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    SMT PROCESS Search Results

    SMT PROCESS Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    TMP89FS60AUG Toshiba Electronic Devices & Storage Corporation 8-bit Microcontroller/Processing Performance Equivalent to a 16-bit MCU/LQFP64-P-1010-0.50E Visit Toshiba Electronic Devices & Storage Corporation
    TMP89FS63AUG Toshiba Electronic Devices & Storage Corporation 8-bit Microcontroller/Processing Performance Equivalent to a 16-bit MCU/LQFP52-P-1010-0.65 Visit Toshiba Electronic Devices & Storage Corporation
    TMP89FS60BFG Toshiba Electronic Devices & Storage Corporation 8-bit Microcontroller/Processing Performance Equivalent to a 16-bit MCU/P-LQFP64-1414-0.80-002 Visit Toshiba Electronic Devices & Storage Corporation
    TMP89FS63BUG Toshiba Electronic Devices & Storage Corporation 8-bit Microcontroller/Processing Performance Equivalent to a 16-bit MCU/P-LQFP52-1010-0.65-002 Visit Toshiba Electronic Devices & Storage Corporation
    TMP89FS62AUG Toshiba Electronic Devices & Storage Corporation 8-bit Microcontroller/Processing Performance Equivalent to a 16-bit MCU/LQFP44-P-1010-0.80A Visit Toshiba Electronic Devices & Storage Corporation

    SMT PROCESS Datasheets Context Search

    Catalog Datasheet MFG & Type Document Tags PDF

    Weidmuller BLZ 5.08

    Abstract: pin header stand-off pin in paste 1-87682-0
    Text: Data Sheet • PCB Products 270° pin header for the SMT Process Omnimate Range 5.08 SL-SMT 5.08/270 GL Box / SL-SMT 5.08/270 GL SL-SMT 5.08/270 FL Box / SL-SMT 5.08/270 FL SL-SMT 5.08/270 GH Box / SL-SMT 5.08/270 GH SL-SMT 5.08/270 FH Box / SL-SMT 5.08/270 FH


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    PHAP3301

    Abstract: PHAP3355R tactile button 5mm PHAP3368 smt tact Switches PHAP3378 PHAP3372 phap33 U5550 PHAP3306
    Text: Selection guide Tact switches Series Page PHAP3390 PHAP3391 PHAP3380 PHAP3371 PHAP3372 PHAP3373 PHAP3374 PHAP3378 PHAP3361 PHAP3355 PHAP3366 PHAP3365 C3 C-5 C-6 C-7 C-9 C-10 C-10 C-11 Type SMT/Through hole SMT SMT SMT SMT SMT SMT SMT SMT Contact N.O. N.O.


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    PHAP3390 PHAP3391 PHAP3380 PHAP3371 PHAP3372 PHAP3373 PHAP3374 12VDC PHAP3378 PHAP3361 PHAP3301 PHAP3355R tactile button 5mm PHAP3368 smt tact Switches PHAP3378 phap33 U5550 PHAP3306 PDF

    2.54mm,SMT

    Abstract: pick
    Text: 2.54mm SMT Pin Header - slanted - E-tec the Swiss connection PCB SMT Layout “single row” PCB SMT Layout “dual row” SPECIFICATIONS Current rating Insulator resistance Contact resistance Dielectric withstanding Operating temperature Processing temperature


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    H135/02 12-position 2.54mm,SMT pick PDF

    CROSS AVX

    Abstract: No abstract text available
    Text: TECHNICAL INFORMATION SMT PROCESS CHARACTERISTICS OF AVX TRANSGUARDS by Ron Demko AVX Corporation Raleigh, NC Abstract: TransGuards are uniquely suited for wide-scale usage in SMT applications. TransGuards exhibit many advantages when used in SMT assemblies.


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    protecti480-539-1501 S-SMT00M301-R CROSS AVX PDF

    inspection criteria

    Abstract: 202F
    Text: TECHNICAL INFORMATION SMT PROCESS CHARACTERISTICS OF AVX TRANSGUARDS by Ron Demko AVX Corporation Raleigh, NC Abstract: TransGuards are uniquely suited for wide-scale usage in SMT applications. TransGuards exhibit many advantages when used in SMT assemblies.


