOD87 footprint pcb MLC745 smd footprint PDF

    TN0019

    Abstract: thermal pcb guidelines 7x7x1 JESD97 QFPN-28 QFPN 28 footprint
    Text: TN0019 Technical note Linear accelerometers in QFPN package surface mounting guidelines Abstract This document is a general guidelines about soldering accelerometer products packaged in Quad Flat Package No lead surface mount. November 2006 Rev 1 1/11 www.st.com


    Original     		TN0019 TN0019 thermal pcb guidelines 7x7x1 JESD97 QFPN-28 QFPN 28 footprint PDF

    SOD87 footprint

    Abstract: Soldering guidelines and SMD footprint design sot3391h SOT-34 MSA460 MSA439 SOT343R footprint
    Text: SC18_1999_.book : SC18_CHAPTER_4_1999 1 Wed May 12 11:40:55 1999 CHAPTER 4 SOLDERING GUIDELINES AND SMD FOOTPRINT DESIGN page Introduction 4-2 Axial and radial leaded devices 4-2 Surface-mount devices 4-3 Recommended footprints 4 - 14 SC18_1999_.book : SC18_CHAPTER_4_1999


    Original     		MSD060 OT428. MSC422 OT457 SC-74) MSC423 SOD87 footprint Soldering guidelines and SMD footprint design sot3391h SOT-34 MSA460 MSA439 SOT343R footprint PDF

    QFPN-28

    Abstract: qfn 44 PACKAGE footprint QFPN 28 footprint 4x4x1 QFPN-24 TN0019 7x7x1 MEMS ic 7551-1 qfn 28 land pattern
    Text: TN0019 Technical note MEMS in QFPN package surface mounting guidelines Introduction This document is a general guideline about soldering MEMS products packaged in Quad Flat Package No lead surface mount. April 2010 Doc ID 12708 Rev 2 1/14 www.st.com Contents


    Original     		TN0019 QFPN-28 qfn 44 PACKAGE footprint QFPN 28 footprint 4x4x1 QFPN-24 TN0019 7x7x1 MEMS ic 7551-1 qfn 28 land pattern PDF

    KR-19SHrma

    Abstract: ST25E-PS90 TN82 DIL32 DIL-32 J-STD-033 Soldering guidelines pin in paste mems ultrasonic sensors Sn60Pb40 solder
    Text: Technical Note 82 Assembly Instructions for SCC1XX0 series TABLE OF CONTENTS Table of Contents .1 1 Objective .2


    Original     		32-lead DIL-32) DIL-32 J-STD-020C) J-STD-033) KR-19SHrma ST25E-PS90 TN82 DIL32 J-STD-033 Soldering guidelines pin in paste mems ultrasonic sensors Sn60Pb40 solder PDF

    KR-19SHrma

    Abstract: ST25E-PS90 almit DIL 330 J-STD-033 TN71 mems ultrasonic sensors leadframe dil Soldering guidelines pin in paste J-STD-033 PCB
    Text: Technical Note 71 Assembly Instructions for SCA6x0 and SCA10x0 series TABLE OF CONTENTS Table of Contents .1 1 Objective .2


    Original     		SCA10x0 DIL-12 J-STD-020C) J-STD-033) KR-19SHrma ST25E-PS90 almit DIL 330 J-STD-033 TN71 mems ultrasonic sensors leadframe dil Soldering guidelines pin in paste J-STD-033 PCB PDF

    Soldering guidelines and SMD footprint design

    Abstract: SOD87 footprint SMD footprint design Soldering guidelines SOD106 land pattern sod110 land sot89 stencil SC59 SOD110 footprint "msb900"
    Text: CHAPTER 4 SOLDERING GUIDELINES AND SMD FOOTPRINT DESIGN page Introduction 4-2 Axial and radial leaded devices 4-2 Surface-mount devices 4-3 Recommended footprints 4 - 14 Philips Semiconductors Discrete Semiconductor Packages Soldering guidelines and SMD footprint design


