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    SOIC 16 JEDEC PACKAGE OUTLINE Search Results

    SOIC 16 JEDEC PACKAGE OUTLINE Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    TPH9R00CQH Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 150 V, 64 A, 0.009 Ohm@10V, SOP Advance / SOP Advance(N) Visit Toshiba Electronic Devices & Storage Corporation
    TPH2R408QM Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 80 V, 120 A, 0.00243 Ohm@10V, SOP Advance Visit Toshiba Electronic Devices & Storage Corporation
    XPH2R106NC Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 60 V, 110 A, 0.0021 Ω@10V, SOP Advance(WF) Visit Toshiba Electronic Devices & Storage Corporation
    XPH3R206NC Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 60 V, 70 A, 0.0032 Ω@10V, SOP Advance(WF) Visit Toshiba Electronic Devices & Storage Corporation
    TPH4R008QM Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 80 V, 86 A, 0.004 Ohm@10V, SOP Advance(N) Visit Toshiba Electronic Devices & Storage Corporation

    SOIC 16 JEDEC PACKAGE OUTLINE Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    MS-012 soic 16

    Abstract: MS-012 M16A jedec MS-012 soic 16 Jedec package outline
    Text: Revised January 1999 Package M16A 16-Lead Small Outline Integrated Circuit SOIC , JEDEC MS-012, 0.150” Narrow Package Number M16A 1999 Fairchild Semiconductor Corporation m16a.prf www.fairchildsemi.com Package M16A January 1999


    Original     		PDF 16-Lead MS-012, MS-012 soic 16 MS-012 M16A jedec MS-012 soic 16 Jedec package outline

    soic 16 Jedec package outline

    Abstract: jedec MS-013 MS-013 M16B
    Text: Revised January 1999 Package M16B 16-Lead Small Outline Intergrated Circuit SOIC , JEDEC MS-013, 0.300” Wide Package Number M16B 1999 Fairchild Semiconductor Corporation m16b.prf www.fairchildsemi.com Package M16B January 1999


    Original     		PDF 16-Lead MS-013, soic 16 Jedec package outline jedec MS-013 MS-013 M16B

    74S133

    Abstract: DM74S133 DM74S133M DM74S133N M16A MS-001 N16E 13-INPUT
    Text: Revised April 2000 DM74S133 13-Input NAND Gate General Description This device contains a single gate which performs the logic NAND function. Ordering Code: Order Number Package Number Package Description DM74S133M M16A 16-Lead Small Outline Integrated Circuit SOIC , JEDEC MS-012, 0.150 Narrow


    Original     		PDF DM74S133 13-Input DM74S133M 16-Lead MS-012, DM74S133N MS-001, 74S133 DM74S133 DM74S133M DM74S133N M16A MS-001 N16E

    1256A-12

    Abstract: 8 pin 393 atmel 0420
    Text: Package Drawing 16S2, 16-lead, 0.300" Wide, Plastic Gull Wing Small Outline JEDEC SOIC Dimensions in Inches and (Millimeters) 0.020 (0.508) 0.013 (0.330) 0.299 (7.60) 0.291 (7.39) PIN 1 0.420 (10.7) 0.393 (9.98) 0.050 (1.27) BSC 0.394 (10.00) 0.386 (09.80)


    Original     		PDF 16-lead, 1256A-12 8 pin 393 atmel 0420

    16s1

    Abstract: No abstract text available
    Text: Package Drawing 16S1, 16-lead, 0.150" Wide, Plastic Gull Wing Small Outline JEDEC SOIC Dimensions in Inches and (Millimeters) 0.020 (0.51) 0.013 (0.33) 0.158 (4.00) 0.150 (3.80) PIN 1 0.244 (6.20) 0.228 (5.80) .050 (1.27) BSC 0.394 (10.00) 0.386 (09.80)


