3.5mm Stereo Chassis Socket
Abstract: FDZ BT PCB Mounted 6.5mm Stereo Socket trs stereo jack female jack 3.5mm Stereo plug FEMALE PCB MOUNT 6.35mm audio black Socket 5 pin PCB Mounted 3.5mm Stereo jack TRS jack CONNECTOR Stereo phone plug solder 3.5MM PCB Mounted 3.5mm Stereo plug 4 pole switch
Text: CONTENTS CONTENTS CATEGORY SUB CATEGORY AX SERIES XLR CABLE CONNECTORS PAGE 3 METAL SHELL TYPE - SOLDER AC SERIES XLR CABLE CONNECTORS PAGE 9 METAL SHELL TYPE - SOLDER THERMOPLASTIC SHELL TYPE - SOLDER METAL SHELL TYPE RIGHT ANGLE - SOLDER METAL SHELL TYPE - IDC SOLDERLESS
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35Mother
3.5mm Stereo Chassis Socket
FDZ BT
PCB Mounted 6.5mm Stereo Socket
trs stereo jack female jack
3.5mm Stereo plug FEMALE PCB MOUNT
6.35mm audio black Socket
5 pin PCB Mounted 3.5mm Stereo jack
TRS jack
CONNECTOR Stereo phone plug solder 3.5MM
PCB Mounted 3.5mm Stereo plug 4 pole switch
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PCB Mounted 6.5mm Stereo Socket
Abstract: 3.5mm Stereo plug FEMALE PCB MOUNT 3.5mm Stereo Chassis Socket trs stereo jack female jack layout pcb stk 070 PCB Mounted 3.5mm Stereo Socket chassis STEREO FEMALE CONNECTOR 3.5MM PCB MOUNT 6.35mm audio black Socket XLR-5 connector amphenol CHASSIS MOUNT d sub CONNECTORS
Text: CONTENTS CONTENTS CATEGORY SUB CATEGORY AX SERIES XLR CABLE CONNECTORS PAGE 3 METAL SHELL TYPE - SOLDER AC SERIES XLR CABLE CONNECTORS PAGE 9 METAL SHELL TYPE - SOLDER THERMOPLASTIC SHELL TYPE - SOLDER METAL SHELL TYPE RIGHT ANGLE - SOLDER METAL SHELL TYPE - IDC SOLDERLESS
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GR-78-CORE
Abstract: J-STD-005 multicore solder paste GR78-CORE GR-78-CORE PCB solder powder J-STD-004 paste J-STD-004 MSDS bellcore GR-78 MCF800
Text: Technical Data Sheet MP200 Solder Paste February 2005 HIGH-SPEED PRINTING, NO-CLEAN SOLDER PASTE PRODUCT DESCRIPTION Multicore MP200 solder pastes have been formulated as no-clean solder pastes for high speed printing and reflow in both air and nitrogen. The products were specifically formulated to have increased
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MP200
ANSI/J-STD-004
GR-78-CORE
J-STD-005
multicore solder paste
GR78-CORE
GR-78-CORE PCB
solder powder
J-STD-004 paste
J-STD-004 MSDS
bellcore GR-78
MCF800
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sn63pb37 solder wire
Abstract: SN63PB37 ROSIN FLUX TYPE ROL0 kester Sn63pB37 sn63pb37 solder wire flux 232
Text: 2011RECOMMENDED RECOMMENDED 2012 ElectronicsAssembly Assembly Materials Materials Electronics Table of Contents Table of Contents 2 Products Pages Solder Paste Fluxes Solder Wire Bar Solder Additional Flux Materials TSF Products Other products Helpful Information
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full automatic Washing machines circuit diagram
Abstract: automatic washing machine control system circuit fully automatic washing machine electronic circuit A6S-4101-H A6S-1104-PH 9101h full automatic Washing machines state diagram 4 pole 3 way rotary switch diagram
Text: DIP Switch A6S-H Previous A6S Model Upgraded to Surface-mounting Type with Increased Solder Heat Resistance • Designed to enable replacement of previous (A6S) model, featuring the same dimensions and improved solder heat resistance (peak solder temperature: 260°C).
