numbers
Abstract: 5602 kyocera date code KYOCERA ELCO
Text: SPEC NUMBER: KYOCERA ELCO CORPORATION ２０５－０３－１７３ 取扱説明書 HANDLING MANUAL Series 5602 0.4 mm Pitch Board to Board Connector （H=1.5, 1.7） C DCN-744 09/18 '08 T.Sasaki B DCN-885 06/30 '05 A.Tsunemura O EDN-427 06/03 '02 Y.Shiroyama
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DCN-744
DCN-885
EDN-427
numbers
5602
kyocera date code
KYOCERA ELCO
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tva0300n07
Abstract: mmic amplifier marking code N10 MTVA0300N05 PST-02-A-1 TVA0300N07W3 electronic passive components catalog SC-1016 MTVA0300 SMT2010TALN 42TVA
Text: EMC TECHNOLOGY Custom Engineered Solutions 8851 SW Old Kansas Ave. 772 286-9300 ISO 9001 & 14001 Certified M I C R OWAV E C O M P O N E N T S www.emct.com Resistive Products, Smart Loads , High Reliability Stuart, FL 34997 (800) 544-5594 Thermopads®, Equalizers,
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AV02-0274EN
Abstract: ASDL-4360 ASDL-4360-C22
Text: ASDL-4360 High Power and High Speed Infrared Emitter 885nm in PLCC-2 Package Data Sheet Description Features ASDL-4360 Infrared emitter is encapsulated in the Industry Standard PLCC-2 SMT package that is designed for application that requires high radiant intensity
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ASDL-4360
885nm)
ASDL-4360
885nm.
885nm
AV02-0274EN
ASDL-4360-C22
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ASDL-4360
Abstract: ASDL-4360-C22
Text: ASDL-4360 High Power and High Speed Infrared Emitter 885nm in PLCC-2 Package Data Sheet Description Features ASDL-4360 Infrared emitter is encapsulated in the Industry Standard PLCC-2 SMT package that is designed for application that requires high radiant intensity
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ASDL-4360
885nm)
ASDL-4360
885nm.
885nm
ASDL-4360-C22
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NCP18XH103D0SRB
Abstract: heraeus pc 3000 NCG18XH103 NCP15XH103D0SRC NCP18WF104D0SRB NCG18XH103F0SRB Senju M705-grn360-k2-v NXFS15XH103 PRF18BE471QS5RB BC 5609
Text: !Note • Please read rating and !CAUTION for storage, operating, rating, soldering, mounting and handling in this catalog to prevent smoking and/or burning, etc. • This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please review our product specifications or consult the approval sheet for product specifications before ordering.
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R03E-6
NCP18XH103D0SRB
heraeus pc 3000
NCG18XH103
NCP15XH103D0SRC
NCP18WF104D0SRB
NCG18XH103F0SRB
Senju M705-grn360-k2-v
NXFS15XH103
PRF18BE471QS5RB
BC 5609
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4532M
Abstract: crystal washing machine service manual power 4532M transistor 4532m yageo mlcc yageo Phycomp 0603 res 1808 FOOTPRINT mlcc soldering ceramic capacitor footprint 0201 dimension 4278A
Text: Innovative Service Around the Globe www.yageo.com MLCC Application Manual 1. Introduction Contents 1. Introduction 1.1 Construction and dimensions 1.2 Influences of the MLCC terminations over the solder connections 2. Storage Conditions 3. Soldering Information
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LM 4088 relay
Abstract: IC LM 393 N hall 503 911 smd transistor A6t smd transistor 351A smd a6t double diode SX4009-P1 914 Battery Protection IC G2RL G8HN ic 4081 datasheet
Text: Components Catalogue Contents Contents Welcome 7-8 POWER RELAYS 9 - 156 Technical Information – Power & Signal Relays 9 - 28 AUTOMOTIVE RELAYS 274 - 313 Selection Guide 274 - 277 G8N-1 278 - 282 Selection Guide 29 - 40 G8ND-2 283 - 287 G5B 41 - 44 G8NW 288 - 292
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B3M-6009
Abstract: solder flux 885
Text: R Tactile Switch B3M Designed for a Long Stroke and Positive Click H Long stroke of 0.85 mm provides radically improved operability H Light touch with a minimum overstroke of 0.25 mm H Improved reliability with a service life of 2,000,000 operations Ordering Information
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B3M-6009
1-800-55-OMRON
B3M-6009
solder flux 885
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Untitled
Abstract: No abstract text available
