18013
Abstract: No abstract text available
Text: SOIC-to-JEDEC TO Adapter FEATURES • 8-position SOIC footprint on the top and a circular, 8-pin JEDEC TO male pin footprint on the bottom. IC now available only in 8-position SOIC packages, can be readily mounted on boards having JEDEC TO thru-hole footprints without having to
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Original
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C36000,
B16/B16M
B579-73
SAE-AMS-QQ-N-290
18013
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PDF
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1109814
Abstract: No abstract text available
Text: SOIC-to-JEDEC TO Adapter FEATURES • 8-position SOIC footprint on the top and a circular, 8-pin JEDEC TO male pin footprint on the bottom. IC now available only in 8-position SOIC packages, can be readily mounted on boards having JEDEC TO thru-hole footprints without having to
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Original
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C36000,
B16/B16M
B579-73
SAE-AMS-QQ-N-290
1109814
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PDF
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Untitled
Abstract: No abstract text available
Text: SOIC to TO Adapter FEATURES: • 8-position SOIC footprint on the top and a circular, 8-pin TO can male pin footprint on the bottom. ICs now available only in 8-position SOIC packages can be readily mounted on boards having TO thru-hole footprints without having to redesign the board.
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Original
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C36000
ASTM-B16-85.
MIL-T10727
MIL-P-81728
QQ-N-290.
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PDF
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18012
Abstract: No abstract text available
Text: SOIC to TO Adapter FEATURES: • 8-position SOIC footprint on the top and a circular, 8-pin TO can male pin footprint on the bottom. ICs now available only in 8-position SOIC packages can be readily mounted on boards having TO thru-hole footprints without having to redesign the board.
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Original
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C36000
ASTM-B16-85.
MIL-T10727
MIL-P-81728
QQ-N-290.
18012
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PDF
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Untitled
Abstract: No abstract text available
Text: SOIC to TO Adapter FEATURES: • 8-position SOIC footprint on the top and a circular, 8-pin TO can male pin footprint on the bottom. ICs now available only in 8-position SOIC packages can be readily mounted on boards having TO thru-hole footprints without having to redesign the board.
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Original
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C36000
ASTM-B16-00.
SAE-AMS-QQ-N-290.
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PDF
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1109814
Abstract: No abstract text available
Text: SOIC to TO Adapter FEATURES: • 8-position SOIC footprint on the top and a circular, 8-pin TO can male pin footprint on the bottom. ICs now available only in 8-position SOIC packages can be readily mounted on boards having TO thru-hole footprints without having to redesign the board.
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Original
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C36000
ASTM-B16-85.
MIL-T10727
MIL-P-81728
QQ-N-290.
1109814
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PDF
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Untitled
Abstract: No abstract text available
Text: NTMS3P03R2 Power MOSFET -3.05 Amps, -30 Volts P-Channel SOIC-8 http://onsemi.com Features •ăHigh Efficiency Components in a Single SOIC-8 Package •ăHigh Density Power MOSFET with Low RDS on •ăMiniature SOIC-8 Surface Mount Package - Saves Board Space
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NTMS3P03R2
NTMS3P03R2/D
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PDF
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E3P03
Abstract: NTMS3P03R2 NTMS3P03R2G
Text: NTMS3P03R2 Power MOSFET -3.05 Amps, -30 Volts P-Channel SOIC-8 http://onsemi.com Features •ăHigh Efficiency Components in a Single SOIC-8 Package •ăHigh Density Power MOSFET with Low RDS on •ăMiniature SOIC-8 Surface Mount Package - Saves Board Space
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Original
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NTMS3P03R2
NTMS3P03R2/D
E3P03
NTMS3P03R2
NTMS3P03R2G
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PDF
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1109814
Abstract: 8 soic pcb footprint 18012 ASTM-B16-85
Text: Part No. 1109814/4102-113-18 SOIC to TO Adapter FEATURES: • 8-position SOIC footprint on the top and a circular, 8-pin TO can male pin footprint on the bottom. ICs now available only in 8-position SOIC packages can be readily mounted on boards having TO thru-hole footprints without having to redesign the board.
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Original
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C36000
ASTM-B16-85.
MIL-P-81728
QQ-N-290.
1109814
8 soic pcb footprint
18012
ASTM-B16-85
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PDF
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Untitled
Abstract: No abstract text available
Text: Part No. 1109814/1109902 SOIC TO to Adapter FEATURES: • 8-position SOIC footprint on the top and a circular, 8-pin TO can male pin footprint on the bottom. ICs now available only in 8-position SOIC packages can be readily mounted on boards having TO thru-hole footprints without having to redesign the board.