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A6S-1101-H
A6S-1102-H
A6S-1104-H
A512-E-01A
full automatic Washing machines circuit diagram
automatic washing machine control system circuit
fully automatic washing machine electronic circuit
A6S-4101-H
A6S-1104-PH
9101h
full automatic Washing machines state diagram
4 pole 3 way rotary switch diagram
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Kester 197
Abstract: No abstract text available
Text: R560 Water-Soluble Solder Paste Product Description Physical Properties Data given for Sn63Pb37, 90% metal, -325+500 mesh Kester R560 is an organic acid, water-soluble solder paste formula specifically designed to reduce voiding in Ball Grid Array (BGA) solder
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Sn63Pb37,
10Sep04
Kester 197
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kester Sn62Pb36Ag02
Abstract: Sn63pB37 temp profile
Text: R500 Dispensable Water-soluble Solder Paste for Leaded Alloys Product Description Physical Properties Kester R500 is a water-soluble solder paste formula specifically designed as a consistent dot dispensing paste for automated dispense equipment. This solder paste exhibits excellent wetting
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Sn63Pb37
10rpm
21Sep09
kester Sn62Pb36Ag02
Sn63pB37 temp profile
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senju solder paste
Abstract: senju printing speed Senju metal solder paste viscometer Rosin Flux Type RMA Senju flux Senju soldering paste solder powder 62Sn36Pb2Ag
Text: MITSUBISHI INTEGRATED CIRCUIT PACKAGES SURFACE MOUNTING PROCESS 2.3 SOLDER SUPPLY PROCESS 2.3.1 SOLDER PASTE 1 Material Composition Soldering paste is mainly made from soldering powder and flux. Soldering powder makes up approximately 80-95wt% of soldering paste
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80-95wt%
63Sn/37Pb)
62Sn/36Pb/2Ag)
senju solder paste
senju printing speed
Senju metal solder paste
viscometer
Rosin Flux Type RMA
Senju flux
Senju
soldering paste
solder powder
62Sn36Pb2Ag
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Untitled
Abstract: No abstract text available
Text: Technical Data Sheet MP200 December-2011 PRODUCT DESCRIPTION MP200 provides the following product characteristics: Technology Application Solder paste Sn/Pb soldering MP200 solder pastes have been formulated as no-clean, Sn/Pb solder paste for high speed printing and reflow in both
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MP200
December-2011
MP200
200mms-1
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mutoh ip-220
Abstract: No abstract text available
Text: Database for Properties of Lead-Free Solder Alloys DATABASE FOR PROPERTIES OF LEAD-FREE SOLDER ALLOYS Version 1.0 This database is a joint project of ELFNET and COST 531 Action. COST 531 ACTION ON LEAD-FREE SOLDER ALLOYS EURPEAN LEAD-FREE SOLDERING NETWORK
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kskimm12
RC22717
W0302-019)
mutoh ip-220
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Untitled
Abstract: No abstract text available
Text: HM53-208R0VLF summary material content, BI Technologies Corporation Index Item Material Name TOROID CORE Iron Powder 2 COIL Polyurethane Enamelled Copper Magnet Wire 3 SOLDER Lead Free Solder 1 Element Composition CAS No Fe Resin Coating Lubricant Polyester
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HM53-208R0VLF
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Untitled
Abstract: No abstract text available
Text: HM53-001R6VLF summary material content, BI Technologies Corporation Index Item Material Name TOROID CORE Iron Powder 2 COIL Polyurethane Enamelled Copper Magnet Wire 3 SOLDER Lead Free Solder 1 Element Composition CAS No Fe Resin Coating Lubricant Polyester
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HM53-001R6VLF
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Untitled
Abstract: No abstract text available
Text: HM53-101R6VLF summary material content, BI Technologies Corporation Index Item Material Name TOROID CORE Iron Powder 2 COIL Polyurethane Enamelled Copper Magnet Wire 3 SOLDER Lead Free Solder 1 Element Composition CAS No Fe Resin Coating Lubricant Polyester
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HM53-101R6VLF
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Untitled
Abstract: No abstract text available
Text: HM53-50370HLF summary material content, BI Technologies Corporation Index Item Material Name TOROID CORE Iron Powder 2 COIL Polyurethane Enamelled Copper Magnet Wire 3 SOLDER Lead Free Solder 1 4 ADHESIVE Epoxy Resin Element Composition CAS No Fe Resin Coating
