Please enter a valid full or partial manufacturer part number with a minimum of 3 letters or numbers

    SMT PITCH ROADMAP Search Results

    SMT PITCH ROADMAP Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    A9784- Coilcraft Inc Transformer, planar, SMT, RoHS Visit Coilcraft Inc
    B0310- Coilcraft Inc Transformer, planar, SMT, RoHS Visit Coilcraft Inc
    CST1-06 Coilcraft Inc Current sensor, SMT, RoHS Visit Coilcraft Inc
    CST2010-03 Coilcraft Inc Current sensor, SMT, RoHS Visit Coilcraft Inc
    CST2010-08 Coilcraft Inc Current sensor, SMT, RoHS Visit Coilcraft Inc

    SMT PITCH ROADMAP Datasheets Context Search

    Catalog Datasheet Type Document Tags PDF

    JAE MX34

    Abstract: SMT pitch roadmap CONNECTOR jae 50 SMT roadmap JAE ffc JAE CONNECTORS FPC 0.6mm pitch MX23A MX34 TX20A
    Text: JAE Product guide 15/11/05 1:43 pm Page 3 CONNECTOR PRODUCT GUIDE JAE Product guide 15/11/05 1:43 pm Page 4 Board to Board SERIES AA01A No of contacts 10,30,40,60 Pitch 0.5mm Current Rating 0.2 amp PCB Mounting Method SMT Operating Temp -40 +85 degrees Reeled


    Original     		AA01A KX14/KX15 TX24/TX25 LOGO05/2 JAE MX34 SMT pitch roadmap CONNECTOR jae 50 SMT roadmap JAE ffc JAE CONNECTORS FPC 0.6mm pitch MX23A MX34 TX20A PDF

    MezzSelect

    Abstract: FCI Connector interface hybrid 84502 meg array FCI Connector top mount 0 stand off single row header 2.0mm pitch 10mm height bergstik 2,54 SMT roadmap gig-array connector footprint SMT pitch roadmap GR-1217-CORE
    Text: Targeted Technology Service Speed and Integrity MezzSelect presentation – Dec 2009 – FCI ELX 1 Choose precisely what you Need What is a mezzanine connector? A mezzanine connector… …provides an electrical and mechanical connection between two printed circuits.


    Original     		PDF

    Sn62Pb36Ag2

    Abstract: Boards for assembly with 100OHM impedance erni 32 pins connector 68 pin high density flat connector Z-PACK DIN 1.5mm header connector SMT roadmap
    Text: DesignCon 2005 ERNI MicroSpeed, the Revolution in Mezzanine Connection Andreas Scheck, President & CEO, ERNI Electronics, Inc. Abstract For many reasons, today’s electronic systems are being built in three rather than two dimensions. As such, inter-board connectors – “mezzanine connectors” – play an


    Original     		PDF

    74729 latch

    Abstract: dms 59 to vga SFF8470 pinout DMS59 to vga PS-91525-001 DMS-59 to 15pin QSFP passive connector xaui mini HDMI plug 74752-2301 Micro-D connectors
    Text: I/O Products High Speed Pluggable I/O Solutions Small Form-Factor Pluggable SFP to N-3 Cable to N-8


    Original     		PDF

    TAIYO PSR 4000

    Abstract: manual PACE PSR 800 HC-100-X2 Ablebond 8360 TAIYO PSR 4000 soldermask JEDEC Kostat FBGA PSR4000-AUS5 TAIYO PSR 2000 csp192 FBGA THICK TRAY
    Text: National Semiconductor Application Note 1125 Shaw W. Lee and Wayne Lee June 2000 Introduction CHIP SCALE PACKAGES Laminate substrate based CSPs are an extension of National Semiconductor’s current Plastic Ball Grid Array PBGA technology and are the package of choice for portable applications. CSPs are available in two package designs: Laminate CSP and Fine Pitch Ball Grid Array (FBGA).


    Original     		PDF

    TAIYO PSR 4000

    Abstract: manual PACE PSR 800 CCL-HL-832 fbga Substrate design guidelines JEDEC Kostat FBGA CCL-HL832 ablebond esec 3018 operation kostat bga 6mm x 6mm nitto hc100
    Text: National Semiconductor Application Note 1125 Shaw W. Lee and Wayne Lee June 2000 Introduction CHIP SCALE PACKAGES Laminate substrate based CSPs are an extension of National Semiconductor’s current Plastic Ball Grid Array PBGA technology and are the package of choice for portable applications. CSPs are available in two package designs: Laminate CSP and Fine Pitch Ball Grid Array (FBGA).