Text: Bridgelux ES Star Array Series Product Data Sheet DS23 BXRA-xxx0540, BXRA-xxx0740, BXRA-40E0600 BXRA-40E0810, BXRA-xxC0700, BXRA-xxC1000 Introduction The Bridgelux family of LED Array products delivers high performance, compact and cost-effective solidstate lighting solutions to serve the general lighting market. These products combine the higher efficacy,
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BXRA-xxx0540,
BXRA-xxx0740,
BXRA-40E0600
BXRA-40E0810,
BXRA-xxC0700,
BXRA-xxC1000
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Dupont 9476
Abstract: No abstract text available
Text: ASIC FLIP CHIPS Application Note ASIC Flip Chips: Manufacture and Use By Barbara L. Gibson, Applications Engineer plastic encapsulated device: wire bonds and wire damage during assembly, are avoided. By attaching directly to the substrate without being mounted on a lead frame or
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Integrated Inductive Components
Abstract: TB 2929 H amplifier PHILIPS ferrite transformer cores magnetic amplifier saturable core planar transformer formula Indiana general ferrite core MeFe2O4 TRANSISTOR PHILIPS 8050 3C30 Philips KS capacitors
Text: technical note IIC Integrated Inductive Components Philips Components IIC Integrated Inductive Components Contents 1 Introduction 3 Features and Applications 4 Design example 8 Materials 9 Type Number structure 14 Environmental aspects 14 Product range 14
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IIC10
COD19
Integrated Inductive Components
TB 2929 H amplifier
PHILIPS ferrite transformer cores
magnetic amplifier saturable core
planar transformer formula
Indiana general ferrite core
MeFe2O4
TRANSISTOR PHILIPS 8050
3C30
Philips KS capacitors
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Untitled
Abstract: No abstract text available
Text: DATA SHEET PHOTOCOUPLER PS8601,PS8601L,PS8601L1,PS8601L2 HIGH SPEED ANALOG OUTPUT TYPE 8-PIN PHOTOCOUPLER <R> −NEPOC Series− DESCRIPTION The PS8601 and PS8601L are 8-pin high speed photocouplers containing a GaAIAs LED on input side and a PN photodiode and a high speed amplifier transistor on output side on one chip. The PS8601 is in a plastic DIP Dual Inline Package . The PS8601L is lead bending type (Gull wing) for surface mount.
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PS8601
PS8601L
PS8601L1
PS8601L2
PS8601L2
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PS8602L-E3-A
Abstract: No abstract text available
Text: DATA SHEET PHOTOCOUPLER PS8602,PS8602L,PS8602L1,PS8602L2 HIGH NOISE REDUCTION HIGH SPEED ANALOG OUTPUT TYPE 8 PIN PHOTOCOUPLER <R> −NEPOC Series− DESCRIPTION The PS8602 and PS8602L are 8-pin high speed photocouplers containing a GaAIAs LED on input side and a P-N
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PS8602
PS8602L
PS8602L1
PS8602L2
PS8602L2
PS8602L-E3-A
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DIP SWITCH
Abstract: OMRON DIP switch J101 DIP SW6 washing machine electric circuit 4 pin dip switch dip switch data OMRON DIP mounting washing machine circuit A6E-5101
Text: R A6E/A6ER DIP Switch DIP Switch H The sealed bottom prevents flux penetration H A variety of models including models with short or long levers are available Ordering Information No. of poles Flat actuated DIP terminal Raised actuator DIP terminal Side actuated short-lever
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A6E-2101
A6E-2104
A6ER-2101
A6ER-2104
A6E-3101
A6E-3104
A6ER-3101
A6ER-3104
A6E-4101
A6E-4104
DIP SWITCH
OMRON DIP switch
J101
DIP SW6
washing machine electric circuit
4 pin dip switch
dip switch data
OMRON DIP mounting
washing machine circuit
A6E-5101
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termistor ptc 10k
Abstract: termistor NTC 103 Termistor PTC NCP18XH103F0SRB NTC 503 3950 termistor ntc 10K 103 Catalog termistor termistor NTC 103 at NCP18WF104F3SRB termistor NTC 104
Text: !Note Please read rating and !CAUTION for storage, operating, rating, soldering, mounting and handling in this PDF catalog to prevent smoking and/or burning, etc. This catalog has only typical specifications. Therefore, you are requested to approve our product specifications or to transact the approval sheet for product specifications before ordering.