    Original     		PDF 16-lead, 16s1

    jedec MS-012-AC

    Abstract: MS-012-AC
    Text: Plastic Package Small Outline Plastic Package SOIC M16.15 (JEDEC MS-012-AC ISSUE C) N 16 LEAD NARROW BODY SMALL OUTLINE PLASTIC PACKAGE INDEX AREA H 0.25(0.010) M B M INCHES E SYMBOL -B1 2 3 L SEATING PLANE -A- h x 45o A D -C- e A1 B 0.25(0.010) M C 0.10(0.004)


    Original     		PDF MS-012-AC jedec MS-012-AC

    MS-013-AA

    Abstract: No abstract text available
    Text: Plastic Package Small Outline Plastic Package SOIC M16.3 (JEDEC MS-013-AA ISSUE C) 16 LEAD WIDE BODY SMALL OUTLINE PLASTIC PACKAGE N INDEX AREA H 0.25(0.010) M B M INCHES E SYMBOL -B1 2 3 L SEATING PLANE -A- h x 45o A D -C- e A1 B 0.25(0.010) M C 0.10(0.004)


    Original     		PDF MS-013-AA

    jedec MS-013

    Abstract: MS-013-AA
    Text: Plastic Packages for Integrated Circuits Small Outline Plastic Packages SOIC M16.3 (JEDEC MS-013-AA ISSUE C) 16 LEAD WIDE BODY SMALL OUTLINE PLASTIC PACKAGE N INDEX AREA H 0.25(0.010) M B M INCHES E -B1 2 3 L SEATING PLANE -A- A D hx -CA1 B C 0.10(0.004)


    Original     		PDF MS-013-AA 5M-1982. jedec MS-013

    jedec MS-012-AC

    Abstract: MS-012-AC
    Text: Plastic Packages for Integrated Circuits Small Outline Plastic Packages SOIC M16.15 (JEDEC MS-012-AC ISSUE C) N INDEX AREA H 0.25(0.010) M 16 LEAD NARROW BODY SMALL OUTLINE PLASTIC PACKAGE B M E INCHES -B- 1 2 SYMBOL 3 L SEATING PLANE -A- h x 45o A D -C-


    Original     		PDF MS-012-AC 5M-1982. jedec MS-012-AC

    jedec MS-012-AC

    Abstract: MS-012-AC MS-012AC
    Text: Plastic Packages for Integrated Circuits Small Outline Plastic Packages SOIC M16.15 (JEDEC MS-012-AC ISSUE C) N INDEX AREA H 0.25(0.010) M 16 LEAD NARROW BODY SMALL OUTLINE PLASTIC PACKAGE B M INCHES E -B- 1 2 3 L SEATING PLANE -A- A D h x 45° -C- e A1


    Original     		PDF MS-012-AC jedec MS-012-AC MS-012AC

    MS-013-AA

    Abstract: No abstract text available
    Text: Plastic Packages for Integrated Circuits Small Outline Plastic Packages SOIC M16.3 (JEDEC MS-013-AA ISSUE C) N INDEX AREA 16 LEAD WIDE BODY SMALL OUTLINE PLASTIC PACKAGE H 0.25(0.010) M B M INCHES E -B- 1 2 3 L SEATING PLANE -A- A D h x 45° -C- e A1 B 0.25(0.010) M


    Original     		PDF MS-013-AA

    98ARL10519D

    Abstract: JESD51-5 JEDEC JESD51-8 BGA AN2409 JESD51-7 JESD51-51 jesd51 8 54ld JESD51-8
    Text: Freescale Semiconductor Application Note AN2409 Rev. 1.0, 12/2005 Small Outline Integrated Circuit Fine Pitch Package SOIC 1.0 Purpose This Application Note provides general package information including package dimensions, guidelines for printed circuit board (PCB) layout,


    Original     		PDF AN2409 98ARL10519D JESD51-5 JEDEC JESD51-8 BGA AN2409 JESD51-7 JESD51-51 jesd51 8 54ld JESD51-8