    Original     		PDF

    slim power sata pinout

    Abstract: Mini USB 8-pin B-Type CON HDR 2663 HQCD-030-06 JST MSA QSH-060-01-L-D-A serdes hdmi optical fibre SO-0165-04-01-02 XFP extender BOARD HCM 582 circuit
    Text: CABLE SYSTEMS CSF-210 AUGUST 2010 END-TO-END CABLE SYSTEM SOLUTIONS Product Solutions Whether you need quick-turn, off-the-shelf cable solutions or custom cable solutions, Samtec offers a full line of components and systems that will address your specific needs.


    Original     		CSF-210 slim power sata pinout Mini USB 8-pin B-Type CON HDR 2663 HQCD-030-06 JST MSA QSH-060-01-L-D-A serdes hdmi optical fibre SO-0165-04-01-02 XFP extender BOARD HCM 582 circuit PDF

    Fuse m1 250C

    Abstract: SIEMENS b43471 B43991 SIEMENS b43405 B43876 B43875 m1 250c fuse B41684 epcos B43991 B43405
    Text: Microwave Ceramics and Modules RF LTCC Filter for ISM 2.4 GHz Filter B69893K2457C101 Preliminary datasheet Features • Low Profile maximum height 0.9 mm Change History Revision Detail of change P1 First release Date 09.06.06 Author Stadler Contents Page 2


    Original     		B69893K2457C101 2002/95/EC 2005/747/EC Fuse m1 250C SIEMENS b43471 B43991 SIEMENS b43405 B43876 B43875 m1 250c fuse B41684 epcos B43991 B43405 PDF

    220v AC voltage stabilizer schematic diagram

    Abstract: rjh 3047 equivalent WECO 1502 connection drawing transistor equivalent rjh 3047 str 1265 smps power supply circuit of tv transistor a950 MTK 6252 weco 602 connection drawing 8140 SOURIAU weco 1502 cap drawing
    Text: INTERCONNECTS Interconnects AC Power Connectors Power Cords, Power Entry Modules, Power Filters, Power Outlets and Inlets Bulgin. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1105 Qualtek . . . . . . . . . . . . . . . . . . . . . . . . . . . 1106, 1107


    Original     		PDF

    B43875

    Abstract: B43991 epcos B43991 EPCOS Sikorel B41684 B43876 B43405 B41684 SIEMENS b43405 B43471 Epcos B41684
    Text: SAW Components SAW filter TD-SCDMA Series/type: Ordering code: B7853 B39202B7853C710 Date: Version: September 28, 2006 2.2  EPCOS AG 2006. Reproduction, publication and dissemination of this data sheet, enclosures hereto and the information contained therein without EPCOS’ prior express consent is prohibited.


    Original     		B7853 B39202B7853C710 LK39B. C61157-A8-A3 LK39A. B43875 B43991 epcos B43991 EPCOS Sikorel B41684 B43876 B43405 B41684 SIEMENS b43405 B43471 Epcos B41684 PDF

    B43875

    Abstract: SIEMENS b43405 B43406 B41684 epcos B43991 B43991 B43876 Epcos sikorel b41684 DDS2004 B43405
    Text: SAW Components SAW filter MediaFLO Series/type: Ordering code: LR24A Date: Version: June 19, 2006 1.0  EPCOS AG 2006. Reproduction, publication and dissemination of this data sheet, enclosures hereto and the information contained therein without EPCOS’ prior express consent is prohibited.


    Original     		LR24A 2002/95/EC 2005/747/EC B43875 SIEMENS b43405 B43406 B41684 epcos B43991 B43991 B43876 Epcos sikorel b41684 DDS2004 B43405 PDF

    B43875

    Abstract: B43876 SIEMENS b43471 SIEMENS b43405 epcos B43991 B41684 Epcos sikorel b41684 E70 ferrite core DDS2004 E16* transformer
    Text: SAW Components SAW Rx filter WCDMA band I Series/type: Ordering code: LK39B Date: Version: Sep. 26, 2006 1.1  EPCOS AG 2006. Reproduction, publication and dissemination of this data sheet, enclosures hereto and the information contained therein without EPCOS’ prior express consent is prohibited.