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HM53-50370HLF
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Untitled
Abstract: No abstract text available
Text: HM53-40360HLF summary material content, BI Technologies Corporation Index Item Material Name TOROID CORE Iron Powder 2 COIL Polyurethane Enamelled Copper Magnet Wire 3 SOLDER Lead Free Solder 1 4 ADHESIVE Epoxy Resin Element Composition CAS No Fe Resin Coating
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HM53-40360HLF
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Untitled
Abstract: No abstract text available
Text: HM53-30150HLF summary material content, BI Technologies Corporation Index Item Material Name TOROID CORE Iron Powder 2 COIL Polyurethane Enamelled Copper Magnet Wire 3 SOLDER Lead Free Solder 1 4 ADHESIVE Epoxy Resin Element Composition CAS No Fe Resin Coating
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HM53-30150HLF
0200hane
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24-7068-1407
Abstract: 24-6337-8817 GR-63-CORE Zone 4 test 2460400010 24-6337-0027 K100LD sn62pb36ag2
Text: 2013 RECOMMENDED Electronics Assembly Materials Table of Contents Table of Contents 2 Products Pages Solder Paste Fluxes Solder Wire Bar Solder Additional Flux Materials TSF Products Other products Helpful Information 3-7 8-11 12-13 14-15 16 17 18 19 | 800 253 7837 | WWW.kester.com
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AIMTERGE-520A
Abstract: SN100C C425 BI14
Text: RA Cored Wire Solder Rosin Activated Cored Wire Solder Features: - High Activity Level - Good Thermal Transfer - Fully Activated Flux - Glycol-Free - Improved Wetting Properties Description: RA is a fully activated, general-purpose wire solder for use in applications where mildly activated fluxes are too weak. RA
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ISO9001
45-micron
AIMTERGE-520A
SN100C
C425
BI14
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Untitled
Abstract: No abstract text available
Text: HM100-251R0LF summary material content, BI Technologies Corporation Index Item Material Name E CORE Iron Powder I CORE Iron Powder 1 2 3 4 ADHESIVE COIL SOLDER Epoxy Resin Enamelled Copper Wire Lead Free Solder Element Composition CAS No Fe2O3 MnO ZnO Others
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HM100-251R0LF
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Untitled
Abstract: No abstract text available
Text: HM88-10091R0LF summary material content, BI Technologies Corporation Index Item Material Name E CORE Iron Powder I CORE Iron Powder 1 2 ADHESIVE Epoxy Resin 3 COIL Enamelled Copper Wire 4 5 SOLDER DUMMY Lead Free Solder Dummy Lead Element Composition CAS No
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Delta EFD20
Abstract: 48V to 12V buck transformer EFD20 7W
Text: Application Notes Magnetics Recommended Solder Reflow Profiles Standard SnPb Solder 3°C/Second Max. Lead Pb Free Solder 3°C/Second Max. 100°C 150°C 60-120seconds 150°C 200°C 60-120seconds 3°C/Second Max. 183°C 60-150 Seconds 235°C +/-5°C 30 Seconds Max
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60-120seconds
Delta EFD20
48V to 12V buck transformer
EFD20 7W
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iron powder
Abstract: No abstract text available
Text: 19-Aug-09 HM70-101R0LF summary material content, BI Technologies Corporation Index Item Material Name E CORE Iron Powder I CORE Iron Powder 1 2 ADHESIVE Epoxy Resin 3 COIL Enamelled Copper Wire 4 SOLDER Lead Free Solder Dummy Lead 5 DUMMY Nickel Plating Tin Plating
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19-Aug-09
HM70-101R0LF
iron powder
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TB2272
Abstract: No abstract text available
Text: 23-Jul-09 HM73-106R0LF summary material content, BI Technologies Corporation Index Item Material Name 1 CORE Iron Powder 2 ADHESIVE Epoxy 3 WIRE Air Coil 4 BODY Ink 5 SOLDER Lead Free Solder CAS No Material Mass mg Composition (mg) 7439-89-6 - 855 846.45
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23-Jul-09
HM73-106R0LF
471-34-ect
7440-50-8ad
TB2272
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FAY RF
Abstract: No abstract text available
Text: Development General NXP Semiconductors BL-Cellular Systems, MST RF Power Basestations DEV&QAS Title: Solder mounting recommendations for Ldmos Power Amplifiers Author: Josselin FAY / Raimond DUMOULIN Doc. Nr. Date: 2007/05/10 General solder mounting recommendations
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