JEDEC J-STD-020d.1
Abstract: sac305 SAC305 reflow profile SAC305 solder paste sac305 kester SAC305 reflow Kester sn-pb-ag solder preform J-STD-020D SAC-305
Text: APPLICATION NOTE Solder Mounted Packaged Transistors Introduction This document is a supplement to Cree’s data sheet. It describes the recommended conditions under which Cree’s packaged transistors are to be soldered into amplifiers. Solder Temperatures Defined
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J-STD-020D
APPNOTE-007
JEDEC J-STD-020d.1
sac305
SAC305 reflow profile
SAC305 solder paste
sac305 kester
SAC305 reflow
Kester
sn-pb-ag solder preform
SAC-305
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sn-pb-ag solder preform
Abstract: sn-pb-ag solder preform data sheet AN1908 MRF19090S
Text: MOTOROLA Freescale Semiconductor, Inc. SEMICONDUCTOR APPLICATION NOTE Order this document by AN1908/D AN1908 Solder Mounting Method for the MRF19090S and Similar Packages Prepared by: Wendi Stemmons, Jerry Mason, Rich Wetz, Tom Woods, Mahesh Shah and David Runton
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AN1908/D
AN1908
MRF19090S
sn-pb-ag solder preform
sn-pb-ag solder preform data sheet
AN1908
MRF19090S
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AN1908
Abstract: MRF19090S
Text: MOTOROLA Order this document by AN1908/D SEMICONDUCTOR APPLICATION NOTE AN1908 Solder Mounting Method for the MRF19090S and Similar Packages Prepared by: Wendi Stemmons, Jerry Mason, Rich Wetz, Tom Woods, Mahesh Shah and David Runton INTRODUCTION The following document describes a solder mounting
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AN1908/D
AN1908
MRF19090S
AN1908
MRF19090S
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SN96
Abstract: No abstract text available
Text: AT C H I G H P O W E R R E S I S T I V E P R O D U C T S Attachment Recommendations to Ground Plane for Leaded and Flanged Resistors and Terminations Avoid introducing solder to the entire bond area prior to soldering, i.e. do not use a solder pre-form the same size as the entire resistor chip. Solder pre-form
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LMH6321TS
Abstract: 630540 3RD Rail Engineering
Text: Company URL for Additional Information http://www.national.com/quality/green/ National Semiconductor Contact Gerry Fields Title VP Quality Phone 1-408-721-8435 Part Number MSL Rating Peak Body Temp C MaxTime Sec Cycles 3 235 30 4 Weight (mg) Unit Type LMH6321TS
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LMH6321TS
9-Sep-2006
60676-86-0ult
LMH6321TS
630540
3RD Rail Engineering
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MRF286
Abstract: MRF286 Motorola AN1673 SOCKET HEAD CAP SCREWS
Text: MOTOROLA AN1673 Order this document by AN1673/D SEMICONDUCTOR APPLICATION NOTE AN1673 Solder Reflow Mounting Method for the MRF286 and Similar Packages Prepared by: Jeanne Pavio and Jerry Mason Motorola Semiconductor Products Sector MOUNTING METHOD DESIGN
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AN1673
AN1673/D
MRF286
MRF286,
MRF286
MRF286 Motorola
AN1673
SOCKET HEAD CAP SCREWS
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AN1907
Abstract: MRF9045MR1 TO270
Text: MOTOROLA Order this document by AN1907/D SEMICONDUCTOR APPLICATION NOTE AN1907 Surface Mount Solder Attach Method for the MRF9045MR1 in the TO-270 Plastic RF Package Prepared by: Wendi Stemmons, Jerry Mason, Rich Wetz, Tom Woods, Mahesh Shah and David Runton
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AN1907/D
AN1907
MRF9045MR1
O-270
AN1907
TO270
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TO-270
Abstract: Cu-194 AN1907 sn-pb-ag solder preform SOCKET HEAD CAP SCREWS the tom and jerry show MRF9045MR1 copper bond wire motorola MOTOROLA SEMICONDUCTOR
Text: MOTOROLA Freescale Semiconductor, Inc. SEMICONDUCTOR APPLICATION NOTE Order this document by AN1907/D AN1907 Surface Mount Solder Attach Method for the MRF9045MR1 in the TO-270 Plastic RF Package Freescale Semiconductor, Inc. Prepared by: Wendi Stemmons, Jerry Mason, Rich Wetz, Tom Woods, Mahesh Shah and David Runton
