schematics for a PA amplifier
Abstract: TQM613025 design of multi section directional coupler TQM613026 qualcomm rft
Text: TQM613026 Application Note Application Note for TQM613026 Power Amplifier-Duplexer Product TQM613026 TABLE OF CONTENTS • 1.0 Description • 2.0 Product Block Diagram and Operation • 3.0 Recommended Handset Schematic and Layout Considerations • 3.1 DC Block Recommendations
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TQM613026
TQM613026
schematics for a PA amplifier
TQM613025
design of multi section directional coupler
qualcomm rft
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jedec package MO-247
Abstract: qfn 88 stencil QN180 IEC-68-2-32 QFN PCB Layout guide QN108 Amkor TSCSP qfn 32 land pattern IPC-TM-650 2.6.9 QN180 outline
Text: Application Note AC322 Assembly and PCB Layout Guidelines for QFN Packages Introduction The dual-row or multi-row QFN package is a near Chip Scale, plastic-encapsulated package with a copper leadframe substrate. The exposed die attach paddle on the bottom efficiently conducts heat to the PCB
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AC322
jedec package MO-247
qfn 88 stencil
QN180
IEC-68-2-32
QFN PCB Layout guide
QN108
Amkor TSCSP
qfn 32 land pattern
IPC-TM-650 2.6.9
QN180 outline
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Untitled
Abstract: No abstract text available
Text: Freescale Semiconductor Application Note AN3964 Rev. 2.0, 4/2013 MC13892 Layout Guidelines 1 Purpose This document is intended to show good practices on how to layout the MC13892 PCB for a correct functionality of the whole system. 2 Scope This document contains the packaging and recommended
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AN3964
MC13892
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AN3964
Abstract: battery drill charger MC13892JVK 500E9 MC13892 MC13892VK MC13892VL CLK32KM
Text: Freescale Semiconductor Application Note AN3964 Rev. 1.0, 3/2010 MC13892 Layout Guidelines By: Jorge Ramirez 1 Purpose This document is intended to show good practices on how to layout the MC13892 PCB for a correct functionality of the whole system. 2 Scope
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AN3964
MC13892
AN3964
battery drill charger
MC13892JVK
500E9
MC13892VK
MC13892VL
CLK32KM
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IBM 750L
Abstract: 750FX PowerPC 750FX IBM750FX Signal Path designer
Text: Application Note PowerPC 750FX Power Supply Layout and Bypassing Abstract This Note describes power and ground connectivity, and bypass capacitor selection and placement, for the IBM 750FX microprocessor. Proper selection and placement of the power supply bypass caps is critical for the correct operation of
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750FX
750FX
IBM 750L
PowerPC 750FX
IBM750FX
Signal Path designer
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fbga Substrate design guidelines
Abstract: CS281 ACTEL FBGA PACKAGE DRAWING AC243 CS81 fine BGA thermal profile pcb thermal Design guide pcb trace fbga PCB footprint thermal pcb guidelines MO-195
Text: Application Note AC243 Assembly and PCB Layout Guidelines for Chip-Scale Packages Introduction The Chip-Scale Package CSP is a dual- or multi-layer plastic encapsulated BT-Epoxy type substrate with copper signal and plain layers. The small form factor allows for enhanced conduction of heat to the PCB
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AC243
fbga Substrate design guidelines
CS281
ACTEL FBGA PACKAGE DRAWING
AC243
CS81
fine BGA thermal profile
pcb thermal Design guide pcb trace
fbga PCB footprint
thermal pcb guidelines
MO-195
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capacitive level sensor
Abstract: capacitive touch sensor pcb guideline finger print using labview capacitive touch slider Capacitive PCB capacitive touch sensor labview 3M Touch Systems Capacitive Guidelines touch switch with pcb layout finger print sensor pcb with circuit
Text: AN 19.16 Physical Design and Layout Guidelines for Capacitive Sensor Systems 1 Overview SMSC’s capacitive sensor family provides systems with a wide variety of slider, button, and LED driver functionality. This application note describes design and printed circuit board PCB layout techniques
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84-1LMI
Abstract: XP1018 XU1004
Text: 35.0-45.0 GHz GaAs MMIC Power Amplifier P1018 October 2005 - Rev 21-Oct-05 Features Chip Device Layout Excellent Transmit Output Stage Output Power Adjust 23.0 dB Small Signal Gain +25.0 dBm P1dB Compression Point 100% On-Wafer RF, DC and Output Power Testing
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P1018
21-Oct-05
MIL-STD-883
84-1LMI
XP1018
XU1004
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s2083
Abstract: qfn 32 5x5 STENCIL rf 4 mm PQFN s2083 application PQFN jedec package MO-220 32 5x5 qfn 3X3 land pattern PDFN STQFN-14 MO-220
Text: Application Note S2083 Surface Mount Instructions for QFN / DFN Packages Rev. V9 Introduction Via Design The layout of the surface mount board plays a critical role in product design and must be done properly to achieve the intended performance of an integrated circuit. An accurate PCB pad and solder
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S2083
s2083
qfn 32 5x5 STENCIL
rf 4 mm PQFN
s2083 application
PQFN
jedec package MO-220 32 5x5
qfn 3X3 land pattern
PDFN
STQFN-14
MO-220
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p950003
Abstract: aasupreme ESMIT 4180 aasupreme P950003 73M1906 73M1966B tg-utb01543s 4181 sumida 73M1916-20 UTB01543S
Text: A Maxim Integrated Products Brand 73M1866B/73M1966B MicroDAA with PCM Highway APPLICATION NOTE AN_1x66B_003 October 2009 73M1866B/73M1966B Schematic and Layout Guidelines Introduction This application note provides layout recommendations that must be followed when integrating the 73M1866B
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73M1866B/73M1966B
73M1866B/73M1966B
73M1866B
73M1966B
73M1x66B
73M1866B
73M1966B.
