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    SIM READER AMPHENOL Search Results

    SIM READER AMPHENOL Result Highlights (6)

    Part ECAD Model Manufacturer Description Download Buy
    SF-SFPP2EPASS-005 Amphenol Cables on Demand Amphenol SF-SFPP2EPASS-005 5m SFP+ Cable - Amphenol 10GbE SFP+ Direct Attach Copper Cable (16.4 ft) Datasheet
    SF-SFPP2EPASS-001 Amphenol Cables on Demand Amphenol SF-SFPP2EPASS-001 1m SFP+ Cable - Amphenol 10GbE SFP+ Direct Attach Copper Cable (3.3 ft) Datasheet
    AV-DPMDPM0000-001 Amphenol Cables on Demand Amphenol AV-DPMDPM0000-001 1m DisplayPort Cable - Amphenol DisplayPort 1.1 Certified Cable (3.3ft) 1m (3.3') Datasheet
    SF-SFPP2EPASS-007 Amphenol Cables on Demand Amphenol SF-SFPP2EPASS-007 7m SFP+ Cable - Amphenol 10GbE SFP+ Direct Attach Copper Cable (23 ft) Datasheet
    SF-SFPP2EPASS-002 Amphenol Cables on Demand Amphenol SF-SFPP2EPASS-002 2m SFP+ Cable - Amphenol 10GbE SFP+ Direct Attach Copper Cable (6.6 ft) Datasheet
    SF-SFPP2EPASS-003 Amphenol Cables on Demand Amphenol SF-SFPP2EPASS-003 3m SFP+ Cable - Amphenol 10GbE SFP+ Direct Attach Copper Cable (9.8 ft) Datasheet

    SIM READER AMPHENOL Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    CAD-0605-212

    Abstract: No abstract text available
    Text: Amphenol SIM Reader 1. Material: Contact: Beryllium copper Insulator: 30% lass-filled thermoplastic LCP or equivalent UL94V-0, black 2. Finish: 15 micro-inch 0.38 micron min gold plating at matign area, 100-200 micro-inch(2.54-5.08 micron) pure tin at solder tail and 50-100 microinch(1.27-2.54 micron) nickel under plated


    Original     		PDF UL94V-0, 30Vac CAD-0605-212

    SIM READER amphenol

    Abstract: No abstract text available
    Text: Amphenol SIM Reader 1. Material: Contact: Beryllium copper Insulator: 30% lass-filled thermoplastic LCP or equivalent UL94V-0, black 2. Finish: 15 micro-inch 0.38 micron min gold plating at matign area, 100-200 micro-inch(2.54-5.08 micron) pure tin at solder tail and 50-100 microinch(1.27-2.54 micron) nickel under plated


    Original     		PDF UL94V-0, 30Vac CAD-0605-152 SIM READER amphenol

    Untitled

    Abstract: No abstract text available
    Text: Amphenol SIM Reader 1. Material: Contact: Beryllium copper Insulator: 30% lass-filled thermoplastic LCP or equivalent UL94V-0, black 2. Finish: 15 micro-inch 0.38 micron min gold plating at matign area, 100-200 micro-inch(2.54-5.08 micron) pure tin at solder tail and 50-100 microinch(1.27-2.54 micron) nickel under plated


    Original     		PDF UL94V-0, 30Vac CAD-0605-142

    CAD-0605-202

    Abstract: No abstract text available
    Text: Amphenol SIM Reader 1. Material: Contact: Beryllium copper Insulator: 30% lass-filled thermoplastic LCP or equivalent UL94V-0, black 2. Finish: 15 micro-inch 0.38 micron min gold plating at matign area, 100-200 micro-inch(2.54-5.08 micron) pure tin at solder tail and 50-100 microinch(1.27-2.54 micron) nickel under plated


    Original     		PDF UL94V-0, 30Vac CAD-0605-202

    Untitled

    Abstract: No abstract text available
    Text: Amphenol SIM Reader 1. Material: Contact: Beryllium copper Insulator: 30% lass-filled thermoplastic LCP or equivalent UL94V-0, black 2. Finish: 15 micro-inch 0.38 micron min gold plating at matign area, 100-200 micro-inch(2.54-5.08 micron) pure tin at solder tail and 50-100 microinch(1.27-2.54 micron) nickel under plated


    Original     		PDF UL94V-0, 30Vac CAD-0605-112

    Untitled

    Abstract: No abstract text available
    Text: Amphenol SIM Reader 1. Material: Contact: Beryllium copper Insulator: 30% lass-filled thermoplastic LCP or equivalent UL94V-0, black 2. Finish: 15 micro-inch 0.38 micron min gold plating at matign area, 100-200 micro-inch(2.54-5.08 micron) pure tin at solder tail and 50-100 microinch(1.27-2.54 micron) nickel under plated


    Original     		PDF UL94V-0, 30Vac CAD-0605-182

    Untitled

    Abstract: No abstract text available
    Text: Amphenol SIM Reader 1. Material: Contact: Beryllium copper Insulator: 30% lass-filled thermoplastic LCP or equivalent UL94V-0, black 2. Finish: 15 micro-inch 0.38 micron min gold plating at matign area, 100-200 micro-inch(2.54-5.08 micron) pure tin at solder tail and 50-100 microinch(1.27-2.54 micron) nickel under plated