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R03E1
R03E-1
termistor ptc 10k
termistor NTC 103
Termistor PTC
NCP18XH103F0SRB
NTC 503 3950
termistor ntc 10K 103
Catalog termistor
termistor NTC 103 at
NCP18WF104F3SRB
termistor NTC 104
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siemens ferrite n22 p14
Abstract: Siemens Ferrite B65541 EC35 Siemens ferrite core ETD54 n62 U93 QUANTA ARALDITE ay 105 EC70 N27 Siemens Ferrite N47 EC52 N27 FERRITES N67
Text: Contents Page 5 Selector Guide Index of Part Numbers 11 25 SIFERRIT Materials 31 General - Definitions Application and Processing Notes Packing 103 121 163 Quality Considerations Standards and Specifications 177 181 RM Cores 185 PM Cores 287 P Cores P Core Halves P Cores for Proximity Switches
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Untitled
Abstract: No abstract text available
Text: To our customers, Old Company Name in Catalogs and Other Documents On April 1st, 2010, NEC Electronics Corporation merged with Renesas Technology Corporation, and Renesas Electronics Corporation took over all the business of both companies. Therefore, although the old company name remains in this document, it is a valid
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Abstract: No abstract text available
Text: A pplication N ote 004 Wrapped Chip D evice M ounting Instructions This line of microwave attenuators is designed for surface mount and wraparound grounding applications. The W1 has a platinum gold wraparound ground with full back m etallization and platinum gold input / output terminations.
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ECF564A
Abstract: No abstract text available
Text: Technology A pplication Notes Chip Device Mounting Instructions A pplication N o te 003 Chip D evice Mounting Instructions All of the chip products in this catalog use thick film metallization for terminations - either platinum gold, gold, or platinum silver. Each material is used to accommodate the different bonding practices that are commonly used
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H20E
Abstract: No abstract text available
Text: TPJ £ 1 1 *2 Tvdmob^i Slowave Miniature Delay Line ^ T J Mounting Instructions m . _ mm . A p p lic a tio n N o te s A p p lic a tio n N o te 0 0 6 S lo w a v e ® M in ia tu re D e la y Lin e M o u n tin g In s tru c tio n s Mounting Instructions for the Leadless Surface M ount Delay Line package.
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13X10-6/
H20E
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Hitachi DIP Marking Code
Abstract: hitachi PLC cg-40 date CODE hitachi plcc hitachi lot marking hitachi assembly date code Hitachi Date Code
Text: INTRO DUCTIO N OF PACKAGES H itachi microcomputer devices include various types of package which meet a lot o f requirements such as ever smaller, thinner and more versatile electric appliances. When selecting a package suitable for the customers' use. please refer to the
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it1338
Abstract: Solder Paste Dupont
Text: ASIC Flip Chips: Manufacture and Use fôv H . i r b t i r a I . i i h s o n , A p p l i c a t i o n s F n i» i iu 't * i Introduction plastic encapsulated device: wire bonds and wire damage during assembly, are avoided. By attaching directly to the substrate without being mounted on a lead frame or
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Flip Chip Substrate
Abstract: Dupont 9476
Text: ASIC Flip Chips: Manufacture and Use ! ir i v i t : ì I>mmi . Introduction Application specific integrated circuits ASICs have been available and widely used for almost two decades. On the other hand, the surface mount technology known as "Flip Chip” has been available, but not widely known outside of
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17ces
Flip Chip Substrate
Dupont 9476
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FRO 24N
Abstract: HD63450 hd6345
Text: In trod u ction o f P a c k a ge s H itachi m icrocom puter devices include various types of package which m eet a lot o f requirem ents such as ever smaller, thinner and m ore versatile electric appliances. When selecting a package suitable for the custom ers’ use, please refer to the
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