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AN1907/D
AN1907
MRF9045MR1
O-270
TO-270
Cu-194
AN1907
sn-pb-ag solder preform
SOCKET HEAD CAP SCREWS
the tom and jerry show
copper bond wire motorola
MOTOROLA SEMICONDUCTOR
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kds9
Abstract: kyocera 48 lead ceramic LCC package stk 0035 n PL0181 stk 014 IDK28F1 ntk 32 lcc package 14CA8 sk9173 JESD97
Text: Simtek Corporation Product Packaging Data This document is intended to provide Simtek customers with key information as outlined below for package types used for Simtek nvSRAM products. For additional information contact Simtek at appseng@simtek.com. For RoHS Materials
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Outlin420
5x10-8
75psig
PL0181
kds9
kyocera 48 lead ceramic LCC package
stk 0035 n
stk 014
IDK28F1
ntk 32 lcc package
14CA8
sk9173
JESD97
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Untitled
Abstract: No abstract text available
Text: High Power Resistive Products Resistors and Terminations: Mounting and Attachment Recommendations CHIP ATTACHMENT AND PC BOARD RECOMMENDATIONS For the mounting of chip or leaded devices, it is important to obtain a good solder joint between the device’s ground plane and
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SN63
Abstract: SN63 PB37 IPC-J-STD-006 sn63pb37 361F ingot
Text: Sn63/Pb37 ElectropureTM Solder Alloy Features: - High Purity - Reduces Drossing - Melting Temperature 183° C 361°F - Exceeds IPC-J-STD-006 Specifications Description: Sn63/Pb37 ElectropureTM is a high purity alloy that is composed of 63% tin and 37% lead. ElectropureTM is
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Sn63/Pb37
IPC-J-STD-006
Sn63/Pb37
ISO9001
45-micron
SN63
SN63 PB37
sn63pb37
361F
ingot
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AN1907
Abstract: MRF9045NR1 RF Power Devices
Text: Freescale Semiconductor Application Note AN1907 Rev. 1, 6/2006 Solder Reflow Attach Method for High Power RF Devices in Plastic Packages By: Wendi Stemmons, Jerry Mason, Rich Wetz, Tom Woods, Mahesh Shah and David Runton INTRODUCTION This application note describes a process to solder attach
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AN1907
AN1907
MRF9045NR1
RF Power Devices
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TS0300
Abstract: H20E TS0500 84-1LMI MIL-F-14256 TS050
Text: Application Note 005 Chip Device Mounting Instructions Page 1 of 4 Application Note #005 Chip Device Mounting Instructions All of the chip products in this catalog use thick film metallization for terminations — either platinum gold or platinum silver. Each material is used to accommodate the different bonding practices that are commonly used
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ECF564A
Abstract: H20E TS0300W3 TS0300 TS0500W3 diode wb1 84-1LMI MIL-F-14256 Ablestik 84-1LMI paste resistor thick film
Text: Application Note 006 Wrapped Chip Device Mounting Instructions Page 1 of 4 Application Note #006 Wrapped Chip Device Mounting Instructions This line of microwave attenuators is designed for surface mount and wraparound grounding applications. The W1 has a platinum gold wraparound ground with full back metallization and platinum gold input/output
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95Sn5Sb
Abstract: HP 3478A Copper Alloy C151 bts 2140 AN1907 C101 C102 C151 SAC305 ausi die attach
Text: Freescale Semiconductor Application Note AN1907 Rev. 3, 5/2009 Solder Reflow Attach Method for High Power RF Devices in Over - Molded Plastic Packages By: Keith Nelson, Quan Li, Lu Li, and Mahesh Shah INTRODUCTION TERMINOLOGY DEFINITIONS The purpose of this application note is to provide
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AN1907
95Sn5Sb
HP 3478A
Copper Alloy C151
bts 2140
AN1907
C101
C102
C151
SAC305
ausi die attach
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Untitled