    Original     		PDF UL94V-0, 30Vac CAD-0605-222

    Untitled

    Abstract: No abstract text available
    Text: Amphenol SIM Reader 1. Material: Contact: Beryllium copper Insulator: 30% lass-filled thermoplastic LCP or equivalent UL94V-0, black 2. Finish: 15 micro-inch 0.38 micron min gold plating at matign area, 100-200 micro-inch(2.54-5.08 micron) pure tin at solder tail and 50-100 microinch(1.27-2.54 micron) nickel under plated


    Original     		PDF UL94V-0, 30Vac CAD-0605-132

    Untitled

    Abstract: No abstract text available
    Text: Amphenol SIM Reader 1. Material: Contact: Beryllium copper Insulator: 30% lass-filled thermoplastic LCP or equivalent UL94V-0, black 2. Finish: 15 micro-inch 0.38 micron min gold plating at matign area, 100-200 micro-inch(2.54-5.08 micron) pure tin at solder tail and 50-100 microinch(1.27-2.54 micron) nickel under plated


    Original     		PDF UL94V-0, 30Vac CAD-0605-172

    SIM READER amphenol

    Abstract: No abstract text available
    Text: Amphenol SIM Reader 1. Material: Contact: Beryllium copper Insulator: 30% lass-filled thermoplastic LCP or equivalent UL94V-0, black 2. Finish: 15 micro-inch 0.38 micron min gold plating at matign area, 100-200 micro-inch(2.54-5.08 micron) pure tin at solder tail and 50-100 microinch(1.27-2.54 micron) nickel under plated


    Original     		PDF UL94V-0, 30Vac CAD-0605-162 SIM READER amphenol

    Untitled

    Abstract: No abstract text available
    Text: Amphenol SIM Reader 1. Material: Contact: Beryllium copper Insulator: 30% lass-filled thermoplastic LCP or equivalent UL94V-0, black 2. Finish: 15 micro-inch 0.38 micron min gold plating at matign area, 100-200 micro-inch(2.54-5.08 micron) pure tin at solder tail and 50-100 microinch(1.27-2.54 micron) nickel under plated


    Original     		PDF UL94V-0, 30Vac CAD-0605-192

    CAD-0605-122

    Abstract: CAD0605122
    Text: Amphenol SIM Reader 1. Material: Contact: Beryllium copper Insulator: 30% lass-filled thermoplastic LCP or equivalent UL94V-0, black 2. Finish: 15 micro-inch 0.38 micron min gold plating at matign area, 100-200 micro-inch(2.54-5.08 micron) pure tin at solder tail and 50-100 microinch(1.27-2.54 micron) nickel under plated


    Original     		PDF UL94V-0, 30Vac CAD-0605-122 CAD0605122

    c707 10M006 512

    Abstract: SIM READER amphenol C707 10m006 C707 10M006 049 2 Sim card diagram C707-10M006 0 CAD-0605-122 10M006 sim c707 C70710M006512
    Text: Amphenol Card Readers SIMLOCK SIM/SAM Card Readers Environmental - -40ºC thru 85ºC - IEC 60512-4, Test 6d - IEC 60512-4, Test 6c Features • Same footprint as SIM card • Polarized • Suitable for automated assembly • Custom geometries and layouts possible


    Original     		PDF 500VAC 10M006 CAD-06W1-292 c707 10M006 512 SIM READER amphenol C707 10m006 C707 10M006 049 2 Sim card diagram C707-10M006 0 CAD-0605-122 sim c707 C70710M006512

    SIM READER amphenol

    Abstract: sim connector reader
    Text: Amphenol SIM CARD Connector 1. Material: Contact: Alloy copper Switch:Alloy copper Shell:Stainless steel Insulator: High temperature. Thermoplastic, UL94V-0, Black. 2. Finish : Contact:0.38 micron gold plated at mating area. 3 micron Tin plated on solder tails.


    Original     		PDF UL94V-0, CAD-06-PA-001-X SIM READER amphenol sim connector reader

    montage METAL DETECTOR

    Abstract: micro SD Card connector C707 C707-10M006 C707A C702 10M008 272 4 sim c707 "DIN 965" C702 10M008 230 SD card socket, footprint to PCB
    Text: Amphenol Amphenol-Tuchel Electronics GmbH www.amphenol-tuchel.com Smart Card Connectors Series C 700 Security information It is the user’s responsibility to check whether the components illustrated in this catalogue comply with different regulations from those stated in special fields of application


    Original     		PDF 72/73/EWG) Civi86 montage METAL DETECTOR micro SD Card connector C707 C707-10M006 C707A C702 10M008 272 4 sim c707 "DIN 965" C702 10M008 230 SD card socket, footprint to PCB

