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    SOLDER REFLOW POWER RF Search Results

    SOLDER REFLOW POWER RF Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    TPD4164F Toshiba Electronic Devices & Storage Corporation Intelligent power device / VBB=600V / Iout=2A/ Surface mount type / HSSOP31 Visit Toshiba Electronic Devices & Storage Corporation
    TPD4164K Toshiba Electronic Devices & Storage Corporation Intelligent power device / VBB=600V / Iout=2A/ Through hole type / HDIP30 Visit Toshiba Electronic Devices & Storage Corporation
    TPD4163K Toshiba Electronic Devices & Storage Corporation Intelligent power device / VBB=600V / Iout=1A/ Through hole type / HDIP30 Visit Toshiba Electronic Devices & Storage Corporation
    TPD4163F Toshiba Electronic Devices & Storage Corporation Intelligent power device / VBB=600V / Iout=1A/ Surface mount type / HSSOP31 Visit Toshiba Electronic Devices & Storage Corporation
    TPD4207F Toshiba Electronic Devices & Storage Corporation Intelligent power device 600V (High voltage PWM DC brushless motor driver) Visit Toshiba Electronic Devices & Storage Corporation

    SOLDER REFLOW POWER RF Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    AN1907

    Abstract: MRF9045NR1 RF Power Devices
    Text: Freescale Semiconductor Application Note AN1907 Rev. 1, 6/2006 Solder Reflow Attach Method for High Power RF Devices in Plastic Packages By: Wendi Stemmons, Jerry Mason, Rich Wetz, Tom Woods, Mahesh Shah and David Runton INTRODUCTION This application note describes a process to solder attach


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    PDF AN1907 AN1907 MRF9045NR1 RF Power Devices

    VIMOS RF Power Transistor Mounting

    Abstract: No abstract text available
    Text: RF Power Transistor Mounting VIMOS Product Portfolio I. SM200 Package Surface Mount Substrate ASI Semiconductor recommends using the solder reflow criteria as specified in JEDEC Standard J-STD-020D.1 shown below. VIMOS RF Power Transistor Mounting Profile


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    PDF SM200 J-STD-020D VIMOS RF Power Transistor Mounting

    Untitled

    Abstract: No abstract text available
    Text: Surface Mount High Dynamic Range Mixer 1830 - 2030 MHz, Up Converter Package Style 20 XMFG8-20D3 Key Features • • • IP3 +38 dBm LO Power + 22 dBm Solder Reflow to 240°C Guaranteed Specifications Frequency Range RF OUTPUT 1830-2030 LO INPUT 1710-1777


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    PDF XMFG8-20D3

    Untitled

    Abstract: No abstract text available
    Text: Surface Mount High Dynamic Range Mixer 1930-1990 MHz, Upconverter, High IP3 Package Style 20 XMFF6-20G7 Key Features • • • IP3 +33 dBm LO Power +17dBm Solder Reflow to +240°C Guaranteed Specifications Frequency Range RF output LO input IF input 1930-1990


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    PDF 17dBm XMFF6-20G7

    Untitled

    Abstract: No abstract text available
    Text: Surface Mount High Dynamic Range Mixer 1830 - 2030 MHz, Down Converter Package Style 20 XMFG8-20D2 Key Features • • • IP3 +38 dBm LO Power + 25 dBm Solder Reflow to 240°C Guaranteed Specifications Frequency Range RF INPUT 1830-2030 LO INPUT 1710-1770


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    PDF XMFG8-20D2

    95Sn5Sb

    Abstract: HP 3478A Copper Alloy C151 bts 2140 AN1907 C101 C102 C151 SAC305 ausi die attach
    Text: Freescale Semiconductor Application Note AN1907 Rev. 3, 5/2009 Solder Reflow Attach Method for High Power RF Devices in Over - Molded Plastic Packages By: Keith Nelson, Quan Li, Lu Li, and Mahesh Shah INTRODUCTION TERMINOLOGY DEFINITIONS The purpose of this application note is to provide


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    PDF AN1907 95Sn5Sb HP 3478A Copper Alloy C151 bts 2140 AN1907 C101 C102 C151 SAC305 ausi die attach