p950003
aasupreme
ESMIT 4180
aasupreme P950003
73M1906
tg-utb01543s
4181 sumida
73M1916-20
UTB01543S
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84-1LMI
Abstract: P1017
Text: 30.0-36.0 GHz GaAs MMIC Power Amplifier P1017 September 2005 - Rev 01-Sep-05 Features Chip Device Layout Balanced Design Provides Good Input/Output Match On-Chip Temperature Compensated Output Power Detector 16.0 dB Small Signal Gain +33.0 dBm Third Order Intercept OIP3
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P1017
01-Sep-05
MIL-STD-883
84-1LMI
P1017
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P1017
Abstract: P1017-BD DM6030HK TS3332LD XP1017 XP1017-BD XP1017-BD-000V XP1017-BD-EV1 32H2BA0070
Text: 30.0-36.0 GHz GaAs MMIC Power Amplifier P1017-BD August 2007 - Rev 09-Aug-07 Features Chip Device Layout Balanced Design Provides Good Input/Output Match On-Chip Temperature Compensated Output Power Detector 16.0 dB Small Signal Gain +33.0 dBm Third Order Intercept OIP3
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P1017-BD
09-Aug-07
MIL-STD-883
XP1017-BD
XP1017-BD-000V
XP1017-BD-EV1
XP1017
P1017
P1017-BD
DM6030HK
TS3332LD
XP1017-BD
XP1017-BD-000V
XP1017-BD-EV1
32H2BA0070
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p1017
Abstract: No abstract text available
Text: 30.0-36.0 GHz GaAs MMIC Power Amplifier P1017 September 2005 - Rev 01-Sep-05 Features Chip Device Layout Balanced Design Provides Good Input/Output Match On-Chip Temperature Compensated Output Power Detector 16.0 dB Small Signal Gain +33.0 dBm Third Order Intercept OIP3
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01-Sep-05
P1017
MIL-STD-883
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s2083
Abstract: s2083 application jedec package MO-220 68 PQFN IPC-SM-782 M570 MO-220 S2082
Text: Surface Mount Instructions for PQFN Packages S2083 V5 Introduction The layout of the surface mount board plays a critical role in product design and must be done properly to achieve the intended performance of an integrated circuit. An accurate PCB pad and solder stencil
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S2083
s2083
s2083 application
jedec package MO-220 68
PQFN
IPC-SM-782
M570
MO-220
S2082
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PCB layout guidelines for NXP MCUs in BGA packages
Abstract: LBGA256 AN10778 LPC2468 reflow solder profile land pattern for TSOP 2 54 pin NXP lpc LPC175x LFBGA256 lpc433x TSOP 54 land pattern
Text: AN10778 PCB layout guidelines for NXP MCUs in BGA packages Rev. 2 — 15 April 2011 Application note Document information Info Content Keywords LPC175x, LPC176x, LPC177x, LPC178x, LPC181x, LPC182x, LPC183x, LPC185x, LPC431x, LPC432x, LPC433x, LPC435x, LPC2220, LPC2292,
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AN10778
LPC175x,
LPC176x,
LPC177x,
LPC178x,
LPC181x,
LPC182x,
LPC183x,
LPC185x,
LPC431x,
PCB layout guidelines for NXP MCUs in BGA packages
LBGA256
AN10778
LPC2468 reflow solder profile
land pattern for TSOP 2 54 pin
NXP lpc
LPC175x
LFBGA256
lpc433x
TSOP 54 land pattern
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LPC2468 reflow solder profile
Abstract: 0.65mm pitch BGA 1mm pitch BGA AN10778 MO-275 TFBGA208 LFBGA32 LPC2468 pcb SOT1018-1 nxp cross
Text: AN10778 PCB layout guidelines for NXP MCUs in BGA packages Rev. 01 — 22 January 2009 Application note Document information Info Content Keywords LPC2220, LPC2292, LPC2364, LPC2368, LPC2458, LPC2468, LPC2470, LPC2478, LPC2880, LPC2888, LPC3130, LPC3131, LPC3151, LPC3152, LPC3153, LPC3154, LPC3180/10, LPC3220,
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AN10778
LPC2220,
LPC2292,
LPC2364,
LPC2368,
LPC2458,
LPC2468,
LPC2470,
LPC2478,
LPC2880,
LPC2468 reflow solder profile
0.65mm pitch BGA
