ir2131
Abstract: No abstract text available
Text: IR2131 28 Lead PDIP wide body 28 Lead SOIC (wide body) 01-3024 02
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IR2131
ir2131
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soic 28 wide body
Abstract: No abstract text available
Text: IR2131 28 Lead PDIP wide body 28 Lead SOIC (wide body) 01-3024 02
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IR2131
soic 28 wide body
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soic 28 wide body
Abstract: ir2131
Text: IR2131 28 Lead PDIP wide body 28 Lead SOIC (wide body) 8 01-3040 01
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IR2131
soic 28 wide body
ir2131
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MS-013-AE
Abstract: 7126 RW-28 MS-013AE
Text: a 28-Lead Standard Small Outline Package [SOIC] Wide Body RW-28 Dimensions shown in millimeters and (inches) 18.10 (0.7126) 17.70 (0.6969) 28 15 7.60 (0.2992) 7.40 (0.2913) 1 14 10.65 (0.4193) 10.00 (0.3937) 2.65 (0.1043) 2.35 (0.0925) 0.75 (0.0295) ؋ 45؇
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28-Lead
RW-28)
MS-013AE
MS-013-AE
7126
RW-28
MS-013AE
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DIMENSIONS soic 28
Abstract: No abstract text available
Text: a 28-Lead Standard Small Outline Package [SOIC] Wide Body R-28 Dimensions shown in millimeters and (inches) 18.10 (0.7126) 17.70 (0.6969) 28 15 7.60 (0.2992) 7.40 (0.2913) 1 14 10.65 (0.4193) 10.00 (0.3937) 2.65 (0.1043) 2.35 (0.0925) 0.75 (0.0295) ؋ 45؇
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28-Lead
MS-013AE
DIMENSIONS soic 28
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SOIC-16
Abstract: PLCC-20 SIP 9 SOIC-8 lr 014
Text: PACKAGE DESIGNATORS A DIP 14 to 40 pins B (Semi-Tab DIP) 8 to 24 pins Dwg. OA-004-18 Dwg. OA-004-17 K (SIP) 4 pins KA (SIP) 5 pins LL, LR, or LT (SOT) Dwg. OA-014-64 L (SOIC) 8, 14, or 16 leads Dwg. OA-008-3 LB (Semi-Tab SOIC) 16 to 24 leads LW (Wide-Body SOIC) 16 to 28 leads
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OA-004-18
OA-004-17
OA-014-64
OA-008-3
OA-005-14
OA-005-21
OA-015-3
OA-007-44
OA-013-4
OA-005-17
SOIC-16
PLCC-20
SIP 9
SOIC-8
lr 014
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Untitled
Abstract: No abstract text available
Text: Package Information www.vishay.com Vishay Siliconix SOIC WIDE-BODY : 28-LEADS 0.06 0.002D CAVITY NO. 0.3525 0.001 0.334 0.005 28 27 26 25 24 23 22 21 20 19 18 R0.004 17 16 15 0.010 0.1475 0.001 R0.008 0.295 0.001 R0.009 1 2 3 4 5 6 7 8 9 10 11 12 13 14 4°
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28-LEADS
E11-2209-Rev.
01-Aug-11
01-Aug-11
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Untitled
Abstract: No abstract text available
Text: Plastic Packages for Integrated Circuits Small Outline Plastic Packages SOIC M28.3 (JEDEC MS-013-AE ISSUE C) N 28 LEAD WIDE BODY SMALL OUTLINE PLASTIC PACKAGE INDEX AREA H 0.25(0.010) M B M INCHES E SYMBOL -B- 1 2 3 L SEATING PLANE -A- A D h x 45o a e A1
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MS-013-AE
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MS-013-AE
Abstract: 28 MS-013 Package
Text: Plastic Packages for Integrated Circuits Small Outline Plastic Packages SOIC M28.3 (JEDEC MS-013-AE ISSUE C) 28 LEAD WIDE BODY SMALL OUTLINE PLASTIC PACKAGE N INDEX AREA H 0.25(0.010) M B M INCHES E SYMBOL -B- 1 2 3 L SEATING PLANE -A- h x 45o A D -C- e
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MS-013-AE
5M-1982.