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Original
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C36000
ASTM-B16-85.
MIL-P-81728
QQ-N-290.
003roducts
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PDF
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8 soic pcb footprint
Abstract: IPC4101A 1109814
Text: SOIC to TO Adapter RoHs Compliant FEATURES: • Lead Free RoHs/WEEE Compliant • 8-position SOIC footprint on the top and a circular, 8-pin TO can male pin footprint on the bottom. ICs now available only in 8-position SOIC packages can be readily mounted on boards having TO thru-hole footprints without having to redesign the board.
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Original
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FR406
IS410
IPC4101A/26
C36000
ASTM-B16-00.
MIL-G-45204
SAE-AMS-QQ-N-290.
1109814-RC
18013RC
8 soic pcb footprint
IPC4101A
1109814
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PDF
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Untitled
Abstract: No abstract text available
Text: RoHs/WEEE-Compliant SOIC-to-JEDEC TO Adapter FEATURES • Pb-Free RoHs/WEEE-compliant • 8-position SOIC footprint on the top and a circular, 8-pin JEDEC TO can male pin footprint on the bottom. ICs now available only in 8-position SOIC packages can be readily mounted on boards having JEDEC TO thru-hole footprints without having to
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Original
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IS410
101A/26
C36000,
B16/B16M
MIL-G-45204
AMS-QQ-N-290
1109814-RC
18013RC
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PDF
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IPC 4101A
Abstract: IS410 4101A
Text: RoHs/WEEE-Compliant SOIC-to-JEDEC TO Adapter FEATURES • Pb-Free RoHs/WEEE-compliant • 8-position SOIC footprint on the top and a circular, 8-pin JEDEC TO can male pin footprint on the bottom. ICs now available only in 8-position SOIC packages can be readily mounted on boards having JEDEC TO thru-hole footprints without having to
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Original
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IS410
101A/26
C36000,
B16/B16M
MIL-G-45204
AMS-QQ-N-290
1109814-RC
18013RC
IPC 4101A
4101A
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PDF
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Untitled
Abstract: No abstract text available
Text: Surface Mount SOIC Resistor Networks Surface Mount SOIC Resistor • Tested for COTSNetworks applications SOIC Series · Both narrow and wide body versions available · Standard SOIC Series JEDEC 8, 14, 16, and 20 pin packages Ultra-stable TaNSil resistors on silicon substrates
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HP 2630 optocoupler
Abstract: hp 2631 OPTOCOUPLER hp 2631 HP 2630 a 2630 pin diagram optocoupler hp 2630 datasheet HP 2631 optocoupler LED 5630 2631 optocoupler a 2631 optocoupler
Text: H Dual Channel, High CMR, High Speed, TTL Compatible Optocouplers 8 Pin DIP and SOIC-8 HCPL-2630 HCPL-0630 HCPL-2631 HCPL-0631 HCPL-4661 HCPL-0661 Technical Data Features • Available in 8 Pin DIP and SOIC-8 • Internal Shield for High Common Mode Rejection
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Original
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HCPL-2630
HCPL-0630
HCPL-2631
HCPL-0631
HCPL-4661
HCPL-0661
HCPL-2631/0631:
HCPL-4661/0661:
UL1577
E55361)
HP 2630 optocoupler
hp 2631
OPTOCOUPLER hp 2631
HP 2630
a 2630 pin diagram optocoupler
hp 2630 datasheet
HP 2631 optocoupler
LED 5630
2631 optocoupler
a 2631 optocoupler
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PDF
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OZ 9966
Abstract: ci573 C4493 c5588 JS-05(N)K 16 soic pcb footprint MIL-T-10727 soic footprint 8 soic pcb footprint IT43
Text: 300 RRIES Electronics Europe Tel: + 4 4 1 9 0 8 2 6 0 0 0 7 Unit 3, Furtho Court Towcesler Road, Old Stratford Milton Keynes MK19 6AQ F a x : + 441908 2 6 0 0 0 8 SOIC to DIP Adapters Converts SOIC footprint to DIL footprint ^ 8 to 28 pins 'S 8 to 24 pin version is Universal,
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OCR Scan
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XX-350000-10
00r2S
OZ 9966
ci573
C4493
c5588
JS-05(N)K
16 soic pcb footprint
MIL-T-10727
soic footprint
8 soic pcb footprint
IT43
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PDF
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4701N
Abstract: NTMFS4701N NTMFS4701NT1G NTMFS4701NT3G
Text: NTMFS4701N Power MOSFET 30 V, 20 A, Single N-Channel, SOIC-8 Flat Lead Package Features •ăThermally and Electrically Enhanced Packaging Compatible with Standard SOIC-8 http://onsemi.com •ăNew Package Provides Capability of Inspection and Probe After
