smd291ax
Abstract: SMD-291AX smd 291ax isopropyl alcohol alcohol paste 291ax syringe solder paste
Text: Chip Quik SMD291AX No Clean Solder Paste Product Sheet Page 1 of 2 Product Description CHIP QUIK Product Name: SMD291AX No Clean Solder Paste Product Details CHIP QUIK® z SMD-291AX No Clean Solder Paste Features { No-Clean Solder Paste 5cc Syringe - 15 grams
|
Original
|
PDF
|
SMD291AX
SMD291AX
SMD-291AX
com/smd291ax
smd 291ax
isopropyl alcohol
alcohol
paste
291ax
syringe
solder paste
|
GR-78-CORE
Abstract: No abstract text available
Text: Technical Data Sheet WS200 June-2009 WS200™ is a water washable solder paste for printing and reflow in air or nitrogen atmospheres where process yield is critical. WS200™ solder paste offers excellent open time and good soldering activity over a wide range of reflow profiles and
|
Original
|
PDF
|
WS200â
June-2009
GR-78-CORE
|
sn63pb37 solder wire
Abstract: SN63PB37 ROSIN FLUX TYPE ROL0 kester Sn63pB37 sn63pb37 solder wire flux 232
Text: 2011RECOMMENDED RECOMMENDED 2012 ElectronicsAssembly Assembly Materials Materials Electronics Table of Contents Table of Contents 2 Products Pages Solder Paste Fluxes Solder Wire Bar Solder Additional Flux Materials TSF Products Other products Helpful Information
|
Original
|
PDF
|
|
Solder paste volume
Abstract: No abstract text available
Text: HSDL-2XXX Surface Mount Technology Assembly Application Note 1138 Solder Pad, Mask and Metal Solder Stencil Aperture METAL STENCIL FOR SOLDER PASTE PRINTING STENCIL APERTURE LAND PATTERN SOLDER MASK PCBA Figure 1. Stencil and PCBA Recommended Land Pattern for HSDL-2XXX
|
Original
|
PDF
|
5966-3027E
Solder paste volume
|
all ic data
Abstract: EIAJ SO 8 solder heating profile intel 80486 DX4 INTEL DX4 paste profile SMT Process dx4 208 SQFP 80c196kb 1988 diode databook intel 80486
Text: Board Solder Reflow Process Recommendations - Leaded SMT 9.1 9 Introduction In reflowed board assemblies, the solder joint quality is affected by several variables including the component, SMT Surface Mount Technology assembly conditions, solder paste, reflow profile
|
Original
|
PDF
|
|
all ic data
Abstract: land pattern for TSOP 2 pace craft 100 82425EX intel 80486 80486 DX4 80c196kb 1988 QFP PACKAGE thermal resistance 55A5 TSOP infrared
Text: CHAPTER 9 BOARD SOLDER REFLOW PROCESS RECOMMENDATIONS INTRODUCTION In reflowed board assemblies the solder joint quality is affected by several variables such as board design SMT Surface Mount Technology assembly equipment solder paste component and reflow profile
|
Original
|
PDF
|
|
Intel reflow soldering profile BGA
Abstract: all ic data infrared heating gun 82425EX 80c196kb 1988 28F010 80C196KB pcb warpage after reflow Intel reflow soldering profile BGA intel conveyor belt alignment
Text: Board Solder Reflow Process Recommendations 9.1 9 Introduction In reflowed board assemblies, the solder joint quality is affected by several variables such as the component, SMT Surface Mount Technology assembly conditions, solder paste, reflow profile and board design.
|
Original
|
PDF
|
conductivi49-58.
Intel reflow soldering profile BGA
all ic data
infrared heating gun
82425EX
80c196kb 1988
28F010
80C196KB
pcb warpage after reflow
Intel reflow soldering profile BGA intel
conveyor belt alignment
|
24-7068-1407
Abstract: 24-6337-8817 GR-63-CORE Zone 4 test 2460400010 24-6337-0027 K100LD sn62pb36ag2
Text: 2013 RECOMMENDED Electronics Assembly Materials Table of Contents Table of Contents 2 Products Pages Solder Paste Fluxes Solder Wire Bar Solder Additional Flux Materials TSF Products Other products Helpful Information 3-7 8-11 12-13 14-15 16 17 18 19 | 800 253 7837 | WWW.kester.com
|
Original
|
PDF
|
|
Untitled
Abstract: No abstract text available
Text: PIN RECEPTACLES PIN RECEPTACLES WITH ORGANIC FIBRE PLUG SOLDER BARRIER SEE SPECIFIC CONTACT RANGE ON PAGES 250, 251 & 253 • These through-hole (tubular) receptacles are designed for hand, wave or reflow * soldering. The ORGANIC FIBRE PLUG® barrier prevents solder paste or
|
Original
|
PDF
|
EIA-481
2011/65/EU
|
Untitled
Abstract: No abstract text available
Text: PIN RECEPTACLES PIN RECEPTACLES WITH ORGANIC FIBRE PLUG SOLDER BARRIER SEE SPECIFIC CONTACT RANGE ON PAGES 250, 251 & 253 • These through-hole (tubular) receptacles are designed for hand, wave or reflow * soldering. The ORGANIC FIBRE PLUG® barrier prevents solder paste or
|
Original
|
PDF
|
EIA-481
330mm
0577-0-XX-XX-21-XX-10-0
2011/65/EU
|
Untitled
Abstract: No abstract text available
Text: PIN RECEPTACLES PIN RECEPTACLES WITH ORGANIC FIBRE PLUG SOLDER BARRIER SEE SPECIFIC CONTACT RANGE ON PAGES 250, 251 & 253 • These through-hole (tubular) receptacles are designed for hand, wave or • • reflow* soldering. The ORGANIC FIBRE PLUG® barrier prevents solder, paste or
|