    SIM READER amphenol

    Abstract: XT65 siemens MC1213 push sim card holder MC1213559-2 MC1213911 XT75 siemens molex U.FL-R-SMT XT75 SIM EDGE
    Text: www.xt75.com www.xt65.com SIEMENS XT75 / XT65 SIEMENS XT75/XT65 XT75: GSM/GPRS module with GPS receiver, JAVA and EDGE for the satellite navigation XT65: GSM/GPRS module with GPS receiver and JAVA for the satellite navigation Technische Daten: ‰ ‰ ‰ ‰


    Original     		PDF XT75/XT65 GSM850/900/1800/1900 FL-V04F-male MC1213 SIM READER amphenol XT65 siemens push sim card holder MC1213559-2 MC1213911 XT75 siemens molex U.FL-R-SMT XT75 SIM EDGE

    siemens modem gsm m20 Terminal

    Abstract: S30880-S8000-A100-1 siemens M20 S30880 sms based led scrolling display SMS controlled LED based scrolling message display RS323 class simcard reader circuit diagram star delta timer siemens M20-T
    Text: Cellular Engine Siemens M20 / M20 Terminal Technical Description Data Voice SMS FAX V.24 How to use this book Table of contents Index  Siemens Information and Communication Products How to use this book The following navigation tools are available in addition to the Acrobat Reader toolbar or short-cut menu right


    Original     		PDF

    Untitled

    Abstract: No abstract text available
    Text: Smart Card Connector General Information Chip Cards Chip Cards, Smart Cards, IC Cards or whatever application specific term is used . have some commonality: • the outside dimensions, standardized acc. to ISO 7810, the size of a common credit card • and the position of the contact pads, which connect the embedded IC chip are fixed according to ISO 7816.


    Original     		PDF ID-000,

    C707 10m006

    Abstract: 358 ez 902 sim c707 C707 10M006 049 2 C707 C707D pci ped 358 ez 802 C707 10M006 537 2 C707 10M006 001 0
    Text: Amphenol Amphenol-Tuchel Electronics GmbH Smart Card Connectors Series C700 www.smart-card-connector.info Our project competence for your innovative solutions Amphenol's development strategy is to partner with customers early in their development process. We bring a high level expertise


    Original     		PDF Engineerin00 D-74080 C707 10m006 358 ez 902 sim c707 C707 10M006 049 2 C707 C707D pci ped 358 ez 802 C707 10M006 537 2 C707 10M006 001 0

    C702 10M008 925 4

    Abstract: C707 10m006 358 ez 902 C702 10M008 230 40 C707 10M006 001 0 amphenol simlock C707 10M006 537 2 Smart Card Connector C707A Amphenol-Tuchel snap on tools for electronic
    Text: Amphenol Amphenol-Tuchel Electronics GmbH Smart Card Connectors Series C700 www.smart-card-connector.info Our project competence for your innovative solutions Amphenol's development strategy is to partner with customers early in their development process. We bring a high level expertise


    Original     		PDF D-74080 C702 10M008 925 4 C707 10m006 358 ez 902 C702 10M008 230 40 C707 10M006 001 0 amphenol simlock C707 10M006 537 2 Smart Card Connector C707A Amphenol-Tuchel snap on tools for electronic

    SIM READER amphenol

    Abstract: SD card socket, footprint to PCB C700 C702 10M008 272 4 smart card based door access system Smart Card Connector C707A IEC C8 connector smart card Amphenol C707-10M006-049 IEC C8 pcb mount connector C707A
    Text: Amphenol Amphenol-Tuchel Electronics GmbH www.amphenol-tuchel.com Smart Card Connectors Series C 700 Security information It is the user’s responsibility to check whether the components illustrated in this catalogue comply with different regulations from those stated in special fields of application


    Original     		PDF 72/73/EWG) Civi86 SIM READER amphenol SD card socket, footprint to PCB C700 C702 10M008 272 4 smart card based door access system Smart Card Connector C707A IEC C8 connector smart card Amphenol C707-10M006-049 IEC C8 pcb mount connector C707A

    SIM READER amphenol

    Abstract: No abstract text available
    Text: TNo document k l h t iproperty of Amphenol Corporation and Is ddhared on that it la not to to dtodoMd, reproduced or uood, In whole or in part, tor manutoatura or oat* by anyone other then Amphenol CmuuuUun «tthaut Ito prior concert, ft that no right la granted to dbdooe


    OCR Scan     		PDF HK4434 \MMMNQ\SW\CCAD06PAOO1X-OJIWa SIM READER amphenol

    Untitled

    Abstract: No abstract text available
    Text: TM« ôocumant to Uw e preeorty o f Amphenol Corporation and to ddlw rod on S o l ft to not to tw dtodoood, rapraducad o r u n d, tn «boto or In part, fe r manufactura or «ala by anyone othar than Amptanol Corporation «tthaut Ito prior concort, f t th a t no righ t la granted to dtodoao


    OCR Scan     		PDF

    hk130

    Abstract: No abstract text available
    Text: TN» dooumtnt l i tho proport* of Amehonol Corporation and t i M M u d e th# wpraoo eondMan that R it not to b« dhdoN d, raareducod or uaad. « M o or in port, for monufoctur* or M i* by « g e n * ottwr than Amp Comorotion wtthout Ito prior concort, A that no right to granted to d


    OCR Scan     		PDF HK4434 hk130