    Untitled

    Abstract: No abstract text available
    Text: Freescale Semiconductor Application Note AN2409 Rev. 2.0, 4/2013 Small Outline Integrated Circuit Fine Pitch Package SOIC 1.0 Purpose This Application Note provides general package information including package dimensions, guidelines for printed circuit board (PCB) layout,


    Original     		PDF AN2409

    MTTF analysis data

    Abstract: JEDEC JESD51-8 BGA 98ARL10519D JESD51-51 QFN PACKAGE thermal resistance JESD51-5 JESD51-7 jesd51 8 1147 x motorola SOICW-32
    Text: Freescale Semiconductor, Inc. Application Note AN2409/D Rev. 0, 01/2003 Small Outline Integrated Circuit-Fine Pitch Package SOIC Freescale Semiconductor, Inc. CONTENTS 1.0 PURPOSE 3 2.0 SCOPE 3 3.0 SOIC PACKAGE 3 3.1 PACKAGE DESCRIPTION 3 3.2 PACKAGE DIMENSION


    Original     		PDF AN2409/D MTTF analysis data JEDEC JESD51-8 BGA 98ARL10519D JESD51-51 QFN PACKAGE thermal resistance JESD51-5 JESD51-7 jesd51 8 1147 x motorola SOICW-32

    Untitled

    Abstract: No abstract text available
    Text: Data Sheet LEADFRAME ExposedPad TSSOP/MSOP/SOIC/SSOP Thermal Performance Forced Convection, Single-layer PCB ExposedPad Thin Shrink Small Outline Package TSSOP , Micro Small Outline Package (MSOP), Small Outline IC Package (SOIC), Shrink Small Outline (SSOP)


    Original     		PDF DS571J

    footprint jedec MS-026 TQFP AEB

    Abstract: footprint jedec MS-026 LQFP jedec mo-142 footprint 13-2L footprint jedec MS-026 TQFP 48C1 28P6 JEDEC MS-026 footprint
    Text: Each Atmel datasheet includes an Ordering Information Section which specifies the package types available. This section provides size specifications and outlines for all package types. 1 Package Description See Page 32A 32-lead, Low-profile (1.4 mm) Plastic Quad Flat Package (LQFP) . .5


    Original     		PDF 32-lead, 44-lead, 48-lead, 64-lead 100-lead, 144-lead, 24-lead, 20-lead, footprint jedec MS-026 TQFP AEB footprint jedec MS-026 LQFP jedec mo-142 footprint 13-2L footprint jedec MS-026 TQFP 48C1 28P6 JEDEC MS-026 footprint

    Untitled

    Abstract: No abstract text available
    Text: Data sheet acquired from Harris Semiconductor SCHS040D − Revised October 2003 The CD4042B types are supplied in 16-lead hermetic dual-in-line ceramic packages F3A suffixes , 16-lead dual-in-line plastic package (E suffix), 16-lead small-outline packages (D, DR, DT, DW, DWR, and NSR


    Original     		PDF SCHS040D CD4042B 16-lead 11-Nov-2009 CD4042BD CD4042BDE4 CD4042BDG4

    Untitled

    Abstract: No abstract text available
    Text: Data sheet acquired from Harris Semiconductor SCHS040D − Revised October 2003 The CD4042B types are supplied in 16-lead hermetic dual-in-line ceramic packages F3A suffixes , 16-lead dual-in-line plastic package (E suffix), 16-lead small-outline packages (D, DR, DT, DW, DWR, and NSR


    Original     		PDF SCHS040D CD4042B 16-lead 11-Nov-2009 CD4042BD CD4042BDE4 CD4042BDG4

    CD4014B

    Abstract: CD4014BE CD4014BEE4 CD4014BF3A CD4014BM CD4014BM96 CD4014BM96E4 CD4014BM96G4 CD4014BME4 CD4014BMG4
    Text: Data sheet acquired from Harris Semiconductor SCHS024C − Revised October 2003 The CD4014B and CD4021b series types are supplied in 16-lead hermetic dual-in-line ceramic packages F3A suffix , 16-lead dual-in-line plastic packages (E suffix), 16-lead small-outline packages (M, M96, MT, and NSR