    40R2

    Abstract: No abstract text available
    Text: Surface Mount Downconverting Mixer 1227 and 1575 MHz, Low Harmonics Package Style 40 XMFF6-40R2 Key Features • • • • IP3 +36 dBm LO Power +16 dBm Harmonics –65 dBc Solder Reflow to +240 C Guaranteed Specifications Frequency Range RF input LO input


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    PDF XMFF6-40R2 40R2

    20C5

    Abstract: No abstract text available
    Text: Surface Mount High Dynamic Range Mixer 45.75 MHz Package Style 20 XMCC6-20C5 Key Features • • • IP3 +32 dBm LO Power +17 dBm Solder Reflow to +240°C Guaranteed Specifications Frequency Range RF 45.75 MHz LO 47.54 IF 1.79 MHz MHz MHz Conversion Loss dB


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    PDF XMCC6-20C5 20C5

    20B3

    Abstract: 20B3 diode XMGG7-20B3
    Text: Surface Mount High Dynamic Range Mixer 3400-3600 MHz, Upconverter, High IP3 Package Style 20 XMGG7-20B3 Key Features • • • IP3 +34 dBm LO Power +21 dBm Solder Reflow to +240°C Guaranteed Specifications Frequency Range RF output LO input IF input 3400-3600


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    PDF XMGG7-20B3 20B3 20B3 diode XMGG7-20B3

    Untitled

    Abstract: No abstract text available
    Text: Surface Mount High Dynamic Range Mixer 180 - 260 MHz, Up Converter Package Style 20 XMDD8-20D2 Key Features • • • IP3 +38 dBm LO Power + 25 dBm Solder Reflow to 240°C Guaranteed Specifications Frequency Range RF OUTPUT 180-260 LO INPUT 310 IF INPUT


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    PDF XMDD8-20D2

    Untitled

    Abstract: No abstract text available
    Text: Surface Mount High Dynamic Range Mixer 857 MHz, Upconverter, High IP3 Package Style 20 XMEE6-20G7 Key Features • • • IP3 +33 dBm LO Power +17dBm Solder Reflow to +240°C Guaranteed Specifications Frequency Range RF output LO input IF input 857 ± 5 787


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    PDF 17dBm XMEE6-20G7

    rf down converter 30 mhz

    Abstract: No abstract text available
    Text: Surface Mount High Dynamic Range Mixer 180 - 260 MHz, Down Converter Package Style 20 XMDD7-20D4 Key Features • • • IP3 +34 dBm LO Power + 20 dBm Solder Reflow to 240°C Guaranteed Specifications Frequency Range RF INPUT 180-260 LO INPUT 265-310 IF OUTPUT


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    PDF XMDD7-20D4 rf down converter 30 mhz

    20A8

    Abstract: No abstract text available
    Text: Surface Mount High Dynamic Range Mixer 2200 - 2650 MHz Package Style 20 XMGG7-20A8 Key Features • • • IP3 +32 dBm LO Power +19 dBm Solder Reflow to 240°C Guaranteed Specifications Frequency Range RF input 2200-2650 LO input 1750-2150 IF output 88-860


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    PDF XMGG7-20A8 20A8

    MIXER 210

    Abstract: No abstract text available
    Text: Surface Mount High Dynamic Range Mixer 210 - 230 MHz, Down Converter Package Style 20 XMDD8-20D3 Key Features • • • IP3 +38 dBm LO Power + 25 dBm Solder Reflow to 240°C Guaranteed Specifications Frequency Range RF INPUT 210-230 LO INPUT 197.5 IF OUTPUT


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    PDF XMDD8-20D3 MIXER 210

    Untitled

    Abstract: No abstract text available
    Text: Surface Mount High Dynamic Range Mixer 1805-1880 MHz Package Style 20 XMFF8-20N8 Key Features • • • IP3 +38 dBm LO Power +26 dBm Solder Reflow to +240°C Guaranteed Specifications Frequency Range RF output 1805-1880 LO input 1929-1969 IF input 89-124