Original
|
PDF
|
EIA-481
2011/65/EU
|
Untitled
Abstract: No abstract text available
Text: M PR E CI NE D ON S I CHI A PIN RECEPTACLES With Organic Fibre Plug Solder Barrier PINS • These thru-hole tubular receptacles are designed for hand, wave or reflow* soldering. The ORGANIC FIBRE PLUG® barrier prevents solder, paste or flux from contaminating the
|
Original
|
PDF
|
EIA-481
|
A01201
Abstract: No abstract text available
Text: M PR E CI NE D ON S I CHI A PIN RECEPTACLES With Organic Fibre Plug Solder Barrier PINS • These thru-hole tubular receptacles are designed for hand, wave or reflow* soldering. The ORGANIC FIBRE PLUG® barrier prevents solder, paste or flux from contaminating the
|
Original
|
PDF
|
EIA-481
A01201
|
Untitled
Abstract: No abstract text available
Text: M PR E CI NE D ON S I CHI A PIN RECEPTACLES With Organic Fibre Plug Solder Barrier PINS • These thru-hole tubular receptacles are designed for hand, wave or reflow* soldering. The ORGANIC FIBRE PLUG® barrier prevents solder, paste or flux from contaminating the
|
Original
|
PDF
|
EIA-481
|
|
|
Untitled
Abstract: No abstract text available
Text: M PR E CI NE D ON S I CHI A PIN RECEPTACLES With Organic Fibre Plug Solder Barrier PINS • These thru-hole tubular receptacles are designed for hand, wave or reflow* soldering. The ORGANIC FIBRE PLUG™ barrier prevents solder, paste or flux from contaminating the
|
Original
|
PDF
|
EIA-481
|
Untitled
Abstract: No abstract text available
Text: M PR E CI NE D ON S I CHI A PIN RECEPTACLES With Organic Fibre Plug Solder Barrier PINS • These thru-hole tubular receptacles are designed for hand, wave or reflow* soldering. The ORGANIC FIBRE PLUG® barrier prevents solder, paste or flux from contaminating the
|
Original
|
PDF
|
EIA-481
|
Untitled
Abstract: No abstract text available
Text: M PR E CI NE D ON S I CHI A PIN RECEPTACLES With Organic Fibre Plug Solder Barrier PINS • These thru-hole tubular receptacles are designed for hand, wave or reflow* soldering. The ORGANIC FIBRE PLUG® barrier prevents solder, paste or flux from contaminating the
|
Original
|
PDF
|
EIA-481
|
Untitled
Abstract: No abstract text available
Text: PIN RECEPTACLES With Organic Fibre Plug Solder Barrier M P R E CI NE D ON S I CHI A PINS • These thru-hole tubular receptacles are designed for hand, wave or reflow* soldering. The ORGANIC FIBRE PLUG® barrier prevents solder, paste or flux from contaminating the
|
Original
|
PDF
|
EIA-481
plateXX-XX-30-XX-10-0
3435-0-XX-XX-47-XX-04-0
330mm
|
Untitled
Abstract: No abstract text available
Text: PIN RECEPTACLES With Organic Fibre Plug Solder Barrier M P R E CI NE D ON S I CHI A PINS • These thru-hole tubular receptacles are designed for hand, wave or reflow* soldering. The ORGANIC FIBRE PLUG® barrier prevents solder, paste or flux from contaminating the
|
Original
|
PDF
|
EIA-481
plate-0-XX-XX-21-XX-10-0
4015-0-XX-XX-30-XX-10-0
330mm
|
BGA-3000
Abstract: smd ic marking A9 smd a10 shaker smd diode A4 smd marking a7 smd transistor A6 transistor SMD a4 top mark smd A9 250 micro solder ball
Text: National Semiconductor Application Note 1112 August 2000 CONTENTS Package Construction Key attributes for micro SMD 4, 5, and 8 bump Smallest Footprint Micro SMD Handling Surface Mount Technology SMT Assembly Considerations Printed Circuit Board Layout Stencil Printing Solder Paste
|
Original
|
PDF
|
|
Untitled
Abstract: No abstract text available
Text: S O L D E R IN G A N D C L E A N IN G PROCESSES 1 — Solder Paste Printing Roflow GENERAL Use the optimum solder paste for the pattern, printing pi-ocess, solderpaste density and solder joint quality. RECOMMENDED Use Sn 63% Pb 37% solder paste. Use 8 to 10 mil thickness for
|
OCR Scan
|
PDF
|
|
Untitled
Abstract: No abstract text available
Text: Philips Semiconductors Video Transistors and Modules for Monitors General MOUNTING AND SOLDERING Stencilling Mounting methods In this method a stencil with etched holes to pass the paste is used. The thickness of the stencil determines the amount of amount of solder paste that is deposited on the
|
OCR Scan
|
PDF
|
|
js sot23
Abstract: No abstract text available
Text: Product specification Philips Semiconductors Small-signal Field-effect Transistors General section MOUNTING AND SOLDERING Screen printing Mounting methods This is the best high-volume production method of solder paste application. An emulsion-coated, fine mesh screen
|
OCR Scan
|
PDF
|
|
Untitled
Abstract: No abstract text available
Text: Philips Semiconductors General Small-signal Field-effect Transistors MOUNTING AND SOLDERING Screen printing Mounting methods This is the best high-volume production method of solder paste application. An emulsion-coated, fine mesh screen with apertures etched in the emulsion to coincide with the
|
OCR Scan
|
PDF
|
|