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NTMFS4701N
NTMFS4701N/D
4701N
NTMFS4701N
NTMFS4701NT1G
NTMFS4701NT3G
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PDF
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Untitled
Abstract: No abstract text available
Text: NTMD4820N Power MOSFET 30 V, 8 A, Dual N-Channel, SOIC-8 Features •ăLow RDS on to Minimize Conduction Losses •ăLow Capacitance to Minimize Driver Losses •ăOptimized Gate Charge to Minimize Switching Losses •ăDual SOIC-8 Surface Mount Package Saves Board Space
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NTMD4820N
NTMD4820N/D
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PDF
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HP 2531 optocoupler
Abstract: l 0534 HCPL 443
Text: Whpl HEW LETT 1 "HM PACKARD Dual Channel, High Speed Optocouplers 8 Pin DIP and SOIC-8 Technical Data Features • Available in 8 Pin DIP and SOIC-8 packages • High Speed: 1 Mb/s • TTL Compatible • Very High Common Mode Transient Immunity: 15000 V/jis @VCM= 1500 V
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OCR Scan
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HCPL-4534/0534)
UL1577
E55361)
HCPL-2530/2531/4534)
CA88324)
HCPL-2530/2531/
MIL-STD-1772
HCPL-5530/31)
4447SÃ
5091-0587E
HP 2531 optocoupler
l 0534
HCPL 443
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PDF
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32K243-40M
Abstract: MC100EL23D MC10EL3 MC10EL32 nb6l11d MC10EP08D MC100EL23 32K2 MC100EP89
Text: ECLSOIC8EVB Evaluation Board User's Manual for High Frequency SOIC 8 http://onsemi.com EVAL BOARD USER’S MANUAL INTRODUCTION ON Semiconductor has developed an evaluation board for the devices in 8−lead SOIC package. These evaluation boards are offered as a convenience for the customers
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Original
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EVBUM2056/D
32K243-40M
MC100EL23D
MC10EL3
MC10EL32
nb6l11d
MC10EP08D
MC100EL23
32K2
MC100EP89
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PDF
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32K243-40M
Abstract: ROSENBERGER 32K243 ROSENBERGER 32K243 32K243-40ME3 FOOTPRINTS CONNECTOR 2 PIN sma connector footprint r6j7 MC10EL58D MC10EL33D
Text: ECLSOIC8EVB Evaluation Board Manual for High Frequency SOIC 8 http://onsemi.com EVALUATION BOARD MANUAL Board Lay−Up INTRODUCTION ON Semiconductor has developed an evaluation board for the devices in 8−lead SOIC package. These evaluation boards are offered as a convenience for the customers
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PDF
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4840N
Abstract: NTMD4840NR2G NTMD4840 NTMD4840N
Text: NTMD4840N Power MOSFET 30 V, 7.5 A, Dual N-Channel, SOIC-8 Features •ăLow RDS on to Minimize Conduction Losses •ăLow Capacitance to Minimize Driver Losses •ăOptimized Gate Charge to Minimize Switching Losses •ăDual SOIC-8 Surface Mount Package Saves Board Space
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Original
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NTMD4840N
NTMD4840N/D
4840N
NTMD4840NR2G
NTMD4840
NTMD4840N
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PDF
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4707n
Abstract: 4707n mosfet NTMFS4707NT3G NTMFS4707N NTMFS4707NT1G
Text: NTMFS4707N Power MOSFET 30 V, 17 A, Single N-Channel, SOIC-8 Flat Lead Features •ăFast Switching Times •ăLow Gate Charge •ăLow RDS on •ăLow Inductance SOIC-8 Package •ăThese are Pb-Free Devices http://onsemi.com V(BR)DSS RDS(on) Typ 10 mW @ 10 V
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Original
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NTMFS4707N
NTMFS4707N/D
4707n
4707n mosfet
NTMFS4707NT3G
NTMFS4707N
NTMFS4707NT1G
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PDF
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Untitled
Abstract: No abstract text available
Text: Transient Voltage Suppressors for ESD Protection SLVU2.8-4 Series > SOIC-8 RoHS Low Capacitance SLVU2.8-4 Series Description The SLVU2.8-4 is in an SOIC-8 package and may be used to protect two high-speed line pairs. The " flow-thru” design minimizes trace inductance and reduces voltage overshoot
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Original
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IEC61000-4-2
IEC61000-4-4
IEC61000-4-5
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PDF
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