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    PDF XMFF8-20N8

    TB370

    Abstract: to252 footprint wave soldering TB334 stencil tension
    Text: Guidelines for Soldering Discrete Power Surface Mount Components to PC Boards Semiconductor Technical Brief January 1999 TB370 Authors: John Coronati, Blake Gillett, Don Pavinski, Stephen Vahey Introduction Solder Plating of Surface Mount Packages Proper reflow soldering of surface mount packages to


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    PDF TB370 TB370 TB334 to252 footprint wave soldering stencil tension

    Untitled

    Abstract: No abstract text available
    Text: Surface Mount High Dynamic Range Mixer 925-960 MHz, Very High Isolation Package Style 84 XMEE4-84N5 Key Features • • • • SOIC-8 Package “Drop In Equivalent” LO to RF Isolation 60 dB LO Power +12 +\- 2 dBm Solder Reflow to +240 C Guaranteed Specifications


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    PDF XMEE4-84N5

    XMFF6-20H3

    Abstract: No abstract text available
    Text: Surface Mount High Dynamic Range Mixer 1800-1920 MHz Package Style 20 XMFF6-20H3 Key Features • • • * IP3 +32 dBm LO Power +17 dBm Solder Reflow to 240°C Guaranteed Specifications Frequency Range RF 1800-1920 LO 1530-1650 IF 270 MHz MHz MHz Conversion Loss dB


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    PDF XMFF6-20H3 XMFF6-20H3

    XMGG6-20H2

    Abstract: No abstract text available
    Text: Surface Mount High Dynamic Range Mixer 2400-2500 MHz Package Style 20 XMGG6-20H2 Key Features • • • * IP3 +34 dBm LO Power +17 dBm Solder Reflow to 240°C Guaranteed Specifications Frequency Range RF 2400-2500 LO 2190-2290 IF 210 MHz MHz MHz Conversion Loss dB


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    PDF XMGG6-20H2 XMGG6-20H2

    XMFF2-20T6

    Abstract: No abstract text available
    Text: Surface Mount High Isolation Mixer 1800-2000 MHz Package Style 20 XMFF2-20T6 Key Features • • • High LO to RF Isolation LO Power +7 dBm Solder Reflow to 240°C Guaranteed Specifications Frequency Range RF 1800-2000 LO 1800-2000 IF 10-200 MHz MHz MHz


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    PDF XMFF2-20T6 XMFF2-20T6

    XMGG6-20H3

    Abstract: No abstract text available
    Text: Surface Mount High Dynamic Range Mixer 2400-2500 MHz Package Style 20 XMGG6-20H3 Key Features • • • * IP3 +34 dBm LO Power +17 dBm Solder Reflow to 240°C Guaranteed Specifications Frequency Range RF 2400-2500 LO 2130-2230 IF 270 MHz MHz MHz Conversion Loss dB


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    PDF XMGG6-20H3 XMGG6-20H3

    XMFF7-20H2

    Abstract: No abstract text available
    Text: Surface Mount High Dynamic Range Mixer 1800-1920 MHz Package Style 20 XMFF7-20H2 Key Features • • • IP3 +38 dBm LO Power +21 dBm Solder Reflow to 240°C Guaranteed Specifications Frequency Range RF 1800-1920 LO 1590-1710 IF 210 MHz MHz MHz Conversion Loss dB


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    PDF XMFF7-20H2 XMFF7-20H2

    LR 3960

    Abstract: XMGG4-20A9
    Text: Surface Mount High Dynamic Range Mixer 3590 – 3960 MHz Package Style 20 XMGG4-20A9 Key Features • • • IP3 +24 dBm LO Power +15 to +17 dBm Solder Reflow to 240°C Guaranteed Specifications Frequency Range RF LO IF 3590-3960 3100 499-860 MHz MHz MHz


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    PDF XMGG4-20A9 LR 3960 XMGG4-20A9

    Untitled

    Abstract: No abstract text available
    Text: Surface Mount Broadband Mixer 50-4000 MHz Package Style 30 XMAG7-30LK Key Features • • • IP3 +32 dBm LO Power +23 dBm Solder Reflow to 240°C Guaranteed Specifications Frequency Range RF LO IF 50-4000 50-4000 50-3000 MHz MHz MHz Conversion Loss dB


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    PDF XMAG7-30LK