1mm pitch BGA
AN10778
MO-275
TFBGA208
LFBGA32
LPC2468 pcb
SOT1018-1
nxp cross
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0.65mm pitch BGA
Abstract: OMAP35x
Text: Application Report SPRAAV6B – June 2008 OMAP35x 0.65mm Pitch Layout Methods Keven Coates . ABSTRACT It is easy to see from the unique look that the OMAP35x parts have a very unusual
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OMAP35x
0.65mm pitch BGA
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AN10373
Abstract: pci pcb layout
Text: AN10373 PCI Express PHY PCB Layout Guideline Rev. 01 — 30 April 2005 Application note Document information Info Content Keywords pcb, layout, symmetry, loss, jitter Abstract This document provides a practical guideline for incorporating the PCI Express PHY IC layout into the PCB design.
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AN10373
AN10373
pci pcb layout
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AN111
Abstract: scotchbrite eraser APP1110 dremel
Text: Maxim > App Notes > GENERAL ENGINEERING TOPICS PROTOTYPING AND PC BOARD LAYOUT Keywords: PCB, circuit board, prototype Jun 14, 2002 APPLICATION NOTE 1110 Prototyping with Surface Mount Devices Abstract: Surface mount devices can often be prototyped without etched PCBs by using plain copperclad and
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com/an1110
AN1110,
APP1110,
Appnote1110,
AN111
scotchbrite
eraser
APP1110
dremel
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M1000
Abstract: 40BRFM0058 mmic MIXER 210 84-1LMI XM1000
Text: 32.0-46.0 GHz GaAs MMIC Balanced Mixer November 2005 - Rev 21-Nov-05 M1000 Features Chip Device Layout Fundamental Balanced Mixer 7.0 dB Conversion Loss +24 dBm Input Third Order Intercept 100% On-Wafer RF Testing 100% Visual Inspection to MIL-STD-883 Method 2010
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21-Nov-05
M1000
MIL-STD-883
M1000
40BRFM0058
mmic MIXER 210
84-1LMI
XM1000
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Untitled
Abstract: No abstract text available
Text: MASW-011021 HMICTM Silicon PIN Diode SPDT Switch 6 - 14 GHz Features • Rev. V1 Die Bond Pad Layout Specified from 8 GHz to 12 GHz Low Insertion Loss High Isolation Low Parasitic Capacitance and Inductance
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MASW-011021
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M1000
Abstract: No abstract text available
Text: 32.0-46.0 GHz GaAs MMIC Balanced Mixer November 2005 - Rev 21-Nov-05 M1000 Features Chip Device Layout Fundamental Balanced Mixer 7.0 dB Conversion Loss +24 dBm Input Third Order Intercept 100% On-Wafer RF Testing 100% Visual Inspection to MIL-STD-883 Method 2010
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21-Nov-05
M1000
MIL-STD-883
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M1000
Abstract: No abstract text available
Text: 32.0-46.0 GHz GaAs MMIC Balanced Mixer August 2005 - Rev 04-Aug-05 M1000 Features Chip Device Layout Fundamental Balanced Mixer 7.0 dB Conversion Loss +24 dBm Input Third Order Intercept 100% On-Wafer RF Testing 100% Visual Inspection to MIL-STD-883 Method 2010
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04-Aug-05
M1000
MIL-STD-883
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M1000
Abstract: M1000/SUPER5-KIT/SCC
Text: 32.0-46.0 GHz GaAs MMIC Balanced Mixer April 2005 - Rev 30-Apr-05 M1000 Features Chip Device Layout Fundamental Balanced Mixer 7.0 dB Conversion Loss +24 dBm Input Third Order Intercept 100% On-Wafer RF Testing 100% Visual Inspection to MIL-STD-883 Method 2010
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30-Apr-05
M1000
MIL-STD-883
M1000
M1000/SUPER5-KIT/SCC
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