Abstract: No abstract text available
Text: APPLICATION NOTE 002 - HYBRID COUPLER MOUNTING INSTRUCTIONS MOUNTING INSTRUCTIONS FOR PLANAR, PRETINNED AND EDGE CLIP STYLE COUPLERS This line of hybrid couplers is designed for surface mount applications using wrap-around metallization or edge clip leads. The planar style has
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Ablestik 84-1LMI
Abstract: mil-f-14256* rma h20E induction furnace circuit fiberglass laminate induction furnace circuit board
Text: APPLICATION NOTES APPLICATION NOTE 002 - HYBRID COUPLER MOUNTING INSTRUCTIONS MOUNTING INSTRUCTIONS FOR PLANAR, PRETINNED AND EDGE CLIP STYLE COUPLERS This line of hybrid couplers is designed for surface mount applications using wrap-around metallization or edge clip leads. The planar style has
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h20E
Abstract: induction furnace circuit induction furnace circuit board Ablestik 84-1LMI
Text: APPLICATION NOTES APPLICATION NOTE 002 - HYBRID COUPLER MOUNTING INSTRUCTIONS MOUNTING INSTRUCTIONS FOR PLANAR, PRETINNED AND EDGE CLIP STYLE COUPLERS This line of hybrid couplers is designed for surface mount applications using wrap-around metallization or edge clip leads. The planar style has
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ECF564A
Abstract: No abstract text available
Text: Technology A pplication Notes Chip Device Mounting Instructions A pplication N o te 003 Chip D evice Mounting Instructions All of the chip products in this catalog use thick film metallization for terminations - either platinum gold, gold, or platinum silver. Each material is used to accommodate the different bonding practices that are commonly used
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Ablestik 84-1LMI
Abstract: gold melting furnace 84-1LMI epoxy adhesive
Text: APPLICATION NOTES APPLICATION NOTE 005 - CHIP DEVICE MOUNTING INSTRUCTIONS All of the chip products in this catalog use thick film metallization for terminations — either platinum gold or platinum silver. Each material is used to accommodate the different bonding practices that are commonly used in RF and microwave applications. Some of these chips are offered with
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Untitled
Abstract: No abstract text available
Text: APPLICATION NOTE 005 - CHIP DEVICE MOUNTING INSTRUCTIONS All of the chip products in this catalog use thick film metallization for terminations — either platinum gold or platinum silver. Each material is used to accommodate the different bonding practices that are commonly used in RF and microwave applications. Some of these chips are offered with
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Untitled
Abstract: No abstract text available
Text: A pplication N ote 004 Wrapped Chip D evice M ounting Instructions This line of microwave attenuators is designed for surface mount and wraparound grounding applications. The W1 has a platinum gold wraparound ground with full back m etallization and platinum gold input / output terminations.
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84-1LMI epoxy adhesive
Abstract: TS0300W3 TS0500W3
Text: APPLICATION NOTES APPLICATION NOTE 006 - WRAPPED CHIP DEVICE MOUNTING INSTRUCTIONS This line of microwave attenuators is designed for surface mount and wrap-around grounding applications. The W1 has a platinum gold wrap around ground with full back metallization and platinum gold input/output terminations. The WB1 has a platinum gold wrap-around ground and
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5082 schottky
Abstract: 5082-0087 HP 5082-0024 5082-2713 HP 2835 5082-0097 node B 3206 5082-0024
Text: DE § 4 4 4 7 5 0 4 QDQSñlS S | ~ 4447584 H E WL E T T - P A C K A R D » 58G CMPNTS 02815 D - T - Ö HEW LETT PACKARD SCHOTTKY BARRIER CHIPS FOR HYBRID INTEGRATED CIRCUITS 5082-0009 5082-0013 5082-0023 5082-0024 5082-0029 5082-0031 5082-0041 7 - 0 7 5082-0057
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