    Original     		LK39B LK39B. C61157-A8-A3 B39202B7853C710 LK39A. B43875 B43876 SIEMENS b43471 SIEMENS b43405 epcos B43991 B41684 Epcos sikorel b41684 E70 ferrite core DDS2004 E16* transformer PDF

    INTEL application notes

    Abstract: land pattern BGA 0.75 PCB design for very fine pitch csp package land pattern for TSOP 2 1mm pitch BGA socket land pattern for TSOP BGA reflow guide pcb thermal Design guide trace theta layout micro pitch BGA socket s1 SOLDER PROFILE
    Text: 5.0 5.1 5.2.1 MANUFACTURING CONSIDERATIONS SMT Process Many factors contribute to a high yielding assembly process. A few of the key focus areas and their contributing factors are highlighted in Table 7. 5.2 PCB Design Guidelines One of the key efforts in implementing the


    Original     		PDF

    General Micro-electronics

    Abstract: SMT pitch roadmap ansys darveaux ansys CP-01019-1 Electronic Arrays FR4 thermal expansion constant vs temperature neural network BGA cte amkor flip
    Text: Building Reliability Into Full-Array BGAs Yuan Li, Ph.D., Anil Pannikkat, Ph.D., Larry Anderson, Tarun Verma, Bruce Euzent Altera Corporation 101 Innovation Drive, San Jose, CA 95134 Electronic Arrays, NEC, IMP and Altera Corp. He joined Altera in 1992 and is currently Director


    Original     		PDF

    SMD TQFP microcontroller NEC

    Abstract: CMOS-9HD CB10VX CMOS-N5 ARM1136J PBGA 376 vhdl code pdf cisc processor CMOS-10HD ARM11 mpcore MCM NAND
    Text: ASIC T echn o l o gy H an dbo o k 2009 1 ARM, ARM7TDMI-S, ARM926EJ-S, ARM946E-S, ARM966E-S, ARM11 and ARM Cortex are trademarks of ARM Ltd. All other product, brand, or trade names used in this pamphlet are the trademarks or registered trademarks of their respective owners.


    Original     		ARM926EJ-S, ARM946E-S, ARM966E-S, ARM11 A17023EE9V0PF00 SMD TQFP microcontroller NEC CMOS-9HD CB10VX CMOS-N5 ARM1136J PBGA 376 vhdl code pdf cisc processor CMOS-10HD ARM11 mpcore MCM NAND PDF

    RTL28

    Abstract: arm cortex a9 mpcore CMOS-9HD CB90L VHDL code for ADC and DAC SPI with FPGA 24KEc cortex a9 qfp ARM1136J Ethernet-MAC ic renesas ARM926EJ-STM
    Text: ASIC Technology Handbook www.renesas.eu ARM, ARM7TDMI-S, ARM926EJ-S, ARM946E-S, ARM966E-S, ARM11 and ARM Cortex are trademarks of ARM Ltd. 4KEc, 24KEm, 24KEc, 24KEf and 74Kf are trademarks of MIPS Technolgies. All other product, brand, or trade names used in this


    Original     		ARM926EJ-S, ARM946E-S, ARM966E-S, ARM11 24KEm, 24KEc, 24KEf R05CS0001ED0101 RTL28 arm cortex a9 mpcore CMOS-9HD CB90L VHDL code for ADC and DAC SPI with FPGA 24KEc cortex a9 qfp ARM1136J Ethernet-MAC ic renesas ARM926EJ-STM PDF

    10Gbase-kr backplane connector

    Abstract: 10GBASE-KR GR-1217-CORE 76020-ABCD sata male amphenol metal housing 2 row 120 pin
    Text: Backplane Products Visit www.molex.com to access more part numbers and product information, download sales drawings, product specifications, 3D models, place sample requests, and more. Backplane Roadmap. H-2


    Original     		PDF

    SMT pitch roadmap

    Abstract: bare die
    Text: N DEDICATED W elcome to National Semiconductor’s DIEmentions. Within these pages is information on how National is supporting the growing need for bare die, Known Good Die KGD , flexible processing flows, and assorted shipping carriers. In DIEmentions will be the latest information on die and packaging availability. There will be