28 MS-013 Package
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28 MS-013 Package
Abstract: MS-013-AE
Text: Plastic Package Small Outline Plastic Package SOIC M28.3 (JEDEC MS-013-AE ISSUE C) 28 LEAD WIDE BODY SMALL OUTLINE PLASTIC PACKAGE N INDEX AREA H 0.25(0.010) M B M INCHES E SYMBOL -B1 2 3 L SEATING PLANE -A- h x 45o A D -C- e A1 B 0.25(0.010) M C 0.10(0.004)
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MS-013-AE
28 MS-013 Package
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IR2110 application note
Abstract: IR2101 full bridge IR2113 APPLICATION NOTE h bridge ir2110 full bridge ir2110 Full-bridge IR2110 IR2112 application note IR2104 APPLICATION NOTE h bridge ir2113 ballast Self-Oscillating
Text: International Rectifier Control IC Navigator Function Features Voltage Offset 8 Lead DIP 14 Lead DIP 14 Lead DIP w/o leads 4 & 5 16 Lead DIP w/o leads 4 & 5 28 Lead DIP 9 Pin SIP w/o leads 5&7 8 Lead SOIC Narrow Body Basic 600 IR2117 G IR2118 (G) IR2117S (G)
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IR2117
IR2118
IR2117S
IR2118S
IR2127
IR2128
IR2127S
IR2128S
IR2121
IR2125
IR2110 application note
IR2101 full bridge
IR2113 APPLICATION NOTE
h bridge ir2110
full bridge ir2110
Full-bridge IR2110
IR2112 application note
IR2104 APPLICATION NOTE
h bridge ir2113
ballast Self-Oscillating
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Ablestik 8290
Abstract: C194 G600 MS-013 Amkor Wafer level mold compound PPF leadframe
Text: LEADFRAME data sheet SOIC Features: Small Outline IC Packages: Amkor has a broad portfolio of Small Outline ICs SOIC packages, including .150", .208" and .300" body sizes. Statistically controlled and refined assembly processes coupled with very high quality materials assure the best
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MS-013
MS-019
Ablestik 8290
C194
G600
MS-013
Amkor Wafer level mold compound
PPF leadframe
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ir2110
Abstract: ir2110 application AN IR2110 IR2112 IR2112-2 IR2110-2 IR4427 IC IR2110S IR2186S IR3220S
Text: International Rectifier Automotive IC Navigator MOSFET GATE DRIVERS 8 Lead SOIC Narrow Body 14 Lead SOIC Narrow Body 16 Lead SOIC Wide Body Features Voltage Offset 8 Lead DIP Dual Low Side b a si c n/a IR4426 IR4427 IR4428 IR4426S IR4427S IR4428S High Side
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IR4426
IR4427
IR4428
IR4426S
IR4427S
IR4428S
IR21271
IR21271S
IR2181
IR2186
ir2110
ir2110 application
AN IR2110
IR2112
IR2112-2
IR2110-2
IR4427
IC IR2110S
IR2186S
IR3220S
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Untitled
Abstract: No abstract text available
Text: DIP to SOIC Adapter Modules ACCUTEK MICROCIRCUIT CORPORATION DIP to SOIC ADAPTER MODULES ELIMINATE THE NEED TO REDESIGN MOTHERBOARDS OR MAY BE USED FOR BREADBOARD PROTOTYPING DESCRIPTION The Accutek SOIC family of Adapter Modules permit the connection of older Dual-Inline-Packages onto circuit board sites which are designed for standard pitch SOIC devices.
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AK32WSOIC-D600S
AK32WSOIC-D600
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Untitled
Abstract: No abstract text available
Text: ACCUTEK Wide SOIC to Narrow SOIC Adapter Modules MICROCIRCUIT CORPORATION SOIC ADAPTER MODULES ELIMINATE THE NEED TO REDESIGN MOTHERBOARDS OR MAY BE USED FOR BREADBOARD PROTOTYPING DESCRIPTION The Accutek family of SOIC Adapter Modules permit the connection
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AK24SW-SN
AK20SW-SN
AK28SW-SN
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Untitled
Abstract: No abstract text available
Text: Wide SOIC to Narrow SOIC Adapter Modules ACCUTEK MICROCIRCUIT CORPORATION SOIC ADAPTER MODULES ELIMINATE THE NEED TO REDESIGN MOTHERBOARDS OR MAY BE USED FOR BREADBOARD PROTOTYPING DESCRIPTION The Accutek family of SOIC Adapter Modules permit the connection
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AK24SW-SN
AK20SW-SN
AK28SW-SN
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qsop 16 pcb footprint
Abstract: qsop 24 footprint 16 QSOP pcb footprint 16 soic pcb footprint qsop 20 pcb footprint footprint soic AKB163237 AKL163220 footprint soic 20 AKB203237
Text: Accutek Microcircuit Corporation SOIC Adapter Modules SOIC ADAPTER MODULES ELIMINATE THE NEED TO REDESIGN MOTHERBOARDS OR MAY BE USED FOR BREADBOARD PROTOTYPING DESCRIPTION The Accutek SOIC family of Adapter Modules permit the connection of smaller fine pitch TSOP and SSOP packages onto circuit board