    Original     		PDF SCHS024C CD4014B CD4021b 16-lead 16-lead 12-Jan-2010 CD4014BE CD4014BEE4 CD4014BE CD4014BEE4 CD4014BF3A CD4014BM CD4014BM96 CD4014BM96E4 CD4014BM96G4 CD4014BME4 CD4014BMG4

    CD4043BEE4

    Abstract: No abstract text available
    Text: Data sheet acquired from Harris Semiconductor SCHS041D − Revised October 2003 The CD4043B and CD4044B types are supplied in 16-lead hermetic dual-in-line ceramic packages F3A suffix , 16-lead dual-in-line plastic packages (E suffix), 16-lead small-outline packages (D, DR, DT, DW, DWR,


    Original     		PDF SCHS041D CD4043B CD4044B 16-lead 11-Nov-2009 CD4043BD CD4043BDE4 CD4043BEE4

    CD4014B

    Abstract: CD4014BE CD4014BEE4 CD4014BF3A CD4014BM CD4014BM96 CD4014BM96E4 CD4014BM96G4 CD4014BME4 CD4014BMG4
    Text: Data sheet acquired from Harris Semiconductor SCHS024C − Revised October 2003 The CD4014B and CD4021b series types are supplied in 16-lead hermetic dual-in-line ceramic packages F3A suffix , 16-lead dual-in-line plastic packages (E suffix), 16-lead small-outline packages (M, M96, MT, and NSR


    Original     		PDF SCHS024C CD4014B CD4021b 16-lead 16-lead 12-Jan-2010 CD4014BE CD4014BEE4 CD4014BE CD4014BEE4 CD4014BF3A CD4014BM CD4014BM96 CD4014BM96E4 CD4014BM96G4 CD4014BME4 CD4014BMG4

    LD128

    Abstract: PPF leadframe
    Text: LEADFRAME data sheet SOIC Features Small Outline IC Package SOIC : SOIC is a leadframe based, plastic encapsulated package that is well suited for applications requiring optimum performance in IC packaging. This industry standard package runs in very high volume and


    Original     		PDF MS-013 MO-119 LD128 PPF leadframe

    footprint jedec MS-026 TQFP

    Abstract: atmel 0328 PQFP chip size CERAMIC LEADLESS CHIP CARRIER 68 MS-026-AED ATMEL 740 64 CERAMIC LEADLESS CHIP CARRIER LCC 8 lead side brazed ATMEL 342 atmel 545
    Text: Each Atmel datasheet includes an Ordering Information Section which specifies the package types available. This section provides size specifications and outlines for all package types. 1 Package Description See Page 32A 32-lead, Low-profile (1.4 mm) Plastic Quad Flat


    Original     		PDF 32-lead, 44-lead, 48-lead, 64-lead 100-lead, 0555D 11/99/xM footprint jedec MS-026 TQFP atmel 0328 PQFP chip size CERAMIC LEADLESS CHIP CARRIER 68 MS-026-AED ATMEL 740 64 CERAMIC LEADLESS CHIP CARRIER LCC 8 lead side brazed ATMEL 342 atmel 545

    Untitled

    Abstract: No abstract text available
    Text: PACKAGE soie DIAGRAM OUTLINES PACKAGE DIAGRAM OUTLINES SOIC C o n t i n u e d REVISIONS DWG § NOM N MAX T E S 0 18- -1 DWG § JEDEC VARIATION □ AA MIN DWG § S016- JEDEC VARIATION □ AB MIN NOM MAX S020- 2 JEDEC VARIATION T E NOM MAX T E S024- 2 NOM


    OCR Scan     		PDF S016N M0-059, -330T