    Original     		OD106, OT223. MSB958 Soldering guidelines and SMD footprint design SOD87 footprint SMD footprint design Soldering guidelines SOD106 land pattern sod110 land sot89 stencil SC59 SOD110 footprint "msb900" PDF

    CMA3000

    Abstract: CMA3000-D0X vti cma3000 J-STD-020D accelerometer SENSORS
    Text: CMA3000 Assembly Instructions CMA3000 Series 3-axis accelerometer CMA3000 Assembly Instructions TABLE OF CONTENTS 1 Objective . 3


    Original     		CMA3000 CMA3000-D0X vti cma3000 J-STD-020D accelerometer SENSORS PDF

    CMA3000

    Abstract: CMA3000-D0X rev 0.4 pin in paste CMA3000-D0X J-STD-020D vti cma3000 asic chips
    Text: CMA3000 Assembly Instructions CMA3000 Series 3-axis accelerometer CMA3000 Assembly Instructions TABLE OF CONTENTS 1 Objective . 3


    Original     		CMA3000 CMA3000-D0X rev 0.4 pin in paste CMA3000-D0X J-STD-020D vti cma3000 asic chips PDF

    qfn 32 land pattern

    Abstract: hermetic packages PCB land IPC 1725 SOD-323 land pattern SOIC 8 pcb pattern land pattern for SSOP land pattern for TSSOP 24 pin 16 soic pcb footprint QFN-20 reflow IPC-SM-782
    Text: APPLICATION NOTE Suggested PCB Land Pattern Designs for Leaded and Leadless Packages and Detailed Surface Mount Guidelines for Leadless Packages Below are sample printed circuit board land pattern dimensions. These are based on the IPC Institute for Interconnecting and


    Original     		IPC-SM-782. OD-323 qfn 32 land pattern hermetic packages PCB land IPC 1725 SOD-323 land pattern SOIC 8 pcb pattern land pattern for SSOP land pattern for TSSOP 24 pin 16 soic pcb footprint QFN-20 reflow IPC-SM-782 PDF

    SOD-323 land pattern

    Abstract: SOIC 8 pcb pattern land pattern for SSOP tssop 16 exposed pad stencil land pattern for TSsOP 16 LPCC-16 16 soic pcb footprint land pattern for TSSOP qfn 32 land pattern qfn 28 land pattern
    Text: Application Note Suggested PCB Land Pattern Designs for Leaded and Leadless Packages and Detailed Surface Mount Guidelines for Leadless Packages Below are sample printed circuit board land pattern dimensions. These are based on the IPC Institute for Interconnecting and


    Original     		IPC-SM-782. SoD-323 SOD-323 land pattern SOIC 8 pcb pattern land pattern for SSOP tssop 16 exposed pad stencil land pattern for TSsOP 16 LPCC-16 16 soic pcb footprint land pattern for TSSOP qfn 32 land pattern qfn 28 land pattern PDF

    sot89 stencil

    Abstract: sot89 land pattern Loctite 218 RG200 substrate 5989-0810EN LOCTITE-96sc Getek LOCTITE 384 RG200 laser gun
    Text: SOT89 Package Application Note 5051 Introduction PCB Land Pattern and Stencil Design Avago Technologies SOT89 is a 3 I/O pins Figure 1 package platform designed to offer excellent heat dissipation and wide RF frequency response. The SOT89 package itself is lead free with a dimension of 4.1 mm


    Original     		5989-0810EN sot89 stencil sot89 land pattern Loctite 218 RG200 substrate LOCTITE-96sc Getek LOCTITE 384 RG200 laser gun PDF

    IPC-CH-65A

    Abstract: Vacuum HW004A0A1 213B HW004A0A1-S IPC7711 telcordia GR-63-CORE
    Text: Application Note September 2002 Application Guidelines For Surface-Mount Power Modules Using Column Pins With Solder Balls This application note is intended to provide the user with the best information to date regarding the PCB printed-circuit-board mounting and assembly process of TEPS surface-mountable


    Original     		AP02-002EPS IPC-CH-65A Vacuum HW004A0A1 213B HW004A0A1-S IPC7711 telcordia GR-63-CORE PDF