    Original     		PDF

    CBG064-052A

    Abstract: csp process flow diagram CBG064 reballing 28F160C18 BGA Solder Ball 0.35mm collapse intel 845 MOTHERBOARD pcb CIRCUIT diagram micron tsop 48 PIN tray 28F3202C3 intel MOTHERBOARD pcb design in
    Text: D Intel Flash Memory Chip Scale Package User’s Guide The Complete Reference Guide 1999 D Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document. Except as provided in Intel’s Terms and Conditions of Sale for such products, Intel assumes no liability


    Original     		PDF

    tape 3m 9448

    Abstract: transistor 1548b MIL-T-55155 1547B transistor 3m 9448 ED203 str 6654 str g 8656 transistor 1547B str 8656
    Text: D E S I G N E R S A N D M A N U FAC T U R E R S RoHS COMPLIANT ~ ISO 9001 CERTIFIED M55 C2-FM3 m 10/23/06 10:19 AM Page C2 Auto & Subminiature Fuse Holders pages 34-37 2 in 1 Fuse Holder page 35 Miniature USB Plugs & Sockets page 88 Thumbscrews & Knobs page 76-84


    Original     		PDF

    toshiba laptop battery pack pinout

    Abstract: GTX3000P IBM POWER3 processor driclad toshiba laptop schematic diagram MCP Technology Trend P2SC stacked transistors SOI RF IBM Microelectronics ASIC ibm ASIC SRAM
    Text: 4 volume 4 A publication of IBM Microelectronics IBM Helps Juniper Networks Produce Revolutionary Internet Backbone Router Nancy Adinolfe, R. K. Anand, and Alison Seaman In This Issue Introduction Fourth Quarter 1998, Vol. 4, No.4 1 IBM Helps Juniper Networks Produce


    Original     		64-bit S/390TM 256-Mb 60-micron 10-mil toshiba laptop battery pack pinout GTX3000P IBM POWER3 processor driclad toshiba laptop schematic diagram MCP Technology Trend P2SC stacked transistors SOI RF IBM Microelectronics ASIC ibm ASIC SRAM PDF

    WMP100

    Abstract: sim 300 processor gsm modem datasheet sim 300 processor datasheet for gsm modem wavecom WMP100 sim 300 processor gsm modem wavecom wmp50 sim 300 processor gsm modem for project wavecom WMP150 WMP150 sim 300 processor for gsm modem
    Text: Smart wireless. Smart business. Wireless Microprocessor WMP 50/100/500 Smart Devices Creative Software Services Wireless Microprocessor® The Wireless Microprocessor® is a certified processing and radio solution in a BGA package designed for GSM/GPRS cellular communication in the M2M


    Original     		WMP50 WMP100 sim 300 processor gsm modem datasheet sim 300 processor datasheet for gsm modem wavecom WMP100 sim 300 processor gsm modem wavecom wmp50 sim 300 processor gsm modem for project wavecom WMP150 WMP150 sim 300 processor for gsm modem PDF

    10000 watt stabilizer transformer winding formula

    Abstract: BUSS SR-5 T3.15A 250V mini project using microcontroller toy car OC-106 94V0 C Buss SR-5 T2A 250v T2A 250v BUSS SS-5 PCF 7953 T2A 250v SS-5 OC106 T2A 250v BUSS
    Text: Circuit Protection and Power Management Solutions Full Line Electronics Catalog 2007 Electronic Components INTRODUCTION From overcurrent and overvoltage protection to supercapacitors and magnetics, Cooper Bussmann provides integrated solutions that meet the evolving needs of technology-driven markets. Cooper


    Original     		CB-5010 10000 watt stabilizer transformer winding formula BUSS SR-5 T3.15A 250V mini project using microcontroller toy car OC-106 94V0 C Buss SR-5 T2A 250v T2A 250v BUSS SS-5 PCF 7953 T2A 250v SS-5 OC106 T2A 250v BUSS PDF

    tyco p11b

    Abstract: alcatel 2440 p31b j1 smd p31a TYCO P11A 14 nokia 1280 Littelfuse P26B smd 2640 alcatel marconi 2030 operating manual
    Text: Media Contact: Dan Stanek Director of Marketing & Corporate Marcom Littelfuse, Inc. Tel: 847-391-0714 dstanek@littelfuse.com To download a high-resolution version of this image click here:


    Original     		Photos/26031 tyco p11b alcatel 2440 p31b j1 smd p31a TYCO P11A 14 nokia 1280 Littelfuse P26B smd 2640 alcatel marconi 2030 operating manual PDF