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AKL203237
AKL243237
AKL143227
AKL143220
AKL083220
AKL283237
qsop 16 pcb footprint
qsop 24 footprint
16 QSOP pcb footprint
16 soic pcb footprint
qsop 20 pcb footprint
footprint soic
AKB163237
AKL163220
footprint soic 20
AKB203237
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dram zip
Abstract: Z03 Series AK14Z-N AK16Z-N AK16Z-W AK20Z-N AK20Z-W AK24Z-W AK28Z-W
Text: Accutek Microcircuit Corporation ZIP Adapter Modules DESCRIPTION FEATURES The Accutek family of ZIP Adapter Modules is designed to convert any digital integrated circuit in SOIC package to side-mounted ZIP modules. The Accutek ZIP Modules can be used to save space on thru-hole boards or replace
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AK5464Z
AK20Z-SOJ
AK20Z-QSOP-WPC
AK20ZD-SOIC-WPC
AK20Z-SOIC-WPC
dram zip
Z03 Series
AK14Z-N
AK16Z-N
AK16Z-W
AK20Z-N
AK20Z-W
AK24Z-W
AK28Z-W
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AK14Z-N
Abstract: AK16Z-N AK16Z-W AK20Z-N AK20Z-QSOP AK20Z-QSOP-LH AK20Z-QSOP-WPC AK20Z-SOIC-WPC AK20Z-SOJ AK20Z-W
Text: ACCUTEK ZIP Adapter Modules MICROCIRCUIT CORPORATION DESCRIPTION FEATURES The Accutek family of ZIP Adapter Modules is designed to convert any digital integrated circuit in SOIC package to side-mounted ZIP modules. The Accutek ZIP Modules can be used to save space on thru-hole boards or replace
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AK5464Z
AK20Z-SOJ
AK20Z-QSOP-WPC
AK20ZD-SOIC-WPC
AK20Z-SOIC-WPC
AK14Z-N
AK16Z-N
AK16Z-W
AK20Z-N
AK20Z-QSOP
AK20Z-QSOP-LH
AK20Z-QSOP-WPC
AK20Z-SOIC-WPC
AK20Z-SOJ
AK20Z-W
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Untitled
Abstract: No abstract text available
Text: ZIP Adapter Modules ACCUTEK MICROCIRCUIT CORPORATION DESCRIPTION FEATURES The Accutek family of ZIP Adapter Modules is designed to convert any digital integrated circuit in SOIC package to side-mounted ZIP modules. The Accutek ZIP Modules can be used to save space on thru-hole boards or replace
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AK20ZD-QSOP-WPC
AK20Z-QSOP-WPC
AK5464Z
AK20Z-SOJ
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soic 28 wide body
Abstract: 28 MS-013 Package MS-013
Text: 300 mil Wide Body SOIC SYMBOL A A1 A2 B C D E e H h L N α In Millimeters COMMON DIMENSIONS MIN MAX -2.65 0.10 -2.05 2.55 0.33 0.51 0.18 0.32 SEE VARIATIONS 7.40 7.60 1.27 BASIC 10.00 10.65 0.25 0.75 0.40 1.27 SEE VARIATIONS 0° 8° In Inches* COMMON DIMENSIONS
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MS-013,
MS-119
soic 28 wide body
28 MS-013 Package
MS-013
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DIMENSIONS soic 28
Abstract: 40 PIN CERDIP ADM231
Text: 5 V-Powered CMOS RS-232 Drivers/Receivers ADM231L–ADM234L/ADM236L–ADM241L FEATURES ADM236L TYPICAL OPERATING CIRCUIT Single 5 V power supply Meets all EIA-232-E and V.28 specifications 120 kbps data rate On-board dc-to-dc converters ±9 V output swing with 5 V supply
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RS-232
ADM231L
ADM234L/ADM236L
ADM241L
EIA-232-E
ADM236L
interface/rs-232/adm241l/products/product
07-Sep-2010
DIMENSIONS soic 28
40 PIN CERDIP
ADM231
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MS-013-AE
Abstract: 751F-01 soic 28 wide body
Text: F R E E S C A L E SEMICONDUCTOR, A L L RIG H TS RESERVED. TITLE: SOIC. INC. WIDE BODY. 28 L E A D C A S E O U T L I NE MECHANICAL OUTLINE P R IN T VERSIO N NOT TO S C A LE DOCUMENT NO: 9 8 A S B 4 2 3 4 5 B REV: G CASE NUMBER: 7 5 1 F - 0 5 10 MAR 2005
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98ASB42345B
751F-05
MS-013AE
5M-1994.
751F-05
MS-013-AE
751F-01
soic 28 wide body
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40-pin EPROM pinout
Abstract: lcc 28 socket AD303 uPD78P138GF 28C513 32 pin plcc socket to dil AD-303 hitachi h8 DIL 28 32 plcc 8751 EPROM
Text: tmcnra I ul li I T - | J [ j p ELECTRONICS PACKAGE CONVERTERS FOR USE WITH PROGRAMMERS □ Increase the versatility of your programming system with our economical solutions MQP Electronics manufacture a complete range of package converters for use with device programming equipment.
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S2000
H8/534
H8/536
UPD78P138GF
87C751
87C752
87C552
40-pin EPROM pinout
lcc 28 socket
AD303
28C513
32 pin plcc socket to dil
AD-303
hitachi h8
DIL 28 32 plcc
8751 EPROM
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