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    S-SMT00M301-R inspection criteria 202F PDF

    smt machines

    Abstract: IPC-A610B pin header stand-off pin in paste pin header standoff pin in paste
    Text: SL-SMT Through-Hole-Reflow SL-SMT … reduces costs in the production process SL-SMT are the high temperature resistant pin headers specially developed to be compatible with reflow production processes. Existing pcb connector headers cannot withstand the high temperatures


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    Untitled

    Abstract: No abstract text available
    Text: Datasheet PCB Components PCB connectors for the Reflow Soldering Process SL-SMT 5.08 SL-SMT 5.08 is the high temperature resistant pin header for the 5.08 mm pitch range specially developed to be compatible with SMT Reflow soldering production processes. Standard PCB


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    LIT0105 PDF

    sn63pb37 solder SPHERES

    Abstract: J-STD-020 SAC305 JEDEC J-STD-020d.1 Altera Flip Chip BGA warpage reflow profile SAC305 bga ALTERA AN81 sn63pb37 solder wire sn63pb37 solder wire shelf life pcb warpage in ipc standard J-STD-020D
    Text: SMT Board Assembly Process Recommendations AN-353-4.0 Application Note This application note describes the board assembly process used in surface-mount technology SMT and focuses on the SMT component-to-board reflow soldering process and rework soldering if you are removing or replacing individual


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    AN-353-4 AN-353 AN-81. sn63pb37 solder SPHERES J-STD-020 SAC305 JEDEC J-STD-020d.1 Altera Flip Chip BGA warpage reflow profile SAC305 bga ALTERA AN81 sn63pb37 solder wire sn63pb37 solder wire shelf life pcb warpage in ipc standard J-STD-020D PDF

    microwave oven schematic

    Abstract: V03120
    Text: HMC268LM1 v03.1201 MICROWAVE CORPORATION SMT MMIC LOW NOISE AMPLIFIER, 20 - 32 GHz AMPLIFIERS - SMT 1 Typical Applications Features The HMC268LM1 LNA enables economical PCB SMT assembly for: SMT mmWave Package • Millimeterwave Point-to-Point Radios 15 dB Gain


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    HMC268LM1 HMC268LM1 2350C 2350C. microwave oven schematic V03120 PDF

    Untitled

    Abstract: No abstract text available
    Text: MICROWAVE CORPORATION HMC268LM1 v03.1201 SMT MMIC LOW NOISE AMPLIFIER, 20 - 32 GHz AMPLIFIERS - SMT 1 Typical Applications Features The HMC268LM1 LNA enables economical PCB SMT assembly for: SMT mmWave Package • Millimeterwave Point-to-Point Radios 15 dB Gain


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    HMC268LM1 HMC268LM1 2350C 2350C. PDF

    Untitled

    Abstract: No abstract text available
    Text: ODU-FLAKAFIX 8,9 1,78 This special use of the SMT technology for through hole connectors is a vital innovation. 2,29 The assembly of through hole connectors with SMT components in SMT process is possible due to the use of liquid crystal polymer LCP , which is


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    D-84453 PDF

    223214

    Abstract: No abstract text available
    Text: ERmet Thru Hole Reflow THR Female Connectors In the case of modern boards with SMT population, 2.0 mm H.M. ERmet thru hole reflow (THR) female connectors have been developed. The connectors have been designed for fully automatic SMT assembly. Safe positioning before the SMT soldering process is ensured by means of kinked terminations.


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    HSMG-T400

    Abstract: SIEMENS SMT-TOPLED T400 material data sheet HSMD-T400 HSMS-T400 HSMY-T400 IS28 T670 Radiation Assured Devices
    Text: Figure 17. SMT-TOPLEDTM cross section Designing with Surface Mount LEDs The evolution from through hole technology to SMT demands surface mount optoelectronic components. HP and Siemens have addressed this need by creating a SMT standard for LEDs. The advantages to the user of using SMT-TOPLEDTM are many:


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    HSMA-T400 HSMS-T400 HSMD-T400 HSMY-T400 HSMG-T400 HSMG-T400 SIEMENS SMT-TOPLED T400 material data sheet HSMD-T400 HSMS-T400 HSMY-T400 IS28 T670 Radiation Assured Devices PDF

    154873

    Abstract: 154673
    Text: ERmet Thru Hole Reflow THR Female Connectors In the case of modern boards with SMT population, 2.0 mm H.M. ERmet thru hole reflow (THR) female connectors have been developed. The connectors have been designed for fully automatic SMT assembly. Safe positioning before the SMT soldering process is ensured by means of kinked terminations.


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    square pin headers

    Abstract: square pin headers SMT 34 pin 2 row female pcb header 2.54mm square pin headers SMT pick and place design
    Text: 1.27mm Female Header - SMT - 1.27mm x 2.54mm Female Header - SMT - SPECIFICATIONS Current rating Insulator resistance Contact resistance Dielectric withstanding voltage Operating temperature Processing temperature Contact material Insulator material single row


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    Untitled

    Abstract: No abstract text available
    Text: SPECIFICATION Model No. : SGGP.25A Product Name : GPS/GLONASS SMT Patch Antenna Features 25mm*25mm*4mm Single Feed SMT Mount GPS: 1575MHz GLONASS: 1602MHz Patent pending : RoHS Photo  : SPE-13-8-031/D/SS Page 1 of 10 SGGP.25.4.A.02 1. Introduction This ceramic 25mm GPS/GLONASS patch antenna is mounted via SMT process and


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    1575MHz 1602MHz SPE-13-8-031/D/SS PDF

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    Abstract: No abstract text available
    Text: SPECIFICATION Model No. : SGGP.18A Product Name : GPS/GLONASS SMT Patch Antenna Features 18mm*18mm*4mm Single Feed SMT : GPS: 1575MHz GLONASS: 1602MHz Patent pending RoHS Photo = : SPE-13-8-030/C/SS Page 1 of 10 SGGP.18.4.A.02 1. Introduction This ceramic 18mm GPS/GLONASS patch antenna is mounted via SMT process and


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    1575MHz 1602MHz SPE-13-8-030/C/SS PDF

    Untitled

    Abstract: No abstract text available
    Text: SPECIFICATION Model No. : SGGP.25A Product Name : GPS/GLONASS SMT Patch Antenna Features 25mm*25mm*4.5mm Single Feed SMT Mount GPS: 1575MHz GLONASS: 1602MHz Patent pending : RoHS Photo  : SPE-13-8-031/G/SS Page 1 of 14 SGGP.25.4.A.02 1. Introduction This ceramic 25mm GPS/GLONASS patch antenna is mounted via SMT process and


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    1575MHz 1602MHz SPE-13-8-031/G/SS PF606-P26 over270Â PDF

    Untitled

    Abstract: No abstract text available
    Text: DATASHEET Rev. B RGW2 SERIES 2:1 Wide Input Voltage Range DIP and SMT Packages Single and Dual Outputs 2 Watt DC/DC Power Converters FEATURES • 2 Watts Maximum Output Power  Single and Dual Outputs  SMT & DIP Packages: 0.74 x 0.50 x 0.33 Inches  SMT Package Qualified for Lead Free Reflow Solder Process


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    J-STD-020D 1600VDC 3000VDC 100KHz, PDF

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    Abstract: No abstract text available
    Text: DATASHEET Rev. A RGW3 SERIES 2:1 Wide Input Voltage Range DIP and SMT Packages Single and Dual Outputs 3 Watt DC/DC Power Converters FEATURES • 3 Watts Maximum Output Power  Single and Dual Outputs  SMT & DIP Packages: 0.74 x 0.50 x 0.33 Inches  SMT Package Qualified for Lead Free Reflow Solder Process


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    J-STD-020D 1600VDC 3000VDC 100KHz, PDF

    Untitled

    Abstract: No abstract text available
    Text: SL-SMT Through-Hole-Reflow SL-SMT . reduces costs in the production process SL-SMT are the high temperature resistant pin headers specially developed to be compatible with SMT reflow soldering production processes. Standard PCB connectors cannot withstand the high


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    Untitled

    Abstract: No abstract text available
    Text: This Group o f SMP Connectors are Elevated by 2.1mm SMT mounting: Many mays can be used for SMT reflow. The most common is Vapor phase or infrared furnace. Connector body header is made of high temp plastic (PPS) and can withstand the temperatures required for the SMT process.


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    FCN-568P068-G/0871-4E FCN-568P068-G/0773-4E PDF

    Untitled

    Abstract: No abstract text available
    Text: Fujrrsu SMT mounting: Many mays can be used for SMT reflow. The most common is Vapor phase or infrared furnace. Connector body header is made of high temp plastic (PPS) and can withstand the temperatures required for the SMT process. Ejector mechanism is usually made of low temp plastic (polyester) and can NOT with


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    500grams. FCN-568P068-G/0663-4E FCN-568P068-G/0664-4E PDF

    Untitled

    Abstract: No abstract text available
    Text: PLCC S o ck ets iT A R C O N N f C O N N E C ^ G R S Features, SMT Type ▲ Low Profile Construction ▲ SMT Process Compatible ▲ Extraction Tool Slots ▲ Solder Tails Exposed for Inspection Features, PTH Type ▲ SMT Process Compatible ▲ Closed Bottom Eliminates Solder Wicking


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